Zirconium [Zr] as principal constituent

Industry

CPC
H01L2224/2927

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/2927Zirconium [Zr] as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Metal paste for joints, assembly, production method for assembly, s...
- Patent number 11,462,502
- Issue date Oct 4, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Yuki Kawana
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Solder material for semiconductor device
- Patent number 11,145,615
- Issue date Oct 12, 2021
- Fuji Electric Co., Ltd.
- Hirohiko Watanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sintering pastes with high metal loading for semiconductor die atta...
- Patent number 10,727,193
- Issue date Jul 28, 2020
- Ormet Circuits, Inc.
- Catherine Shearer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder material for semiconductor device
- Patent number 10,727,194
- Issue date Jul 28, 2020
- Fuji Electric Co., Ltd.
- Hirohiko Watanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Preform structure for soldering a semiconductor chip arrangement, a...
- Patent number 9,536,851
- Issue date Jan 3, 2017
- Infineon Technologies AG
- Friedrich Kroener
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SOLDER MATERIAL FOR SEMICONDUCTOR DEVICE
- Publication number 20210407953
- Publication date Dec 30, 2021
- Fuji Electric Co., Ltd.
- Hirohiko WATANABE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER MATERIAL FOR SEMICONDUCTOR DEVICE
- Publication number 20200303337
- Publication date Sep 24, 2020
- Fuji Electric Co., Ltd.
- Hirohiko WATANABE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL PASTE FOR JOINTS, ASSEMBLY, PRODUCTION METHOD FOR ASSEMBLY, S...
- Publication number 20200075528
- Publication date Mar 5, 2020
- Hitachi Chemical Company, Ltd.
- Yuki KAWANA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
CONDUCTIVE JOINING MATERIAL AND CONDUCTIVE JOINING STRUCTURE WHICH...
- Publication number 20180033760
- Publication date Feb 1, 2018
- NIPPON STEEL & SUMITOMO METAL CORPORATION
- Shinji ISHIKAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER MATERIAL FOR SEMICONDUCTOR DEVICE
- Publication number 20180033761
- Publication date Feb 1, 2018
- Fuji Electric Co., Ltd.
- Hirohiko WATANABE
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
PREFORM STRUCTURE FOR SOLDERING A SEMICONDUCTOR CHIP ARRANGEMENT, A...
- Publication number 20170084567
- Publication date Mar 23, 2017
- INFINEON TECHNOLOGIES AG
- Friedrich Kroener
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Zirconium [Zr] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Metal paste for joints, assembly, production method for assembly, s...

Solder material for semiconductor device

Sintering pastes with high metal loading for semiconductor die atta...

Solder material for semiconductor device

Preform structure for soldering a semiconductor chip arrangement, a...

Patents Applicationslast 30 patents

SOLDER MATERIAL FOR SEMICONDUCTOR DEVICE

SOLDER MATERIAL FOR SEMICONDUCTOR DEVICE

METAL PASTE FOR JOINTS, ASSEMBLY, PRODUCTION METHOD FOR ASSEMBLY, S...

CONDUCTIVE JOINING MATERIAL AND CONDUCTIVE JOINING STRUCTURE WHICH...

SOLDER MATERIAL FOR SEMICONDUCTOR DEVICE

PREFORM STRUCTURE FOR SOLDERING A SEMICONDUCTOR CHIP ARRANGEMENT, A...