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Zinc (Zn) as principal constituent
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H01L2224/48618
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ELECTRICITY
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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/48618
Zinc (Zn) as principal constituent
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last 30 patents
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Patent Grant
Chip package and a method for manufacturing a chip package
Patent number
8,815,647
Issue date
Aug 26, 2014
Infineon Technologies AG
Ralf Otremba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and fabricating method thereof
Patent number
8,183,683
Issue date
May 22, 2012
Amkor Technology, Inc.
Joon Su Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer and semiconductor package
Patent number
8,110,931
Issue date
Feb 7, 2012
Advanced Semiconductor Engineering, Inc.
Hsiao Chuan Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Lead frames with improved adhesion to a polymer
Patent number
5,449,951
Issue date
Sep 12, 1995
Olin Corporation
Arvind Parthasarathi
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Lead frames having a chromium and zinc alloy coating
Patent number
5,343,073
Issue date
Aug 30, 1994
Olin Corporation
Arvind Parthasarathi
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
CHIP PACKAGE AND A METHOD FOR MANUFACTURING A CHIP PACKAGE
Publication number
20140061669
Publication date
Mar 6, 2014
INFINEON TECHNOLOGIES AG
Ralf Otremba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Package-In-Packages and Methods of Formation Thereof
Publication number
20140001615
Publication date
Jan 2, 2014
Infineon Technologies Austria AG
Ralf Otremba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER AND SEMICONDUCTOR PACKAGE
Publication number
20100007004
Publication date
Jan 14, 2010
Advanced Semiconductor Engineering, Inc.
Hsiao Chuan CHANG
H01 - BASIC ELECTRIC ELEMENTS