Leads folded back

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CPC
H05K2201/10765

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/10765Leads folded back

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Three-dimensional stack of leaded package and electronic member
- Patent number 9,698,083
- Issue date Jul 4, 2017
- Infineon Technologies AG
- Alfred Swain Hong Yeo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with terminal pins with lateral reversal point and laterall...
- Patent number 9,293,400
- Issue date Mar 22, 2016
- Infineon Technologies AG
- Sergey Ananiev
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat conduction board and mounting method of electronic components
- Patent number 8,278,750
- Issue date Oct 2, 2012
- NEC Access Technica, Ltd.
- Hideki Akahori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light source unit, backlight unit and liquid crystal display includ...
- Patent number 7,766,499
- Issue date Aug 3, 2010
- Samsung Electronics Co., Ltd.
- Jin Hee Park
- F21 - LIGHTING
Information Patent Grant
Method and system for attachment of light emitting diodes to circui...
- Patent number 7,677,763
- Issue date Mar 16, 2010
- Timothy Chan
- F21 - LIGHTING
Information Patent Grant
Press-fit fixing terminal, and electronic component having the same...
- Patent number 7,210,969
- Issue date May 1, 2007
- Matsushita Electric Industrial Co., Ltd.
- Yukio Hashimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component lead system
- Patent number 7,045,720
- Issue date May 16, 2006
- Intel Corporation
- Clement Sagayanathan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface mount package for long lead devices
- Patent number 6,423,906
- Issue date Jul 23, 2002
- Youngtek Electronics Corp.
- Bily Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Procedure for soldering an insulated wire
- Patent number 5,695,110
- Issue date Dec 9, 1997
- Temic Telefunken Microelectronic GmbH
- Klaus Schirmer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film IC with connection terminals
- Patent number 5,635,758
- Issue date Jun 3, 1997
- Siemens Aktiengesellschaft
- Karl-Gerd Drekmeier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Unitary capacitance trimmer
- Patent number 4,897,624
- Issue date Jan 30, 1990
- Thomson Consumer Electronics, Inc.
- Leroy S. Wignot
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Injection molded circuit housing
- Patent number 4,766,520
- Issue date Aug 23, 1988
- Capsonic Group, Inc.
- Duane Huber
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multiconductor electrical cable terminations and methods and appara...
- Patent number 4,753,005
- Issue date Jun 28, 1988
- E. I. Du Pont de Nemours and Company
- Alexander W. Hasircoglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiconductor electrical cable terminations and methods and appara...
- Patent number 4,679,868
- Issue date Jul 14, 1987
- E. I. Du Pont de Nemours and Company
- Alexander W. Hasircoglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for forming electrical leads for retention in...
- Patent number 4,249,582
- Issue date Feb 10, 1981
- Zenith Radio Corporation
- Joseph M. Jacobs
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
3806770
- Patent number 3,806,770
- Issue date Apr 23, 1974
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3747045
- Patent number 3,747,045
- Issue date Jul 17, 1973
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3693052
- Patent number 3,693,052
- Issue date Sep 19, 1972
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
3634601
- Patent number 3,634,601
- Issue date Jan 11, 1972
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3601787
- Patent number 3,601,787
- Issue date Aug 24, 1971
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3437882
- Patent number 3,437,882
- Issue date Apr 8, 1969
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3327284
- Patent number 3,327,284
- Issue date Jun 20, 1967
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3290637
- Patent number 3,290,637
- Issue date Dec 6, 1966
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
3184699
- Patent number 3,184,699
- Issue date May 18, 1965
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
2902629
- Patent number 2,902,629
- Issue date Sep 1, 1959
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
2740097
- Patent number 2,740,097
- Issue date Mar 27, 1956
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Three-dimensional stack of leaded package and electronic member
- Publication number 20150348882
- Publication date Dec 3, 2015
- INFINEON TECHNOLOGIES AG
- Alfred Swain Hong YEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Assembly and Module
- Publication number 20140252583
- Publication date Sep 11, 2014
- INFINEON TECHNOLOGIES AG
- Andrea Carletti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Discrete-Pin Printed-Circuit Mounting with Notches
- Publication number 20140160681
- Publication date Jun 12, 2014
- Wintec Industries, Inc.
- Kong-Chen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM PROVIDED WITH A SOLDER JOINT
- Publication number 20130264102
- Publication date Oct 10, 2013
- Tellabs Oy
- Antti HOLMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT ARRANGEMENT AND ASSOCIATED CONTROLLER FOR A MOTOR VEHICLE
- Publication number 20130069427
- Publication date Mar 21, 2013
- ROBERT BOSCH GmbH
- Jens Nowotnick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCED STRESS GULL WING SOLDER JOINTS FOR PRINTED WIRING BOARD CON...
- Publication number 20120298406
- Publication date Nov 29, 2012
- International Business Machines Corporation
- Wai Mon Ma
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL CONNECTION STRUCTURE AND LIGHT EMITTING DIODE MODULE, FA...
- Publication number 20120032224
- Publication date Feb 9, 2012
- KING'S METAL FIBER TECHNOLOGIES CO., LTD.
- Chih Chang Fang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT CONDUCTION BOARD AND MOUNTING METHOD OF ELECTRONIC COMPONENTS
- Publication number 20110116236
- Publication date May 19, 2011
- HIDEKI AKAHORI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Compression Connector
- Publication number 20090239396
- Publication date Sep 24, 2009
- Koon Poh Tay
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Light emitting module
- Publication number 20090200914
- Publication date Aug 13, 2009
- Bright View Electronics Co., Ltd.
- Gwo-Feng Hwang
- F21 - LIGHTING
Information Patent Application
LIGHT SOURCE UNIT, BACKLIGHT UNIT AND LIQUID CRYSTAL DISPLAY INCLUD...
- Publication number 20080106898
- Publication date May 8, 2008
- Samsung Electronics Co., Ltd.
- Jin Hee PARK
- G02 - OPTICS
Information Patent Application
Method of bonding flying leads
- Publication number 20070137025
- Publication date Jun 21, 2007
- FUJITSU LIMITED
- Takashi Kubota
- G11 - INFORMATION STORAGE
Information Patent Application
PRESS-FIT FIXING TERMINAL, AND ELECTRONIC COMPONENT HAVING THE SAME...
- Publication number 20070105456
- Publication date May 10, 2007
- Yukio Hashimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and system for attachment of light emitting diodes to circui...
- Publication number 20070025103
- Publication date Feb 1, 2007
- Timothy Chan
- F21 - LIGHTING
Information Patent Application
Method and system for attachment of light emmiting diodes to circui...
- Publication number 20060082315
- Publication date Apr 20, 2006
- Timothy Chan
- F21 - LIGHTING
Information Patent Application
Wire loop grid array package
- Publication number 20050133928
- Publication date Jun 23, 2005
- Gregory E. Howard
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Component lead system
- Publication number 20050061543
- Publication date Mar 24, 2005
- Clement Sagayanathan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Surface mount package for long lead devices
- Publication number 20020005296
- Publication date Jan 17, 2002
- Bily Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Leads folded back

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Three-dimensional stack of leaded package and electronic member

Package with terminal pins with lateral reversal point and laterall...

Heat conduction board and mounting method of electronic components

Light source unit, backlight unit and liquid crystal display includ...

Method and system for attachment of light emitting diodes to circui...

Press-fit fixing terminal, and electronic component having the same...

Component lead system

Surface mount package for long lead devices

Procedure for soldering an insulated wire

Film IC with connection terminals

Unitary capacitance trimmer

Injection molded circuit housing

Multiconductor electrical cable terminations and methods and appara...

Multiconductor electrical cable terminations and methods and appara...

Method and apparatus for forming electrical leads for retention in...

3806770

3747045

3693052

3634601

3601787

3437882

3327284

3290637

3184699

2902629

2740097

Patents Applicationslast 30 patents

Three-dimensional stack of leaded package and electronic member

Power Semiconductor Assembly and Module

Discrete-Pin Printed-Circuit Mounting with Notches

SYSTEM PROVIDED WITH A SOLDER JOINT

CIRCUIT ARRANGEMENT AND ASSOCIATED CONTROLLER FOR A MOTOR VEHICLE

REDUCED STRESS GULL WING SOLDER JOINTS FOR PRINTED WIRING BOARD CON...

ELECTRICAL CONNECTION STRUCTURE AND LIGHT EMITTING DIODE MODULE, FA...

HEAT CONDUCTION BOARD AND MOUNTING METHOD OF ELECTRONIC COMPONENTS

Compression Connector

Light emitting module

LIGHT SOURCE UNIT, BACKLIGHT UNIT AND LIQUID CRYSTAL DISPLAY INCLUD...

Method of bonding flying leads

PRESS-FIT FIXING TERMINAL, AND ELECTRONIC COMPONENT HAVING THE SAME...

Method and system for attachment of light emitting diodes to circui...

Method and system for attachment of light emmiting diodes to circui...

Wire loop grid array package

Component lead system

Surface mount package for long lead devices