Zinc [Zn] as principal constituent

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H01L2224/05118

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/05118Zinc [Zn] as principal constituent

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packaging method and semiconductor package device
- Patent number 11,990,432
- Issue date May 21, 2024
- TONGFU MICROELECTRONICS CO., LTD.
- Guoqing Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pads for low temperature hybrid bonding
- Patent number 11,810,891
- Issue date Nov 7, 2023
- Advanced Micro Devices, Inc.
- Priyal Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor chip, method for producing a power semiconducto...
- Patent number 11,664,335
- Issue date May 30, 2023
- Semikron Elektronik GmbH & Co., KG
- Wolfgang-Michael Schulz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate having a bond pad material based on aluminum
- Patent number 11,410,950
- Issue date Aug 9, 2022
- Infineon Technologies AG
- Gert Pfahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die with conversion coating
- Patent number 11,121,076
- Issue date Sep 14, 2021
- Texas Instruments Incorporated
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pads for low temperature hybrid bonding
- Patent number 10,937,755
- Issue date Mar 2, 2021
- Advanced Micro Devices, Inc.
- Priyal Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device load terminal
- Patent number 10,756,035
- Issue date Aug 25, 2020
- Infineon Technologies AG
- Roman Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip wire bondless power device
- Patent number 10,720,380
- Issue date Jul 21, 2020
- Sayan Seal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure with underbump metallization structure and integrate...
- Patent number 9,190,373
- Issue date Nov 17, 2015
- Kabushiki Kaisha Toshiba
- Tatsuo Migita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor devices
- Patent number 9,087,833
- Issue date Jul 21, 2015
- Samsung Electronics Co., Ltd.
- Baik-woo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device, method of manufacturing the device and...
- Patent number 9,059,003
- Issue date Jun 16, 2015
- NIPPON MICROMETAL CORPORATION
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Soldering structure and method using Zn
- Patent number 8,517,249
- Issue date Aug 27, 2013
- Samsung Electronics Co., Ltd.
- Won-kyoung Choi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer-bump structure
- Patent number 8,299,629
- Issue date Oct 30, 2012
- Aflash Technology Co., Ltd.
- Kuei-Wu Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip having bond pads
- Patent number 7,825,523
- Issue date Nov 2, 2010
- Samsung Electronics Co., Ltd.
- Young-Hee Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a semiconductor chip assembly with metal pillar an...
- Patent number 7,811,863
- Issue date Oct 12, 2010
- Bridge Semiconductor Corporation
- Charles W. C. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip having bond pads and multi-chip package
- Patent number 7,576,440
- Issue date Aug 18, 2009
- Samsung Electronics Co., Ltd.
- Young-Hee Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip having bond pads
- Patent number 7,547,977
- Issue date Jun 16, 2009
- Samsung Electronics Co., Ltd.
- Young-Hee Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip having bond pads
- Patent number 7,541,682
- Issue date Jun 2, 2009
- Samsung Electronics Co., Ltd.
- Young-Hee Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating board on chip (BOC) semiconductor package wi...
- Patent number 7,537,966
- Issue date May 26, 2009
- Micron Technology, Inc.
- Mike Connell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor package with circuit side poly...
- Patent number 7,479,413
- Issue date Jan 20, 2009
- Micron Technology, Inc.
- Mike Connell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor electronic device and method of manufacturing thereof
- Patent number 7,459,387
- Issue date Dec 2, 2008
- STMicroelectronics S.r.l.
- Roberto Tiziani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip having bond pads
- Patent number 7,453,159
- Issue date Nov 18, 2008
- Samsung Electronics Co., Ltd.
- Young-Hee Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sealing and protecting integrated circuit bonding pads
- Patent number 7,262,126
- Issue date Aug 28, 2007
- Texas Instruments Incorporated
- Christo P. Bojkov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor multi-chip package
- Patent number 7,148,578
- Issue date Dec 12, 2006
- Samsung Electronics Co., Ltd.
- Young-Hee Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with circuit side polymer layer and wafer lev...
- Patent number 6,995,041
- Issue date Feb 7, 2006
- Micron Technology, Inc.
- Mike Connell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for chemical etch control of noble metals in the presence of...
- Patent number 6,979,647
- Issue date Dec 27, 2005
- Texas Instruments Incorporated
- Christo P. Bojkov
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Stacked semiconductor package with circuit side polymer layer
- Patent number 6,949,834
- Issue date Sep 27, 2005
- Micron Technology, Inc.
- Mike Connell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sealing and protecting integrated circuit bonding pads
- Patent number 6,927,493
- Issue date Aug 9, 2005
- Texas Instruments Incorporated
- Christo P. Bojkov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating bumps utilizing a resist layer having photose...
- Patent number 6,900,117
- Issue date May 31, 2005
- Seiko Epson Corporation
- Tsuyoshi Yoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor electronic device and method of manufacturing thereof
- Patent number 6,815,789
- Issue date Nov 9, 2004
- STMicroelectronics S.r.l.
- Roberto Tiziani
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
NEUTRAL pH COPPER PLATING SOLUTION FOR UNDERCUT REDUCTION
- Publication number 20240279835
- Publication date Aug 22, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230411323
- Publication date Dec 21, 2023
- RENESAS ELECTRONICS CORPORATION
- Etsuko WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20220189895
- Publication date Jun 16, 2022
- Fujitsu Limited
- Masaru Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING METHOD AND SEMICONDUCTOR PACKAGE DEVICE
- Publication number 20210265294
- Publication date Aug 26, 2021
- TONGFU MICROELECTRONICS CO., LTD.
- Guoqing YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PADS FOR LOW TEMPERATURE HYBRID BONDING
- Publication number 20210183810
- Publication date Jun 17, 2021
- ADVANCED MICRO DEVICES, INC.
- PRIYAL SHAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Substrate Having a Bond Pad Material Based on Aluminum
- Publication number 20210091025
- Publication date Mar 25, 2021
- INFINEON TECHNOLOGIES AG
- Gert Pfahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE WITH CONVERSION COATING
- Publication number 20200411429
- Publication date Dec 31, 2020
- TEXAS INSTRUMENTS INCORPORATED
- NAZILA DADVAND
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH ELECTROPLATED COPPER STRUCTURES
- Publication number 20200286844
- Publication date Sep 10, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Keith Edward Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NEUTRAL pH COPPER PLATING SOLUTION FOR UNDERCUT REDUCTION
- Publication number 20200248329
- Publication date Aug 6, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
BOND PADS FOR LOW TEMPERATURE HYBRID BONDING
- Publication number 20200006280
- Publication date Jan 2, 2020
- Priyal Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF INTERCONNECT FOR HIGH DENSITY 2.5D AND 3D INTEGRATION
- Publication number 20180286826
- Publication date Oct 4, 2018
- Xilinx, Inc.
- Jaspreet Singh Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Load Terminal
- Publication number 20170098620
- Publication date Apr 6, 2017
- INFINEON TECHNOLOGIES AG
- Roman Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE DEVICE AND...
- Publication number 20140327018
- Publication date Nov 6, 2014
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICES
- Publication number 20140151744
- Publication date Jun 5, 2014
- Samsung Electronics Co., Ltd.
- Baik-woo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Aluminum Bond Pad With Trench Thinning for Fine Pitch Ultra-Thick A...
- Publication number 20120299187
- Publication date Nov 29, 2012
- BROADCOM CORPORATION
- Kent Charles OERTLE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20120049356
- Publication date Mar 1, 2012
- Kabushiki Kaisha Toshiba
- Tatsuo Migita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer-Bump Structure
- Publication number 20110260300
- Publication date Oct 27, 2011
- MAO BANG ELECTRONIC CO., LTD.
- Kuei-Wu Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT, SEMICONDUCTOR PACKAGE, AND ELECTRONIC DEVICE
- Publication number 20090174052
- Publication date Jul 9, 2009
- NEC Corporation
- Yoshimichi Sogawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDERING STRUCTURE AND METHOD USING ZN
- Publication number 20080223906
- Publication date Sep 18, 2008
- Samsung Electronics Co., Ltd.
- Won-kyoung Choi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor chip having bond pads
- Publication number 20070108562
- Publication date May 17, 2007
- SAMSUNG ELECTRONICS CO., LTD.
- Young-Hee Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP HAVING BOND PADS
- Publication number 20070108633
- Publication date May 17, 2007
- Samsung Electronics Co., Ltd.
- Young-Hee Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP HAVING BOND PADS
- Publication number 20070108632
- Publication date May 17, 2007
- SAMSUNG ELECTRONICS CO., LTD.
- Young-Hee Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP HAVING BOND PADS AND MULTI-CHIP PACKAGE
- Publication number 20070057367
- Publication date Mar 15, 2007
- SAMSUNG ELECTRONICS CO., LTD.
- Young-Hee Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP HAVING BOND PADS AND MULTI-CHIP PACKAGE
- Publication number 20070057383
- Publication date Mar 15, 2007
- SAMSUNG ELECTRONICS CO., LTD.
- Young-Hee Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating board on chip (BOC) semiconductor package wi...
- Publication number 20060292752
- Publication date Dec 28, 2006
- Mike Connell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating semiconductor package with circuit side poly...
- Publication number 20060030081
- Publication date Feb 9, 2006
- Mike Connell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sealing and protecting integrated circuit bonding pads
- Publication number 20050245076
- Publication date Nov 3, 2005
- Christo P. Bojkov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sealing and protecting integrated circuit bonding pads
- Publication number 20050073048
- Publication date Apr 7, 2005
- Christo P. Bojkov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor electronic device and method of manufacturing thereof
- Publication number 20050073057
- Publication date Apr 7, 2005
- STMicroelectronics S.r.I.
- Roberto Tiziani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for chemical etch control of noble metals in the presence of...
- Publication number 20050048798
- Publication date Mar 3, 2005
- Christo P. Bojkov
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Zinc [Zn] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor packaging method and semiconductor package device

Bond pads for low temperature hybrid bonding

Power semiconductor chip, method for producing a power semiconducto...

Semiconductor substrate having a bond pad material based on aluminum

Semiconductor die with conversion coating

Bond pads for low temperature hybrid bonding

Semiconductor device load terminal

Flip-chip wire bondless power device

Bump structure with underbump metallization structure and integrate...

Power semiconductor devices

Power semiconductor device, method of manufacturing the device and...

Soldering structure and method using Zn

Wafer-bump structure

Semiconductor chip having bond pads

Method of making a semiconductor chip assembly with metal pillar an...

Semiconductor chip having bond pads and multi-chip package

Semiconductor chip having bond pads

Semiconductor chip having bond pads

Method for fabricating board on chip (BOC) semiconductor package wi...

Method for fabricating semiconductor package with circuit side poly...

Semiconductor electronic device and method of manufacturing thereof

Semiconductor chip having bond pads

Sealing and protecting integrated circuit bonding pads

Semiconductor multi-chip package

Semiconductor package with circuit side polymer layer and wafer lev...

Method for chemical etch control of noble metals in the presence of...

Stacked semiconductor package with circuit side polymer layer

Sealing and protecting integrated circuit bonding pads

Method of fabricating bumps utilizing a resist layer having photose...

Semiconductor electronic device and method of manufacturing thereof

Patents Applicationslast 30 patents

NEUTRAL pH COPPER PLATING SOLUTION FOR UNDERCUT REDUCTION

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGING METHOD AND SEMICONDUCTOR PACKAGE DEVICE

BOND PADS FOR LOW TEMPERATURE HYBRID BONDING

Semiconductor Substrate Having a Bond Pad Material Based on Aluminum

SEMICONDUCTOR DIE WITH CONVERSION COATING

SEMICONDUCTOR DEVICE WITH ELECTROPLATED COPPER STRUCTURES

NEUTRAL pH COPPER PLATING SOLUTION FOR UNDERCUT REDUCTION

BOND PADS FOR LOW TEMPERATURE HYBRID BONDING

METHODS OF INTERCONNECT FOR HIGH DENSITY 2.5D AND 3D INTEGRATION

Semiconductor Device Load Terminal

POWER SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE DEVICE AND...

POWER SEMICONDUCTOR DEVICES

Aluminum Bond Pad With Trench Thinning for Fine Pitch Ultra-Thick A...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

Wafer-Bump Structure

ELECTRONIC COMPONENT, SEMICONDUCTOR PACKAGE, AND ELECTRONIC DEVICE

SOLDERING STRUCTURE AND METHOD USING ZN

Semiconductor chip having bond pads

SEMICONDUCTOR CHIP HAVING BOND PADS

SEMICONDUCTOR CHIP HAVING BOND PADS

SEMICONDUCTOR CHIP HAVING BOND PADS AND MULTI-CHIP PACKAGE

SEMICONDUCTOR CHIP HAVING BOND PADS AND MULTI-CHIP PACKAGE

Method for fabricating board on chip (BOC) semiconductor package wi...

Method for fabricating semiconductor package with circuit side poly...

Sealing and protecting integrated circuit bonding pads

Sealing and protecting integrated circuit bonding pads

Semiconductor electronic device and method of manufacturing thereof

Method for chemical etch control of noble metals in the presence of...