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Leads formed from a punched metal foil

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  • CPC
  • H05K2201/10924
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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

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H05K2201/10924Leads formed from a punched metal foil
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    WIRING SUBSTRATE
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    • Publication date Jun 26, 2014
    • YAZAKI CORPORATION
    • Mamoru SAWAI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MOLD MODULE UTILIZED AS POWER UNIT OF ELECTRIC POWER STEERING APPAR...
    • Publication number 20140151146
    • Publication date Jun 5, 2014
    • MITSUBISHI ELECTRIC CORPORATION
    • Daisuke Tanaka
    • B62 - LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
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    ELECTRONIC SYSTEM WITH A COMPOSITE SUBSTRATE
    • Publication number 20130328181
    • Publication date Dec 12, 2013
    • Han-Hsiang Lee
    • H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • Information Patent Application

    Planar Contact with Solder
    • Publication number 20130283608
    • Publication date Oct 31, 2013
    • Jack Seidler
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC PACKAGE STRUCTURE
    • Publication number 20130141886
    • Publication date Jun 6, 2013
    • CYNTEC CO., LTD.
    • Da-Jung Chen
    • H01 - BASIC ELECTRIC ELEMENTS
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    CIRCUIT ARRANGEMENT AND ASSOCIATED CONTROLLER FOR A MOTOR VEHICLE
    • Publication number 20130069427
    • Publication date Mar 21, 2013
    • ROBERT BOSCH GmbH
    • Jens Nowotnick
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CIRCUIT ARRANGEMENT AND ASSOCIATED CONTROLLER FOR A MOTOR VEHICLE
    • Publication number 20130010442
    • Publication date Jan 10, 2013
    • ROBERT BOSCH GmbH
    • Michael Heim
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    RESIN-SEALED ELECTRONIC CONTROLLER AND METHOD OF FABRICATING THE SAME
    • Publication number 20120300404
    • Publication date Nov 29, 2012
    • Mitsubishi Electric Corporation
    • Fumiaki ARIMAI
    • H01 - BASIC ELECTRIC ELEMENTS
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    POWER-SUPPLY MODULE
    • Publication number 20120262145
    • Publication date Oct 18, 2012
    • CYNTEC CO., LTD.
    • Da-Jung Chen
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    ELECTRONIC PACKAGE STRUCTURE
    • Publication number 20120236519
    • Publication date Sep 20, 2012
    • CYNTEC CO., LTD.
    • Da-Jung Chen
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20120120610
    • Publication date May 17, 2012
    • DENSO CORPORATION
    • Mitsuhiro SAITOU
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD OF MANUFACTURING BLOCK MODULE
    • Publication number 20120084977
    • Publication date Apr 12, 2012
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Seung Wook PARK
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC PACKAGE STRUCTURE
    • Publication number 20120075808
    • Publication date Mar 29, 2012
    • Han-Hsiang LEE
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CONDUCTOR GRID FOR ELECTRONIC HOUSINGS AND MANUFACTURING METHOD
    • Publication number 20120018187
    • Publication date Jan 26, 2012
    • Tyco Electronics AMP GmbH
    • Lorenz Berchtold
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC PACKAGE STRUCTURE
    • Publication number 20120014079
    • Publication date Jan 19, 2012
    • CYNTEC CO. LTD.
    • Da-Jung CHEN
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE
    • Publication number 20110290535
    • Publication date Dec 1, 2011
    • YAZAKI CORPORATION
    • Mamoru Sawai
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC SYSTEM WITH A COMPOSITE SUBSTRATE
    • Publication number 20110199746
    • Publication date Aug 18, 2011
    • CYNTEC CO. LTD.
    • Han-Hsiang LEE
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC ASSEMBLY AND METHOD FOR ITS MANUFACTURE
    • Publication number 20110182048
    • Publication date Jul 28, 2011
    • Walter Roethlingshoefer
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LIGHT-EMITTING DIODE PACKAGE STRUCTURE AND MANUFACTURING METHOD THE...
    • Publication number 20110101393
    • Publication date May 5, 2011
    • EVERLIGHT ELECTRONICS CO., LTD.
    • Chin-Yuan Hsu
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC PACKAGE STRUCTURE
    • Publication number 20110090648
    • Publication date Apr 21, 2011
    • CYNTEC CO., LTD.
    • Da-Jung Chen
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    INTEGRATION OF SMD COMPONENTS IN AN IC HOUSING
    • Publication number 20110068460
    • Publication date Mar 24, 2011
    • Felix SCHINNER
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    Semiconductor device
    • Publication number 20110044009
    • Publication date Feb 24, 2011
    • DENSO CORPORATION
    • Yutaka Fukuda
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Method and Apparatus for Vertical Stacking of Integrated Circuit Chips
    • Publication number 20100289130
    • Publication date Nov 18, 2010
    • Interconnect Portfolio LLC
    • Joseph C. Fjelstad
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    PLANAR CONTACT WITH SOLDER
    • Publication number 20100236815
    • Publication date Sep 23, 2010
    • Interplex Industries, Inc.
    • Jack Seidler
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LIGHTING DEVICE AND METHOD FOR MAKING THE SAME
    • Publication number 20100181890
    • Publication date Jul 22, 2010
    • BRIGHT LED ELECTRONICS CORP.
    • Ching-Lin Tseng
    • F21 - LIGHTING
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    SURFACE MOUNTING COMPONENT
    • Publication number 20100172114
    • Publication date Jul 8, 2010
    • Sumida Corporation
    • Tsuyoshi Sato
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    ELECTRONIC MODULE AND METHOD FOR MANUFACTURING AN ELECTRONIC MODULE
    • Publication number 20100170706
    • Publication date Jul 8, 2010
    • Peter Kimmich
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC PACKAGE STRUCTURE
    • Publication number 20090207574
    • Publication date Aug 20, 2009
    • CYNTEC CO., LTD.
    • Da-Jung Chen
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20090190320
    • Publication date Jul 30, 2009
    • RENESAS TECHNOLOGY CORP.
    • ICHIO SHIMIZU
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    Cable termination methods and apparatus
    • Publication number 20090158584
    • Publication date Jun 25, 2009
    • Apple Inc.
    • Christopher D. Prest
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR