Zinc [Zn] as principal constituent

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CPC
H01L2224/13318

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/13318Zinc [Zn] as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Conductive particle, and connection material, connection structure,...
- Patent number 10,412,838
- Issue date Sep 10, 2019
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Arata Kishi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive connecting member and manufacturing method of same
- Patent number 10,177,079
- Issue date Jan 8, 2019
- Furukawa Electric Co., Ltd.
- Hideo Nishikubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing metal ball, joining material, and metal ball
- Patent number 10,150,185
- Issue date Dec 11, 2018
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for forming pillar bumps on semiconductor wafers
- Patent number 9,831,201
- Issue date Nov 28, 2017
- Guy F. Burgess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component-mounted structure, IC card and COF package
- Patent number 9,516,749
- Issue date Dec 6, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yoshiyuki Wada
- G02 - OPTICS
Information Patent Grant
Package on package structure and method of manufacturing the same
- Patent number 9,230,935
- Issue date Jan 5, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Cheng Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and manufacturing method for the same
- Patent number 7,871,917
- Issue date Jan 18, 2011
- Fujitsu Semiconductor Limited
- Joji Fujimori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, mounting circuit board, method of producing t...
- Patent number 6,909,180
- Issue date Jun 21, 2005
- Matsushita Electric Industrial Co., Ltd.
- Masahiro Ono
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CONDUCTIVE PARTICLE, AND CONNECTION MATERIAL, CONNECTION STRUCTURE,...
- Publication number 20170347463
- Publication date Nov 30, 2017
- Panasonic Intellectual Property Management Co., Ltd.
- ARATA KISHI
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
CHIP ARRANGEMENT, CHIP CARD ARRANGEMENT AND METHOD FOR MANUFACTURIN...
- Publication number 20140328032
- Publication date Nov 6, 2014
- INFINEON TECHNOLOGIES AG
- Frank Pueschner
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PACKAGE ON PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140159233
- Publication date Jun 12, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE CONNECTING MEMBER AND MANUFACTURING METHOD OF SAME
- Publication number 20130001775
- Publication date Jan 3, 2013
- Hideo Nishikubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method for the same
- Publication number 20070197016
- Publication date Aug 23, 2007
- FUJITSU LIMITED
- Joji Fujimori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit substrate for packaging semiconductor device, method for pr...
- Publication number 20050163982
- Publication date Jul 28, 2005
- Masahiro Ono
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device, mounting circuit board, method of producing t...
- Publication number 20030049425
- Publication date Mar 13, 2003
- Masahiro Ono
- H01 - BASIC ELECTRIC ELEMENTS

Zinc [Zn] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Conductive particle, and connection material, connection structure,...

Conductive connecting member and manufacturing method of same

Method for producing metal ball, joining material, and metal ball

Methods for forming pillar bumps on semiconductor wafers

Electronic component-mounted structure, IC card and COF package

Package on package structure and method of manufacturing the same

Semiconductor device and manufacturing method for the same

Semiconductor device, mounting circuit board, method of producing t...

Patents Applicationslast 30 patents

CONDUCTIVE PARTICLE, AND CONNECTION MATERIAL, CONNECTION STRUCTURE,...

CHIP ARRANGEMENT, CHIP CARD ARRANGEMENT AND METHOD FOR MANUFACTURIN...

PACKAGE ON PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

CONDUCTIVE CONNECTING MEMBER AND MANUFACTURING METHOD OF SAME

Semiconductor device and manufacturing method for the same

Circuit substrate for packaging semiconductor device, method for pr...

Semiconductor device, mounting circuit board, method of producing t...