Yttrium Aluminium Garnet Nd:YAG LASER

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CPC
H01L2924/40404

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/40404Yttrium Aluminium Garnet Nd:YAG LASER

Industries

Patents Grantslast 30 patents

Information Patent Grant
Printed circuit board and semiconductor package
- Patent number 10,950,517
- Issue date Mar 16, 2021
- Samsung Electronics Co., Ltd.
- Soo-Jae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and semiconductor package
- Patent number 10,586,748
- Issue date Mar 10, 2020
- Samsung Electronics Co., Ltd.
- Soo-Jae Park
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE
- Publication number 20200176344
- Publication date Jun 4, 2020
- Samsung Electronics Co. Ltd.
- Soo-Jae PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING MEMBER TO BE TREATED AND LAMINATE
- Publication number 20200009845
- Publication date Jan 9, 2020
- FUJIFILM CORPORATION
- Shotaro OGAWA
- B32 - LAYERED PRODUCTS
Information Patent Application
PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE
- Publication number 20170309559
- Publication date Oct 26, 2017
- Samsung Electronics Co., Ltd.
- Soo-Jae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING STACKED SEMICONDUCTOR PACKAGE
- Publication number 20150311187
- Publication date Oct 29, 2015
- Samsung Electronics Co., Ltd.
- Young-ho JOUNG
- H01 - BASIC ELECTRIC ELEMENTS