Zinc [Zn] as principal constituent

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H01L2224/05618

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/05618Zinc [Zn] as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method of forming brass-coated metals in flip-chip redistribution l...
- Patent number 11,984,418
- Issue date May 14, 2024
- Texas Instruments Incorporated
- Vivek Swaminathan Sridharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding process with inhibited oxide formation
- Patent number 11,869,870
- Issue date Jan 9, 2024
- SiTime Corporation
- Paul M. Hagelin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, manufacturing method, solid state image senso...
- Patent number 11,776,923
- Issue date Oct 3, 2023
- Sony Corporation
- Masaki Haneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor chip, method for producing a power semiconducto...
- Patent number 11,664,335
- Issue date May 30, 2023
- Semikron Elektronik GmbH & Co., KG
- Wolfgang-Michael Schulz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding process with inhibited oxide formation
- Patent number 11,488,930
- Issue date Nov 1, 2022
- SiTime Corporation
- Paul M. Hagelin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Brass-coated metals in flip-chip redistribution layers
- Patent number 11,410,947
- Issue date Aug 9, 2022
- Texas Instruments Incorporated
- Vivek Swaminathan Sridharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device load terminal
- Patent number 11,315,892
- Issue date Apr 26, 2022
- Infineon Technologies AG
- Roman Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, manufacturing method, solid state image senso...
- Patent number 10,950,637
- Issue date Mar 16, 2021
- Sony Corporation
- Masaki Haneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for creating a bond between objects based on f...
- Patent number 10,923,454
- Issue date Feb 16, 2021
- Seyed Amir Paknejad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding process with inhibited oxide formation
- Patent number 10,910,341
- Issue date Feb 2, 2021
- SiTime Corporation
- Paul M. Hagelin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device load terminal
- Patent number 10,756,035
- Issue date Aug 25, 2020
- Infineon Technologies AG
- Roman Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-temperature bonding with spaced nanorods and eutectic alloys
- Patent number 10,646,964
- Issue date May 12, 2020
- Northeastern University
- Stephen Peter Stagon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with metal structure electrically connected to...
- Patent number 10,651,140
- Issue date May 12, 2020
- Infineon Technologies AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-destructive testing of integrated circuit chips
- Patent number 10,651,099
- Issue date May 12, 2020
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, manufacturing method, solid state image senso...
- Patent number 10,615,210
- Issue date Apr 7, 2020
- Sony Corporation
- Masaki Haneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of interconnect for high density 2.5D and 3D integration
- Patent number 10,593,638
- Issue date Mar 17, 2020
- Xilinx, Inc.
- Jaspreet Singh Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with metal structure electrically connected to...
- Patent number 10,090,265
- Issue date Oct 2, 2018
- Infineon Technologies AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device load terminal
- Patent number 10,079,217
- Issue date Sep 18, 2018
- Infineon Technologies AG
- Roman Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure for semiconductor package and method of manufactu...
- Patent number 9,984,993
- Issue date May 29, 2018
- Advanced Semiconductor Engineering, Inc.
- Min-Fong Shu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable interconnect
- Patent number 9,960,130
- Issue date May 1, 2018
- UTAC HEADQUARTERS PTE. LTD.
- Rui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Batch process for connecting chips to a carrier
- Patent number 9,673,170
- Issue date Jun 6, 2017
- Infineon Technologies AG
- Rupert Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having solder joint and method of forming the...
- Patent number 9,646,945
- Issue date May 9, 2017
- Samsung Electronics Co., Ltd.
- Soon-Bum Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for manufacturing a chip arrangement, methods for manufactu...
- Patent number 9,576,875
- Issue date Feb 21, 2017
- Infineon Technologies AG
- Reinhard Hess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device for use in flip-chip bonding, which reduces la...
- Patent number 9,520,381
- Issue date Dec 13, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yuichi Higuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack packages and methods of fabricating the same
- Patent number 9,368,482
- Issue date Jun 14, 2016
- SK hynix Inc.
- Jong Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with low-melting-temperature conductive reg...
- Patent number 9,318,313
- Issue date Apr 19, 2016
- STMicroelectronics S.r.l.
- Alberto Pagani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure of semiconductor package, method for fabricating...
- Patent number 9,269,670
- Issue date Feb 23, 2016
- SK Hynix Inc.
- Seong Cheol Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a chip package
- Patent number 9,245,868
- Issue date Jan 26, 2016
- Infineon Technologies AG
- Holger Torwesten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack packages and methods of fabricating the same
- Patent number 9,214,410
- Issue date Dec 15, 2015
- SK Hynix Inc.
- Jong Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having stacked substrates with protruding and...
- Patent number 9,209,112
- Issue date Dec 8, 2015
- Seiko Epson Corporation
- Hideo Imai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240379639
- Publication date Nov 14, 2024
- Samsung Electronics Co., Ltd.
- Myung Joo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALLOY FOR METAL UNDERCUT REDUCTION
- Publication number 20240290735
- Publication date Aug 29, 2024
- TEXAS INSTRUMENTS INCORPORATED
- RAFAEL JOSE GUEVARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240234354
- Publication date Jul 11, 2024
- nD-HI Technologies Lab, Inc.
- Ho-Ming TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD, SOLID STATE IMAGE SENSO...
- Publication number 20230402411
- Publication date Dec 14, 2023
- SONY GROUP CORPORATION
- Masaki HANEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND PACKAGING METHOD
- Publication number 20230197652
- Publication date Jun 22, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Xiaoxuan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING UNDERFILL AND METHOD OF FORMING THE...
- Publication number 20230154885
- Publication date May 18, 2023
- Samsung Electronics Co., LTD
- Jinyoung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT INSULATING INTERCONNECT FEATURES IN A COMPONENT OF A COMPOSITE...
- Publication number 20220415853
- Publication date Dec 29, 2022
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRASS-COATED METALS IN FLIP-CHIP REDISTRIBUTION LAYERS
- Publication number 20220384375
- Publication date Dec 1, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Vivek Swaminathan SRIDHARAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRASS-COATED METALS IN FLIP-CHIP REDISTRIBUTION LAYERS
- Publication number 20210193600
- Publication date Jun 24, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Vivek Swaminathan SRIDHARAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD, SOLID STATE IMAGE SENSO...
- Publication number 20210183661
- Publication date Jun 17, 2021
- SONY CORPORATION
- Masaki HANEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR CREATING A BOND BETWEEN OBJECTS BASED ON F...
- Publication number 20210167035
- Publication date Jun 3, 2021
- Seyed Amir Paknejad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD, SOLID STATE IMAGE SENSO...
- Publication number 20200227462
- Publication date Jul 16, 2020
- SONY CORPORATION
- Masaki HANEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Chip, Method for Producing a Power Semiconducto...
- Publication number 20190148318
- Publication date May 16, 2019
- SEMIKRON Elektronik GmbH & Co., KG
- Wolfgang-Michael SCHULZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20190088618
- Publication date Mar 21, 2019
- Toshiba Memory Corporation
- Kazumichi TSUMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE LOAD TERMINAL
- Publication number 20180366428
- Publication date Dec 20, 2018
- INFINEON TECHNOLOGIES AG
- Roman ROTH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Metal Structure Electrically Connected to...
- Publication number 20180350761
- Publication date Dec 6, 2018
- INFINEON TECHNOLOGIES AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTU...
- Publication number 20170033075
- Publication date Feb 2, 2017
- Advanced Semiconductor, Inc.
- Min-Fong SHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE INTERCONNECT
- Publication number 20160233179
- Publication date Aug 11, 2016
- United Test & Assembly Center Ltd.
- Rui HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ZN BASED LEAD-FREE SOLDER AND SEMICONDUCTOR POWER MODULE
- Publication number 20160082552
- Publication date Mar 24, 2016
- MITSUBISHI ELECTRIC CORPORATION
- Koji YAMAZAKI
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
POWER SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE DEVICE AND...
- Publication number 20140327018
- Publication date Nov 6, 2014
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE OF SEMICONDUCTOR PACKAGE, METHOD FOR FABRICATING...
- Publication number 20140252652
- Publication date Sep 11, 2014
- SK HYNIX INC.
- Seong Cheol KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODES AND METHODS OF FABRICATING THE SAME
- Publication number 20140124799
- Publication date May 8, 2014
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Doo Hyeb YOUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPENSATING FOR WARPAGE OF A FLIP CHIP PACKAGE BY VARYING HEIGHTS...
- Publication number 20140117535
- Publication date May 1, 2014
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT, A CHIP PACKAGE AND A METHOD FOR MANUFACTURING A...
- Publication number 20140084302
- Publication date Mar 27, 2014
- INFINEON TECHNOLOGIES AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for manufacturing a chip arrangement, methods for manufactu...
- Publication number 20140070376
- Publication date Mar 13, 2014
- INFINEON TECHNOLOGIES AG
- Reinhard Hess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND A METHOD FOR MANUFACTURING A CHIP PACKAGE
- Publication number 20140061669
- Publication date Mar 6, 2014
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device and Method of Fabricating an Electronic Device
- Publication number 20140042603
- Publication date Feb 13, 2014
- INFINEON TECHNOLOGIES AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHODS FOR MANUFACTURING A CHIP PACKAGE
- Publication number 20140001634
- Publication date Jan 2, 2014
- INFINEON TECHNOLOGIES AG
- Holger Torwesten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-In-Packages and Methods of Formation Thereof
- Publication number 20140001615
- Publication date Jan 2, 2014
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL CHIP STACK AND METHOD OF FORMING THE SAME
- Publication number 20130307144
- Publication date Nov 21, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua YU
- H01 - BASIC ELECTRIC ELEMENTS

Zinc [Zn] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of forming brass-coated metals in flip-chip redistribution l...

Bonding process with inhibited oxide formation

Semiconductor device, manufacturing method, solid state image senso...

Power semiconductor chip, method for producing a power semiconducto...

Bonding process with inhibited oxide formation

Brass-coated metals in flip-chip redistribution layers

Power semiconductor device load terminal

Semiconductor device, manufacturing method, solid state image senso...

Method and apparatus for creating a bond between objects based on f...

Bonding process with inhibited oxide formation

Semiconductor device load terminal

Low-temperature bonding with spaced nanorods and eutectic alloys

Semiconductor device with metal structure electrically connected to...

Non-destructive testing of integrated circuit chips

Semiconductor device, manufacturing method, solid state image senso...

Methods of interconnect for high density 2.5D and 3D integration

Semiconductor device with metal structure electrically connected to...

Power semiconductor device load terminal

Bonding structure for semiconductor package and method of manufactu...

Reliable interconnect

Batch process for connecting chips to a carrier

Semiconductor device having solder joint and method of forming the...

Methods for manufacturing a chip arrangement, methods for manufactu...

Semiconductor device for use in flip-chip bonding, which reduces la...

Stack packages and methods of fabricating the same

Semiconductor structure with low-melting-temperature conductive reg...

Bonding structure of semiconductor package, method for fabricating...

Method for manufacturing a chip package

Stack packages and methods of fabricating the same

Semiconductor device having stacked substrates with protruding and...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

ALLOY FOR METAL UNDERCUT REDUCTION

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD, SOLID STATE IMAGE SENSO...

PACKAGE STRUCTURE AND PACKAGING METHOD

SEMICONDUCTOR PACKAGE INCLUDING UNDERFILL AND METHOD OF FORMING THE...

HEAT INSULATING INTERCONNECT FEATURES IN A COMPONENT OF A COMPOSITE...

BRASS-COATED METALS IN FLIP-CHIP REDISTRIBUTION LAYERS

BRASS-COATED METALS IN FLIP-CHIP REDISTRIBUTION LAYERS

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD, SOLID STATE IMAGE SENSO...

METHOD AND APPARATUS FOR CREATING A BOND BETWEEN OBJECTS BASED ON F...

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD, SOLID STATE IMAGE SENSO...

Power Semiconductor Chip, Method for Producing a Power Semiconducto...

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

POWER SEMICONDUCTOR DEVICE LOAD TERMINAL

Semiconductor Device with Metal Structure Electrically Connected to...

BONDING STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTU...

RELIABLE INTERCONNECT

ZN BASED LEAD-FREE SOLDER AND SEMICONDUCTOR POWER MODULE

POWER SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE DEVICE AND...

BONDING STRUCTURE OF SEMICONDUCTOR PACKAGE, METHOD FOR FABRICATING...

LIGHT EMITTING DIODES AND METHODS OF FABRICATING THE SAME

COMPENSATING FOR WARPAGE OF A FLIP CHIP PACKAGE BY VARYING HEIGHTS...

INTEGRATED CIRCUIT, A CHIP PACKAGE AND A METHOD FOR MANUFACTURING A...

Methods for manufacturing a chip arrangement, methods for manufactu...

CHIP PACKAGE AND A METHOD FOR MANUFACTURING A CHIP PACKAGE

Electronic Device and Method of Fabricating an Electronic Device

CHIP PACKAGE AND METHODS FOR MANUFACTURING A CHIP PACKAGE

Package-In-Packages and Methods of Formation Thereof

THREE-DIMENSIONAL CHIP STACK AND METHOD OF FORMING THE SAME