2740097

Information

• Patent Grant
• 2740097

• References
• Source

• Patent Number

  2,740,097

• Date Filed

  Not available

• Date Issued

  Tuesday, March 27, 1956
  68 years ago

• CPC

  • H05K1/148 - Arrangements of two or more hingeably connected rigid printed circuit boards
  • H01R9/096 - Connections between two or more printed circuits
  • H05K3/3447 - Lead-in-hole components
  • H05K2201/10757 - Bent leads
  • H05K2201/10765 - Leads folded back
  • H05K2201/10924 - Leads formed from a punched metal foil

• US Classifications

  • 439 - Electrical connectors
  • 361 - Electricity: electrical systems and devices