Zirconium (Zr) as principal constituent

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H01L2224/4517

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/4517Zirconium (Zr) as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and inspection device
- Patent number 12,040,303
- Issue date Jul 16, 2024
- Kabushiki Kaisha Toshiba
- Mitsuaki Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ag alloy bonding wire for semiconductor device
- Patent number 11,612,966
- Issue date Mar 28, 2023
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tetsuya Oyamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 11,373,934
- Issue date Jun 28, 2022
- Nippon Micrometal Corporation
- Daizo Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor devices
- Patent number 11,342,299
- Issue date May 24, 2022
- Nippon Micrometal Corporation
- Daizo Oda
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,737,356
- Issue date Aug 11, 2020
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,610,976
- Issue date Apr 7, 2020
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cryogenic electronic packages and assemblies
- Patent number 10,586,909
- Issue date Mar 10, 2020
- Massachusetts Institute of Technology
- Rabindra N. Das
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,525,555
- Issue date Jan 7, 2020
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,414,002
- Issue date Sep 17, 2019
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Silver bonding wire for semiconductor device containing indium, gal...
- Patent number 10,381,320
- Issue date Aug 13, 2019
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tetsuya Oyamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting apparatus
- Patent number 10,374,136
- Issue date Aug 6, 2019
- Nichia Corporation
- Ryohei Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,137,534
- Issue date Nov 27, 2018
- Nippon Micrometal Corporation
- Takashi Yamada
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Light emitting device mount, leadframe, and light emitting apparatus
- Patent number 10,115,876
- Issue date Oct 30, 2018
- Nichia Corporation
- Ryohei Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device mount, leadframe, and light emitting apparatus
- Patent number 9,583,688
- Issue date Feb 28, 2017
- Nichia Corporation
- Ryohei Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Segmented bond pads and methods of fabrication thereof
- Patent number 9,543,260
- Issue date Jan 10, 2017
- Infineon Technologies AG
- Albert Birner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack-type semiconductor package
- Patent number 9,299,631
- Issue date Mar 29, 2016
- Samsung Electronics Co., Ltd.
- Ae-Nee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack type semiconductor package
- Patent number 9,171,827
- Issue date Oct 27, 2015
- Samsung Electronics Co., Ltd.
- Jin-Ho Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Nano memory, light, energy, antenna and strand-based systems and me...
- Patent number 9,117,550
- Issue date Aug 25, 2015
- Bao Q. Tran
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Apparatus with a multi-layer coating and method of forming the same
- Patent number 9,055,700
- Issue date Jun 9, 2015
- Semblant Limited
- Mark Robson Humphries
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package apparatus
- Patent number 8,653,640
- Issue date Feb 18, 2014
- Samsung Electronics Co., Ltd.
- Tae-hun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post passivation structure for a semiconductor device and packaging...
- Patent number 8,558,383
- Issue date Oct 15, 2013
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 7,952,028
- Issue date May 31, 2011
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic flame-off electrode with ball-shaped tip
- Patent number 7,795,557
- Issue date Sep 14, 2010
- Kulicke and Soffa Industries, Inc.
- Jon Brunner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Nano memory, light, energy, antenna and strand-based systems and me...
- Patent number 7,671,398
- Issue date Mar 2, 2010
- Bao Q. Tran
- G11 - INFORMATION STORAGE
Information Patent Grant
Circuitry component and method for forming the same
- Patent number 7,582,556
- Issue date Sep 1, 2009
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post passivation structure for a semiconductor device and packaging...
- Patent number 7,468,545
- Issue date Dec 23, 2008
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip structure with redistribution traces
- Patent number 7,425,767
- Issue date Sep 16, 2008
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic flame-off electrode with ball-shaped tip
- Patent number 7,411,157
- Issue date Aug 12, 2008
- Kulicke and Soffa Industries, Inc.
- Jon Brunner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
NANO IC packaging
- Patent number 7,375,417
- Issue date May 20, 2008
- Bao Tran
- G11 - INFORMATION STORAGE
Information Patent Grant
Iridium oxide nanowires and method for forming same
- Patent number 7,255,745
- Issue date Aug 14, 2007
- Sharp Laboratories of America, Inc.
- Fengyan Zhang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240347499
- Publication date Oct 17, 2024
- Samsung Electronics Co., Ltd.
- Hongjin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALUMINUM BONDING WIRE FOR POWER SEMICONDUCTOR
- Publication number 20240105667
- Publication date Mar 28, 2024
- TANAKA DENSHI KOGYO K.K.
- Shuichi MITOMA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240023346
- Publication date Jan 18, 2024
- Samsung Electronics Co., Ltd.
- Younghun CHEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AL BONDING WIRE
- Publication number 20230142531
- Publication date May 11, 2023
- NIPPON MICROMETAL CORPORATION
- Takashi YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20230148306
- Publication date May 11, 2023
- NIPPON MICROMETAL CORPORATION
- Motoki ETO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER BONDING WIRE
- Publication number 20230105851
- Publication date Apr 6, 2023
- NIPPON MICROMETAL CORPORATION
- Tomohiro UNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20230018430
- Publication date Jan 19, 2023
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Ag ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20220266396
- Publication date Aug 25, 2022
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tetsuya OYAMADA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20220108971
- Publication date Apr 7, 2022
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SEMICONDUCTOR DEVICE AND INSPECTION DEVICE
- Publication number 20210296279
- Publication date Sep 23, 2021
- Kabushiki Kaisha Toshiba
- Mitsuaki KATO
- G01 - MEASURING TESTING
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20200373226
- Publication date Nov 26, 2020
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High-Reliability Copper Alloy Bonding Wire for Electronic Packaging...
- Publication number 20200373272
- Publication date Nov 26, 2020
- SOUTH CHINA UNIVERSITY OF TECHNOLOGY
- Bin Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20200312808
- Publication date Oct 1, 2020
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT EMITTING APPARATUS
- Publication number 20190027667
- Publication date Jan 24, 2019
- Nichia Corporation.
- Ryohei YAMASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20180374816
- Publication date Dec 27, 2018
- Nippon Micrometal Corporation
- Daizo ODA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20180133843
- Publication date May 17, 2018
- NIPPON MICROMETAL CORPORATION
- Takashi YAMADA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20170216974
- Publication date Aug 3, 2017
- NIPPON MICROMETAL CORPORATION
- Takashi YAMADA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20170110430
- Publication date Apr 20, 2017
- NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
- Tetsuya OYAMADA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
STACK TYPE SEMICONDUCTOR PACKAGE
- Publication number 20140291868
- Publication date Oct 2, 2014
- JIN-HO LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE MOUNT, LIGHT EMITTING APPARATUS INCLUDING THE...
- Publication number 20140264426
- Publication date Sep 18, 2014
- Nichia Corporation.
- Ryohei YAMASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE APPARATUS
- Publication number 20120306075
- Publication date Dec 6, 2012
- TAE-HUN KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS TO COOL SEMICONDUCTOR
- Publication number 20120299175
- Publication date Nov 29, 2012
- Bao Tran
- G11 - INFORMATION STORAGE
Information Patent Application
Apparatus with a Multi-Layer Coating and Method of Forming the Same
- Publication number 20110253429
- Publication date Oct 20, 2011
- Semblant Global Limited
- Mark Robson Humphries
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20100282495
- Publication date Nov 11, 2010
- NIPPON STEEL MATERIALS CO., LTD
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
NANO MEMORY, LIGHT, ENERGY, ANTENNA AND STRAND-BASED SYSTEMS AND ME...
- Publication number 20100155692
- Publication date Jun 24, 2010
- Bao Q. Tran
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR LIGHT EMITTING DEVICE
- Publication number 20090309115
- Publication date Dec 17, 2009
- Sanken Electric Co., Ltd
- Masanori HOSHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUITRY COMPONENT AND METHOD FOR FORMING THE SAME
- Publication number 20090309224
- Publication date Dec 17, 2009
- MEGICA CORPPORATION
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POST PASSIVATION STRUCTURE FOR A SEMICONDUCTOR DEVICE AND PACKAGING...
- Publication number 20090057895
- Publication date Mar 5, 2009
- MEGICA CORPORATION
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC FLAME-OFF ELECTRODE WITH BALL-SHAPED TIP
- Publication number 20080264907
- Publication date Oct 30, 2008
- KULICKE AND SOFFA INDUSTRIES, INC.
- Jon Brunner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP STRUCTURE WITH REDISTRIBUTION TRACES
- Publication number 20080012132
- Publication date Jan 17, 2008
- MEGICA CORPORATION
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS

Zirconium (Zr) as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and inspection device

Ag alloy bonding wire for semiconductor device

Bonding wire for semiconductor device

Bonding wire for semiconductor devices

Bonding wire for semiconductor device

Bonding wire for semiconductor device

Cryogenic electronic packages and assemblies

Bonding wire for semiconductor device

Bonding wire for semiconductor device

Silver bonding wire for semiconductor device containing indium, gal...

Light emitting apparatus

Bonding wire for semiconductor device

Light emitting device mount, leadframe, and light emitting apparatus

Light emitting device mount, leadframe, and light emitting apparatus

Segmented bond pads and methods of fabrication thereof

Stack-type semiconductor package

Stack type semiconductor package

Nano memory, light, energy, antenna and strand-based systems and me...

Apparatus with a multi-layer coating and method of forming the same

Semiconductor package apparatus

Post passivation structure for a semiconductor device and packaging...

Bonding wire for semiconductor device

Electronic flame-off electrode with ball-shaped tip

Nano memory, light, energy, antenna and strand-based systems and me...

Circuitry component and method for forming the same

Post passivation structure for a semiconductor device and packaging...

Chip structure with redistribution traces

Electronic flame-off electrode with ball-shaped tip

NANO IC packaging

Iridium oxide nanowires and method for forming same

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

ALUMINUM BONDING WIRE FOR POWER SEMICONDUCTOR

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

AL BONDING WIRE

BONDING WIRE FOR SEMICONDUCTOR DEVICES

COPPER BONDING WIRE

COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICES

Ag ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE

BONDING WIRE FOR SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE AND INSPECTION DEVICE

BONDING WIRE FOR SEMICONDUCTOR DEVICE

High-Reliability Copper Alloy Bonding Wire for Electronic Packaging...

COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICES

LIGHT EMITTING APPARATUS

BONDING WIRE FOR SEMICONDUCTOR DEVICES

BONDING WIRE FOR SEMICONDUCTOR DEVICE

BONDING WIRE FOR SEMICONDUCTOR DEVICE

BONDING WIRE FOR SEMICONDUCTOR DEVICE

STACK TYPE SEMICONDUCTOR PACKAGE

LIGHT EMITTING DEVICE MOUNT, LIGHT EMITTING APPARATUS INCLUDING THE...

SEMICONDUCTOR PACKAGE APPARATUS

SYSTEMS AND METHODS TO COOL SEMICONDUCTOR

Apparatus with a Multi-Layer Coating and Method of Forming the Same

BONDING WIRE FOR SEMICONDUCTOR DEVICE

NANO MEMORY, LIGHT, ENERGY, ANTENNA AND STRAND-BASED SYSTEMS AND ME...

SEMICONDUCTOR LIGHT EMITTING DEVICE

CIRCUITRY COMPONENT AND METHOD FOR FORMING THE SAME

POST PASSIVATION STRUCTURE FOR A SEMICONDUCTOR DEVICE AND PACKAGING...

ELECTRONIC FLAME-OFF ELECTRODE WITH BALL-SHAPED TIP

CHIP STRUCTURE WITH REDISTRIBUTION TRACES