Zinc (Zn) as principal constituent

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H01L2224/85418

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/85418Zinc (Zn) as principal constituent

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit device having die bonded to the polymer side of...
- Patent number 8,456,021
- Issue date Jun 4, 2013
- Texas Instruments Incorporated
- Chien-Te Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frames with improved adhesion to a polymer
- Patent number 5,449,951
- Issue date Sep 12, 1995
- Olin Corporation
- Arvind Parthasarathi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frames having a chromium and zinc alloy coating
- Patent number 5,343,073
- Issue date Aug 30, 1994
- Olin Corporation
- Arvind Parthasarathi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT DEVICE HAVING DIE BONDED TO THE POLYMER SIDE OF...
- Publication number 20120126418
- Publication date May 24, 2012
- TEXAS INSTRUMENTS INCORPORATED
- Chien-Te Feng
- H01 - BASIC ELECTRIC ELEMENTS