Zinc [Zn] as principal constituent

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H01L2224/13618

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/13618Zinc [Zn] as principal constituent

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method of forming brass-coated metals in flip-chip redistribution l...
- Patent number 11,984,418
- Issue date May 14, 2024
- Texas Instruments Incorporated
- Vivek Swaminathan Sridharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Industrial chip scale package for microelectronic device
- Patent number 11,749,616
- Issue date Sep 5, 2023
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a heterogeneous solder joint and method f...
- Patent number 11,682,644
- Issue date Jun 20, 2023
- Infineon Technologies AG
- Swee Kah Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Brass-coated metals in flip-chip redistribution layers
- Patent number 11,410,947
- Issue date Aug 9, 2022
- Texas Instruments Incorporated
- Vivek Swaminathan Sridharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connecting conductive pads with post-transition metal and nanoporou...
- Patent number 11,024,597
- Issue date Jun 1, 2021
- Facebook Technologies, LLC
- John Michael Goward
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding structure for semiconductor package and method of manufactu...
- Patent number 9,984,993
- Issue date May 29, 2018
- Advanced Semiconductor Engineering, Inc.
- Min-Fong Shu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump electrode, board which has bump electrodes, and method for man...
- Patent number 9,662,730
- Issue date May 30, 2017
- Senju Metal Industry Co., Ltd.
- Takahiro Hattori
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip-chip assembly process comprising pre-coating interconnect elem...
- Patent number 9,406,662
- Issue date Aug 2, 2016
- Commisariat A l'Energie Atomique et Aux Energies Alternatives
- François Marion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump package and methods of formation thereof
- Patent number 9,373,609
- Issue date Jun 21, 2016
- Infineon Technologies AG
- Meng Tong Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip with pyramid or cone-shaped conductive pads...
- Patent number 9,269,683
- Issue date Feb 23, 2016
- GLOBALFOUNDRIES Inc.
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal coating for indium bump bonding
- Patent number 9,190,377
- Issue date Nov 17, 2015
- Indium Corporation
- Sihai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip with pyramid or cone-shaped conductive pads...
- Patent number 8,766,439
- Issue date Jul 1, 2014
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor element, method for manufacturing the same, and mount...
- Patent number 8,330,271
- Issue date Dec 11, 2012
- Kyocera Corporation
- Kenichi Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming metal bumps
- Patent number 7,550,375
- Issue date Jun 23, 2009
- Advanced Semiconductor Engineering Inc.
- Sheng-Ming Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with gold bumps, and method and apparatus of p...
- Patent number 6,495,441
- Issue date Dec 17, 2002
- Fujitsu Limited
- Masayuki Kitajima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with gold bumps, and method and apparatus of p...
- Patent number 6,344,690
- Issue date Feb 5, 2002
- Fujitsu Limited
- Masayuki Kitajima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with gold bumps, and method and apparatus of p...
- Patent number 6,333,554
- Issue date Dec 25, 2001
- Fujitsu Limited
- Masayuki Kitajima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
INDUSTRIAL CHIP SCALE PACKAGE FOR MICROELECTRONIC DEVICE
- Publication number 20240162163
- Publication date May 16, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT WITH HIGH COPLANARITY AND METHOD OF MANUFACTUR...
- Publication number 20240105670
- Publication date Mar 28, 2024
- CYNTEC CO., LTD.
- Chi-Hung Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL PILLAR FOR CONDUCTIVE CONNECTION
- Publication number 20240088079
- Publication date Mar 14, 2024
- DUKSAN HI-METAL CO., LTD.
- Eun Dong Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY INTERCONNECTION PILLARS AND ASSOCIATE...
- Publication number 20240038707
- Publication date Feb 1, 2024
- Micron Technology, Inc.
- Andrew M. Bayless
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230034654
- Publication date Feb 2, 2023
- Samsung Electronics Co., Ltd.
- Yong Ho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRASS-COATED METALS IN FLIP-CHIP REDISTRIBUTION LAYERS
- Publication number 20220384375
- Publication date Dec 1, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Vivek Swaminathan SRIDHARAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A HETEROGENEOUS SOLDER JOINT AND METHOD F...
- Publication number 20220005778
- Publication date Jan 6, 2022
- INFINEON TECHNOLOGIES AG
- Swee Kah Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRASS-COATED METALS IN FLIP-CHIP REDISTRIBUTION LAYERS
- Publication number 20210193600
- Publication date Jun 24, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Vivek Swaminathan SRIDHARAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CHIP WITH PYRAMID OR CONE-SHAPED CONDUCTIVE PADS...
- Publication number 20140187034
- Publication date Jul 3, 2014
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump Package and Methods of Formation Thereof
- Publication number 20140110835
- Publication date Apr 24, 2014
- INFINEON TECHNOLOGIES AG
- Meng Tong Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL CHIP STACK AND METHOD OF FORMING THE SAME
- Publication number 20130307144
- Publication date Nov 21, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL COATING FOR INDIUM BUMP BONDING
- Publication number 20110315429
- Publication date Dec 29, 2011
- Sihai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CHIP WITH PYRAMID OR CONE-SHAPED CONDUCTIVE PADS...
- Publication number 20110140271
- Publication date Jun 16, 2011
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Element, Method for Manufacturing the Same, and Mount...
- Publication number 20100252926
- Publication date Oct 7, 2010
- KYOCERA CORPORATION
- Kenichi Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming metal bumps
- Publication number 20070218676
- Publication date Sep 20, 2007
- ADVANCED SEMICONDUCTOR ENGINEERING INC.
- Sheng-Ming Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device with gold bumps, and method and apparatus of p...
- Publication number 20020100972
- Publication date Aug 1, 2002
- Masayuki Kitajima
- H01 - BASIC ELECTRIC ELEMENTS

Zinc [Zn] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of forming brass-coated metals in flip-chip redistribution l...

Industrial chip scale package for microelectronic device

Semiconductor device with a heterogeneous solder joint and method f...

Brass-coated metals in flip-chip redistribution layers

Connecting conductive pads with post-transition metal and nanoporou...

Bonding structure for semiconductor package and method of manufactu...

Bump electrode, board which has bump electrodes, and method for man...

Flip-chip assembly process comprising pre-coating interconnect elem...

Bump package and methods of formation thereof

Integrated circuit chip with pyramid or cone-shaped conductive pads...

Metal coating for indium bump bonding

Integrated circuit chip with pyramid or cone-shaped conductive pads...

Semiconductor element, method for manufacturing the same, and mount...

Method for forming metal bumps

Semiconductor device with gold bumps, and method and apparatus of p...

Semiconductor device with gold bumps, and method and apparatus of p...

Semiconductor device with gold bumps, and method and apparatus of p...

Patents Applicationslast 30 patents

INDUSTRIAL CHIP SCALE PACKAGE FOR MICROELECTRONIC DEVICE

ELECTRONIC COMPONENT WITH HIGH COPLANARITY AND METHOD OF MANUFACTUR...

METAL PILLAR FOR CONDUCTIVE CONNECTION

SEMICONDUCTOR DEVICE ASSEMBLY INTERCONNECTION PILLARS AND ASSOCIATE...

SEMICONDUCTOR PACKAGE

BRASS-COATED METALS IN FLIP-CHIP REDISTRIBUTION LAYERS

SEMICONDUCTOR DEVICE WITH A HETEROGENEOUS SOLDER JOINT AND METHOD F...

BRASS-COATED METALS IN FLIP-CHIP REDISTRIBUTION LAYERS

INTEGRATED CIRCUIT CHIP WITH PYRAMID OR CONE-SHAPED CONDUCTIVE PADS...

Bump Package and Methods of Formation Thereof

THREE-DIMENSIONAL CHIP STACK AND METHOD OF FORMING THE SAME

METAL COATING FOR INDIUM BUMP BONDING

INTEGRATED CIRCUIT CHIP WITH PYRAMID OR CONE-SHAPED CONDUCTIVE PADS...

Semiconductor Element, Method for Manufacturing the Same, and Mount...

Method for forming metal bumps

Semiconductor device with gold bumps, and method and apparatus of p...