2747254

Information

• Patent Grant
• 2747254

• References
• Source

• Patent Number

  2,747,254

• Date Filed

  Not available

• Date Issued

  Tuesday, May 29, 1956
  68 years ago

• CPC

  • H01L21/14 - Treatment of the complete device
  • H01L21/02425 - Conductive materials
  • H01L21/02521 - Materials
  • H01L21/02625 - using melted materials

• US Classifications

  • 438 - Semiconductor device manufacturing: process
  • 257 - Active solid-state devices