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2762116
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Information
Patent Grant
2762116
References
Source
Patent Number
2,762,116
Date Filed
Not available
Date Issued
Tuesday, September 11, 1956
67 years ago
CPC
H05K3/386 - by the use of an organic polymeric bonding layer
B32B15/08 - of synthetic resin
H01B1/00 - Conductors or conductive bodies characterised by the conductive materials Selection of materials as conductors
H01B3/004 - with conductive additives or conductive layers
H05K3/382 - by special treatment of the metal
B29K2309/08 - Glass
H05K2201/015 - Fluoropolymer
H05K2201/0355 - Metal foils
H05K2201/0358 - Resin coated copper [RCC]
H05K2201/2063 - mixed adhesion layer containing metallic/inorganic and polymeric materials
Y10S228/903 - Metal to nonmetal
Y10S417/01 - Materials digest
US Classifications
156 - Adhesive bonding and miscellaneous chemical manufacture
052 - Static structures
174 - Electricity: conductors and insulators
228 - Metal fusion bonding
417 - Pumps
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