ZrO2

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CPC
H01L2924/05342

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/05342ZrO2

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 12,148,716
- Issue date Nov 19, 2024
- Kioxia Corporation
- Takuya Konno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical bonding method, package-type electronic component, and hyb...
- Patent number 11,916,038
- Issue date Feb 27, 2024
- Canon Anelva Corporation
- Takayuki Saitoh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Dry etch process landing on metal oxide etch stop layer over metal...
- Patent number 11,195,725
- Issue date Dec 7, 2021
- Texas Instruments Incorporated
- Sebastian Meier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protrusion bump pads for bond-on-trace processing
- Patent number 10,804,192
- Issue date Oct 13, 2020
- Taiwan Semiconductor Manufacturing Company
- Yu-Min Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of manufacturing the same
- Patent number 10,777,522
- Issue date Sep 15, 2020
- NANYA TECHNOLOGY CORPORATION
- Chih-Ching Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dry etch process landing on metal oxide etch stop layer over metal...
- Patent number 10,707,089
- Issue date Jul 7, 2020
- Texas Instruments Incorporated
- Sebastian Meier
- G01 - MEASURING TESTING
Information Patent Grant
Composition for anisotropic conductive film, anisotropic conductive...
- Patent number 10,224,303
- Issue date Mar 5, 2019
- Samsung SDI Co., Ltd.
- Youn Jo Ko
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Protrusion bump pads for bond-on-trace processing
- Patent number 10,163,774
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company
- Yu-Min Liang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding interface layer
- Patent number 10,079,471
- Issue date Sep 18, 2018
- Hewlett Packard Enterprise Development LP
- Xue Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module and fabrication method for the same
- Patent number 9,773,720
- Issue date Sep 26, 2017
- Rohm Co., Ltd.
- Katsuhiko Yoshihara
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BONDING METHOD
- Publication number 20240321820
- Publication date Sep 26, 2024
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Mark SCANNELL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-DENSIFYING NANO-SILVER PASTE AND A METHOD OF FORMING INTERCONN...
- Publication number 20230230950
- Publication date Jul 20, 2023
- NANO AND ADVANCED MATERIALS INSTITUTE LIMITED
- Yuechen WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230062835
- Publication date Mar 2, 2023
- KIOXIA Corporation
- Takuya KONNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL BONDING METHOD, PACKAGE-TYPE ELECTRONIC COMPONENT, AND HYB...
- Publication number 20230051810
- Publication date Feb 16, 2023
- Canon ANELVA Corporation
- Takayuki SAITOH
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DRY ETCH PROCESS LANDING ON METAL OXIDE ETCH STOP LAYER OVER METAL...
- Publication number 20200303202
- Publication date Sep 24, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Sebastian Meier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200211991
- Publication date Jul 2, 2020
- NANYA TECHNOLOGY CORPORATION
- Chih-Ching LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRY ETCH PROCESS LANDING ON METAL OXIDE ETCH STOP LAYER OVER METAL...
- Publication number 20190304796
- Publication date Oct 3, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Sebastian Meier
- G01 - MEASURING TESTING
Information Patent Application
Protrusion Bump Pads for Bond-on-Trace Processing
- Publication number 20190122976
- Publication date Apr 25, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Min Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING INTERFACE LAYER
- Publication number 20180013260
- Publication date Jan 11, 2018
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Xue Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITION FOR ANISOTROPIC CONDUCTIVE FILM, ANISOTROPIC CONDUCTIVE...
- Publication number 20170162531
- Publication date Jun 8, 2017
- Samsung SDI Co., Ltd.
- Youn Jo KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND FABRICATION METHOD FOR THE SAME
- Publication number 20160218050
- Publication date Jul 28, 2016
- Katsuhiko YOSHIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Protrusion Bump Pads for Bond-on-Trace Processing
- Publication number 20160155697
- Publication date Jun 2, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Min Liang
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Chemical bonding method, package-type electronic component, and hyb...

Dry etch process landing on metal oxide etch stop layer over metal...

Protrusion bump pads for bond-on-trace processing

Semiconductor structure and method of manufacturing the same

Dry etch process landing on metal oxide etch stop layer over metal...

Composition for anisotropic conductive film, anisotropic conductive...

Protrusion bump pads for bond-on-trace processing

Bonding interface layer

Power module and fabrication method for the same

Patents Applicationslast 30 patents

BONDING METHOD

SELF-DENSIFYING NANO-SILVER PASTE AND A METHOD OF FORMING INTERCONN...

SEMICONDUCTOR DEVICE

CHEMICAL BONDING METHOD, PACKAGE-TYPE ELECTRONIC COMPONENT, AND HYB...

DRY ETCH PROCESS LANDING ON METAL OXIDE ETCH STOP LAYER OVER METAL...

SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME

DRY ETCH PROCESS LANDING ON METAL OXIDE ETCH STOP LAYER OVER METAL...

Protrusion Bump Pads for Bond-on-Trace Processing

BONDING INTERFACE LAYER

COMPOSITION FOR ANISOTROPIC CONDUCTIVE FILM, ANISOTROPIC CONDUCTIVE...

POWER MODULE AND FABRICATION METHOD FOR THE SAME

Protrusion Bump Pads for Bond-on-Trace Processing