Working metal substrate or core

Industry

CPC
H05K2203/0323

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/0323Working metal substrate or core

Industries

Patents Grantslast 30 patents

Information Patent Grant
Manufacturing method for double-sided wiring circuit board and doub...
- Patent number 12,114,438
- Issue date Oct 8, 2024
- Nitto Denko Corporation
- Shusaku Shibata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing printed circuit board
- Patent number 12,101,890
- Issue date Sep 24, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Myung Ju Gi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring circuit board
- Patent number 12,035,484
- Issue date Jul 9, 2024
- Nitto Denko Corporation
- Kenya Takimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Catalyzed metal foil and uses thereof
- Patent number 11,877,404
- Issue date Jan 16, 2024
- AVERATEK CORPORATION
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and manufacturing method therefor
- Patent number 10,681,820
- Issue date Jun 9, 2020
- Taiyo Yuden Co., Ltd.
- Tatsuro Sawatari
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a high-current printed circuit board
- Patent number 10,561,026
- Issue date Feb 11, 2020
- Avary Holding (Shenzhen) Co., Limited.
- Rih-Sin Jian
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method for manufacturing the same
- Patent number 10,492,309
- Issue date Nov 26, 2019
- Avary Holding (Shenzhen) Co., Limited.
- Rih-Sin Jian
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of producing suspension board with circuit
- Patent number 10,225,930
- Issue date Mar 5, 2019
- Nitto Denko Corporation
- Daisuke Yamauchi
- G11 - INFORMATION STORAGE
Information Patent Grant
Wiring substrate and electronic component device
- Patent number 10,187,979
- Issue date Jan 22, 2019
- Shinko Electric Industries Co., Ltd.
- Ryo Fukasawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Porous alumina templates for electronic packages
- Patent number 10,159,148
- Issue date Dec 18, 2018
- Invensas Corporation
- Rajesh Katkar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring thin plate having aerial wiring portion and method of manufa...
- Patent number 9,795,029
- Issue date Oct 17, 2017
- NHK Spring Co., Ltd.
- Yukie Yamada
- G11 - INFORMATION STORAGE
Information Patent Grant
Porous alumina templates for electronic packages
- Patent number 9,615,451
- Issue date Apr 4, 2017
- Invensas Corporation
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Suspension board with circuit
- Patent number 9,565,751
- Issue date Feb 7, 2017
- Nitto Denko Corporation
- Yuu Sugimoto
- G11 - INFORMATION STORAGE
Information Patent Grant
Printed circuit board and method for manufacturing the same
- Patent number 9,497,853
- Issue date Nov 15, 2016
- LG Innotek Co., Ltd
- Sang Myung Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor light emitting module comprising an exposed plate sur...
- Patent number 9,484,515
- Issue date Nov 1, 2016
- S.E.I Inc.
- Satoshi Komatsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Suspension board assembly sheet with circuits and method for manufa...
- Patent number 9,451,704
- Issue date Sep 20, 2016
- Nitto Denko Corporation
- Terukazu Ihara
- G11 - INFORMATION STORAGE
Information Patent Grant
Device mounting board and semiconductor power module
- Patent number 9,439,285
- Issue date Sep 6, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Keishi Kato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat radiating substrate and method of manufacturing the same
- Patent number 9,258,879
- Issue date Feb 9, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Young Ki Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating heat dissipation substrate
- Patent number 9,247,631
- Issue date Jan 26, 2016
- Unimicron Technology Corp.
- Chen-Chuan Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Magnetically controllable fluidic etching process
- Patent number 9,232,661
- Issue date Jan 5, 2016
- International Business Machines Corporation
- Matthew S. Doyle
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Magnetically controllable fluidic etching process
- Patent number 9,226,405
- Issue date Dec 29, 2015
- International Business Machines Corporation
- Matthew S. Doyle
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Printed circuit board and method of manufacturing same
- Patent number 9,173,301
- Issue date Oct 27, 2015
- Nitto Denko Corporation
- Hayato Takakura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making a heat radiating structure for high-power LED
- Patent number 9,153,760
- Issue date Oct 6, 2015
- Dongguan Kingsun Optoelectronic Co., Ltd
- Xiaofeng Bi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor light emitting device comprising cut-and-bent portions
- Patent number 9,022,613
- Issue date May 5, 2015
- Shimane Prefectural Government
- Satoshi Komatsubara
- F21 - LIGHTING
Information Patent Grant
Method of manufacturing a chip support board structure
- Patent number 8,887,386
- Issue date Nov 18, 2014
- Kinsus Interconnect Technology Corp.
- Ting-Hao Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing printed circuit board having vias and fine...
- Patent number 8,828,247
- Issue date Sep 9, 2014
- MDS Co., Ltd.
- Soon Chul Kwon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 8,772,646
- Issue date Jul 8, 2014
- Ibiden Co., Ltd.
- Kazuyuki Ueda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Suspension board with circuit having an opening extending therethro...
- Patent number 8,767,352
- Issue date Jul 1, 2014
- Nitto Denko Corporation
- Tetsuya Ohsawa
- G11 - INFORMATION STORAGE
Information Patent Grant
Chip support board structure
- Patent number 8,766,102
- Issue date Jul 1, 2014
- Kinsus Interconnect Technology Corp.
- Ting-Hao Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wired circuit board and producing method thereof
- Patent number 8,692,126
- Issue date Apr 8, 2014
- Nitto Denko Corporation
- Jun Ishii
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS AND METHOD FOR MANUFACTURING POWER MODULE
- Publication number 20240306304
- Publication date Sep 12, 2024
- HYUNDAI MOBIS CO., LTD.
- Chan Yang CHOE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240284604
- Publication date Aug 22, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Myungju Gi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, MANUFACTURING METHOD, AND DISPLAY MODULE
- Publication number 20240284608
- Publication date Aug 22, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Gang Yuan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ULTRA-THIN COPPER FOIL WITH CARRIER FOIL AND METHOD FOR MANUFACTURI...
- Publication number 20240206062
- Publication date Jun 20, 2024
- Lotte Energy Materials Corporation
- Chang Yol YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING SUBSTRATE WITH CONDUCTIVE PATTERN ATTACHED...
- Publication number 20240147627
- Publication date May 2, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Tomohiro FUKAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE STRUCTURE
- Publication number 20230422411
- Publication date Dec 28, 2023
- Subtron Technology Co., Ltd.
- Chung Ying Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD
- Publication number 20230209719
- Publication date Jun 29, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Myung Ju GI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD FOR DOUBLE-SIDED WIRING CIRCUIT BOARD AND DOUB...
- Publication number 20230008736
- Publication date Jan 12, 2023
- Nitto Denko Corporation
- Shusaku SHIBATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING CIRCUIT BOARD
- Publication number 20220201871
- Publication date Jun 23, 2022
- Nitto Denko Corporation
- Kenya TAKIMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CATALYZED METAL FOIL AND USES THEREOF
- Publication number 20210259115
- Publication date Aug 19, 2021
- Averatek Corporation
- Shinichi IKETANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING A HIGH-CURRENT PRINTED CIRCUIT BOARD
- Publication number 20190289726
- Publication date Sep 19, 2019
- Avary Holding (Shenzhen) Co., Limited.
- RIH-SIN JIAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190069417
- Publication date Feb 28, 2019
- Avary Holding (Shenzhen) Co., Limited.
- RIH-SIN JIAN
- G11 - INFORMATION STORAGE
Information Patent Application
PRINTED CIRCUIT BOARD, MODULE USING PRINTED CIRCUIT BOARD, AND CAME...
- Publication number 20180213642
- Publication date Jul 26, 2018
- Taiyo Yuden Co., Ltd.
- Yuichi SUGIYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POROUS ALUMINA TEMPLATES FOR ELECTRONIC PACKAGES
- Publication number 20160044781
- Publication date Feb 11, 2016
- Invensas Corporation
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20150163908
- Publication date Jun 11, 2015
- Subtron Technology Co., Ltd.
- Chin-Sheng Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150129293
- Publication date May 14, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Suk Hyeon CHO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20140369014
- Publication date Dec 18, 2014
- YAZAKI CORPORATION
- Yusuke Takagi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR LIGHT EMITTING MODULE AND METHOD OF MANUFACTURING THE...
- Publication number 20140319552
- Publication date Oct 30, 2014
- Satoshi Komatsubara
- F21 - LIGHTING
Information Patent Application
POROUS ALUMINA TEMPLATES FOR ELECTRONIC PACKAGES
- Publication number 20140262457
- Publication date Sep 18, 2014
- Invensas Corporation
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD HAVING METAL BUMPS
- Publication number 20140202748
- Publication date Jul 24, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Myung Sam KANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUSPENSION BOARD ASSEMBLY SHEET WITH CIRCUITS AND METHOD FOR MANUFA...
- Publication number 20140126169
- Publication date May 8, 2014
- Nitto Denko Corporation
- Terukazu IHARA
- G11 - INFORMATION STORAGE
Information Patent Application
METHOD OF MANUFACTURING A CHIP SUPPORT BOARD STRUCTURE
- Publication number 20140115888
- Publication date May 1, 2014
- KINSUS INTERCONNECT TECHNOLOGY CORP.
- Ting-Hao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD
- Publication number 20140118977
- Publication date May 1, 2014
- Murata Manufacturing Co., Ltd.
- Satoshi ITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming Thermal Conductive Pillar in Metal Core Printed C...
- Publication number 20140116613
- Publication date May 1, 2014
- COFAN USA, INC.
- Chang Han
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP SUPPORT BOARD STRUCTURE
- Publication number 20140116757
- Publication date May 1, 2014
- KINSUS INTERCONNECT TECHNOLOGY CORP.
- Ting-Hao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT RADIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140110156
- Publication date Apr 24, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Young Ki Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE MOUNTING BOARD AND SEMICONDUCTOR POWER MODULE
- Publication number 20140085834
- Publication date Mar 27, 2014
- Sanyo Electric Co., Ltd.
- Keishi KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed Circuit Boards with Deformations
- Publication number 20140055991
- Publication date Feb 27, 2014
- Forrest Starnes McCanless
- F21 - LIGHTING
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140054069
- Publication date Feb 27, 2014
- LG Innotek Co., Ltd.
- Sang Myung Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUSPENSION BOARD WITH CIRCUIT
- Publication number 20140029398
- Publication date Jan 30, 2014
- Nitto Denko Corporation
- Tetsuya Ohsawa
- G11 - INFORMATION STORAGE

Working metal substrate or core

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Manufacturing method for double-sided wiring circuit board and doub...

Method of manufacturing printed circuit board

Wiring circuit board

Catalyzed metal foil and uses thereof

Circuit board and manufacturing method therefor

Method for manufacturing a high-current printed circuit board

Printed circuit board and method for manufacturing the same

Method of producing suspension board with circuit

Wiring substrate and electronic component device

Porous alumina templates for electronic packages

Wiring thin plate having aerial wiring portion and method of manufa...

Porous alumina templates for electronic packages

Suspension board with circuit

Printed circuit board and method for manufacturing the same

Semiconductor light emitting module comprising an exposed plate sur...

Suspension board assembly sheet with circuits and method for manufa...

Device mounting board and semiconductor power module

Heat radiating substrate and method of manufacturing the same

Method for fabricating heat dissipation substrate

Magnetically controllable fluidic etching process

Magnetically controllable fluidic etching process

Printed circuit board and method of manufacturing same

Method of making a heat radiating structure for high-power LED

Semiconductor light emitting device comprising cut-and-bent portions

Method of manufacturing a chip support board structure

Method of manufacturing printed circuit board having vias and fine...

Printed wiring board and method for manufacturing printed wiring board

Suspension board with circuit having an opening extending therethro...

Chip support board structure

Wired circuit board and producing method thereof

Patents Applicationslast 30 patents

APPARATUS AND METHOD FOR MANUFACTURING POWER MODULE

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

CIRCUIT BOARD, MANUFACTURING METHOD, AND DISPLAY MODULE

ULTRA-THIN COPPER FOIL WITH CARRIER FOIL AND METHOD FOR MANUFACTURI...

METHOD FOR MANUFACTURING SUBSTRATE WITH CONDUCTIVE PATTERN ATTACHED...

SUBSTRATE STRUCTURE

METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD

MANUFACTURING METHOD FOR DOUBLE-SIDED WIRING CIRCUIT BOARD AND DOUB...

WIRING CIRCUIT BOARD

CATALYZED METAL FOIL AND USES THEREOF

METHOD FOR MANUFACTURING A HIGH-CURRENT PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

PRINTED CIRCUIT BOARD, MODULE USING PRINTED CIRCUIT BOARD, AND CAME...

POROUS ALUMINA TEMPLATES FOR ELECTRONIC PACKAGES

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

WIRING BOARD

SEMICONDUCTOR LIGHT EMITTING MODULE AND METHOD OF MANUFACTURING THE...

POROUS ALUMINA TEMPLATES FOR ELECTRONIC PACKAGES

PRINTED CIRCUIT BOARD HAVING METAL BUMPS

SUSPENSION BOARD ASSEMBLY SHEET WITH CIRCUITS AND METHOD FOR MANUFA...

METHOD OF MANUFACTURING A CHIP SUPPORT BOARD STRUCTURE

WIRING BOARD

Method of Forming Thermal Conductive Pillar in Metal Core Printed C...

CHIP SUPPORT BOARD STRUCTURE

HEAT RADIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

DEVICE MOUNTING BOARD AND SEMICONDUCTOR POWER MODULE

Printed Circuit Boards with Deformations

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

SUSPENSION BOARD WITH CIRCUIT