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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/01054Xenon [Xe]

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Thermocompression bonding using plasma gas
- Patent number 10,297,567
- Issue date May 21, 2019
- Intel Corporation
- Donglai David Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 10,056,336
- Issue date Aug 21, 2018
- Renesas Electronics Corporation
- Masami Koketsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 9,799,609
- Issue date Oct 24, 2017
- Renesas Electronics Corporation
- Masami Koketsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 9,536,839
- Issue date Jan 3, 2017
- Renesas Electronics Corporation
- Masami Koketsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 9,281,291
- Issue date Mar 8, 2016
- Renesas Electronics Corporation
- Masami Koketsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 8,952,555
- Issue date Feb 10, 2015
- Renesas Electronics Corporation
- Masami Koketsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with wireless communication
- Patent number 8,902,123
- Issue date Dec 2, 2014
- Semiconductor Energy Laboratory Co., Ltd.
- Koji Dairiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ta—TaN selective removal process for integrated device fabrication
- Patent number 8,865,597
- Issue date Oct 21, 2014
- International Business Machines Corporation
- John M. Cotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 8,633,603
- Issue date Jan 21, 2014
- Renesas Electronics Corporation
- Masami Koketsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with wireless communication
- Patent number 8,619,003
- Issue date Dec 31, 2013
- Semiconductor Energy Laboratory Co., Ltd.
- Koji Dairiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for fabricating electronic components using liquid injectio...
- Patent number 8,609,472
- Issue date Dec 17, 2013
- Dow Corning Corporation
- Tammy Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct edge connection for multi-chip integrated circuits
- Patent number 8,551,816
- Issue date Oct 8, 2013
- International Business Machines Corporation
- Steven A. Cordes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin sheet for circuit boards, sheet for circuit boards and circui...
- Patent number 8,445,092
- Issue date May 21, 2013
- Lintec Corporation
- Yasunori Karasawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Ta-TaN selective removal process for integrated device fabrication
- Patent number 8,426,316
- Issue date Apr 23, 2013
- International Business Machines Corporation
- John Michael Cotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 8,421,250
- Issue date Apr 16, 2013
- Renesas Electronics Corporation
- Masami Koketsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact spring application to semiconductor devices
- Patent number 8,318,542
- Issue date Nov 27, 2012
- Palo Alto Research Center Incorporated
- Eugene M. Chow
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 8,314,502
- Issue date Nov 20, 2012
- Renesas Electronics Corporation
- Masami Koketsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bondwire design
- Patent number 8,250,506
- Issue date Aug 21, 2012
- Helic S.A.
- Sotirios Bantas
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Direct edge connection for multi-chip integrated circuits
- Patent number 8,237,271
- Issue date Aug 7, 2012
- International Business Machines Corporation
- Steven A. Cordes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 8,232,181
- Issue date Jul 31, 2012
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for fabricating electronic components using liquid injectio...
- Patent number 8,017,449
- Issue date Sep 13, 2011
- Dow Corning Corporation
- Tammy Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 8,008,788
- Issue date Aug 30, 2011
- Renesas Electronics Corporation
- Masami Koketsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 7,989,317
- Issue date Aug 2, 2011
- Semiconductor Energy Laboratory Co., Ltd.
- Daiki Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact spring application to semiconductor devices
- Patent number 7,982,290
- Issue date Jul 19, 2011
- Palo Alto Research Center, Inc.
- Eugene M. Chow
- G01 - MEASURING TESTING
Information Patent Grant
Electronic device package and electronic equipment
- Patent number 7,964,955
- Issue date Jun 21, 2011
- Seiko Epson Corporation
- Hirofumi Kurosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 7,863,154
- Issue date Jan 4, 2011
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal filled through via structure for providing vertical wafer-to-...
- Patent number 7,821,120
- Issue date Oct 26, 2010
- International Business Machines Corporation
- H. Bernhard Pogge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 7,820,526
- Issue date Oct 26, 2010
- Semiconductor Energy Laboratory Co., Ltd.
- Daiki Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive composition, adhesive composition for circuit connection,...
- Patent number 7,795,325
- Issue date Sep 14, 2010
- Hitachi Chemical Co., Ltd.
- Shigeki Katogi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 7,759,177
- Issue date Jul 20, 2010
- Semiconductor Energy Laboratory Co., Ltd.
- Hidekazu Takahashi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20180025991
- Publication date Jan 25, 2018
- Renesas Electronics Corporation
- Masami KOKETSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOCOMPRESSION BONDING USING PLASMA GAS
- Publication number 20170179070
- Publication date Jun 22, 2017
- Donglai David Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20140110789
- Publication date Apr 24, 2014
- Renesas Electronics Corporation
- Masami KOKETSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20130307036
- Publication date Nov 21, 2013
- RENESAS ELECTRONICS CORPORATION
- Masami KOKETSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ta-TaN SELECTIVE REMOVAL PROCESS FOR INTEGRATED DEVICE FABRICATION
- Publication number 20130224959
- Publication date Aug 29, 2013
- International Business Machines Corporation
- John M. Cotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device
- Publication number 20130207252
- Publication date Aug 15, 2013
- RENESAS ELECTRONICS CORPORATION
- Kuniharu Muto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20130119561
- Publication date May 16, 2013
- Semiconductor Energy Laboratory Co., Ltd.
- Koji DAIRIKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20120248603
- Publication date Oct 4, 2012
- Renesas Electronics Corporation
- Masami KOKETSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Direct Edge Connection for Multi-Chip Integrated Circuits
- Publication number 20120187577
- Publication date Jul 26, 2012
- International Business Machines Corporation
- Steven A. Cordes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120146240
- Publication date Jun 14, 2012
- Semiconductor Energy Laboratory Co., Ltd.
- Koji DAIRIKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120034742
- Publication date Feb 9, 2012
- Renesas Electronics Corporation
- Kuniharu Muto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT SPRING APPLICATION TO SEMICONDUCTOR DEVICES
- Publication number 20110318880
- Publication date Dec 29, 2011
- Palo Alto Research Center Incorporated
- Eugene M. Chow
- G01 - MEASURING TESTING
Information Patent Application
Process for Fabricating Electronic Components Using Liquid Injectio...
- Publication number 20110221060
- Publication date Sep 15, 2011
- Tammy Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20110180877
- Publication date Jul 28, 2011
- Renesas Electronics Corporation
- Masami KOKETSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20110104859
- Publication date May 5, 2011
- SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Shunpei YAMAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN SHEET FOR CIRCUIT BOARDS, SHEET FOR CIRCUIT BOARDS AND CIRCUI...
- Publication number 20110048779
- Publication date Mar 3, 2011
- Yasunori Karasawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
THERMAL INTERCONNECT AND INTERFACE MATERIALS, METHODS OF PRODUCTION...
- Publication number 20110038124
- Publication date Feb 17, 2011
- Honeywell International Inc.
- Kikue S. Burnham
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20110039394
- Publication date Feb 17, 2011
- Semiconductor Energy Laboratory Co., Ltd.
- Daiki Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ATTACH AREA CUT-ON-FLY METHOD AND APPARATUS
- Publication number 20100218899
- Publication date Sep 2, 2010
- Checkpoint Systems, Inc.
- Thomas J. Clare
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20100105174
- Publication date Apr 29, 2010
- RENESAS TECHNOLOGY CORP.
- Kuniharu Muto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing Method of Semiconductor Device
- Publication number 20090269886
- Publication date Oct 29, 2009
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE COMPOSITION, ADHESIVE COMPOSITION FOR CIRCUIT CONNECTION,...
- Publication number 20090261483
- Publication date Oct 22, 2009
- HITACHI CHEMICAL CO., Ltd.
- Shigeki Katogi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20090206411
- Publication date Aug 20, 2009
- RENESAS TECHNOLOGY CORP.
- Masami KOKETSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bondwire Design
- Publication number 20090193370
- Publication date Jul 30, 2009
- Sotirios Bantas
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Manufacturing method of semiconductor device
- Publication number 20090042387
- Publication date Feb 12, 2009
- SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Daiki Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrically Connecting Substrate With Electrical Device
- Publication number 20090014850
- Publication date Jan 15, 2009
- David M. Craig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC APPARATUS
- Publication number 20090008128
- Publication date Jan 8, 2009
- Takehiko Hasebe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Ta-TaN SELECTIVE REMOVAL PROCESS FOR INTEGRATED DEVICE FABRICATION
- Publication number 20090001587
- Publication date Jan 1, 2009
- International Business Machines Corporation
- John Michael Cotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT EDGE CONNECTION FOR MULTI-CHIP INTEGRATED CIRCUITS
- Publication number 20080315409
- Publication date Dec 25, 2008
- Steven A. Cordes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Photoelectric conversion element having a semiconductor and semicon...
- Publication number 20080308851
- Publication date Dec 18, 2008
- Semiconductor Energy Laboratory Co., Ltd.
- Naoto Kusumoto
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Thermocompression bonding using plasma gas

Semiconductor device and a method of manufacturing the same

Semiconductor device and a method of manufacturing the same

Semiconductor device and a method of manufacturing the same

Semiconductor device and a method of manufacturing the same

Semiconductor device and a method of manufacturing the same

Semiconductor device with wireless communication

Ta—TaN selective removal process for integrated device fabrication

Semiconductor device and a method of manufacturing the same

Semiconductor device with wireless communication

Process for fabricating electronic components using liquid injectio...

Direct edge connection for multi-chip integrated circuits

Resin sheet for circuit boards, sheet for circuit boards and circui...

Ta-TaN selective removal process for integrated device fabrication

Semiconductor device and a method of manufacturing the same

Contact spring application to semiconductor devices

Semiconductor device and a method of manufacturing the same

Bondwire design

Direct edge connection for multi-chip integrated circuits

Manufacturing method of semiconductor device

Process for fabricating electronic components using liquid injectio...

Semiconductor device and a method of manufacturing the same

Manufacturing method of semiconductor device

Contact spring application to semiconductor devices

Electronic device package and electronic equipment

Manufacturing method of semiconductor device

Metal filled through via structure for providing vertical wafer-to-...

Manufacturing method of semiconductor device

Adhesive composition, adhesive composition for circuit connection,...

Manufacturing method of semiconductor device

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

THERMOCOMPRESSION BONDING USING PLASMA GAS

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

Ta-TaN SELECTIVE REMOVAL PROCESS FOR INTEGRATED DEVICE FABRICATION

Semiconductor Device

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

Direct Edge Connection for Multi-Chip Integrated Circuits

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

CONTACT SPRING APPLICATION TO SEMICONDUCTOR DEVICES

Process for Fabricating Electronic Components Using Liquid Injectio...

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

RESIN SHEET FOR CIRCUIT BOARDS, SHEET FOR CIRCUIT BOARDS AND CIRCUI...

THERMAL INTERCONNECT AND INTERFACE MATERIALS, METHODS OF PRODUCTION...

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

DIE ATTACH AREA CUT-ON-FLY METHOD AND APPARATUS

SEMICONDUCTOR DEVICE

Manufacturing Method of Semiconductor Device

ADHESIVE COMPOSITION, ADHESIVE COMPOSITION FOR CIRCUIT CONNECTION,...

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

Bondwire Design

Manufacturing method of semiconductor device

Electrically Connecting Substrate With Electrical Device

ELECTRONIC APPARATUS

Ta-TaN SELECTIVE REMOVAL PROCESS FOR INTEGRATED DEVICE FABRICATION

DIRECT EDGE CONNECTION FOR MULTI-CHIP INTEGRATED CIRCUITS

Photoelectric conversion element having a semiconductor and semicon...