Zinc [Zn] as principal constituent

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H01L2224/37118

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/37118Zinc [Zn] as principal constituent

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Patents Grantslast 30 patents

Information Patent Grant
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Information Patent Grant
Multichip power semiconductor device
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Information Patent Grant
Chip arrangements, a chip package and a method for manufacturing a...
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- Issue date Oct 7, 2014
- Infineon Technologies AG
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- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
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Information Patent Application
CHIP ARRANGEMENTS, A CHIP PACKAGE AND A METHOD FOR MANUFACTURING A...
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