2963748

Information

• Patent Grant
• 2963748

• References
• Source

• Patent Number

  2,963,748

• Date Filed

  Not available

• Date Issued

  Tuesday, December 13, 1960
  64 years ago

• CPC

  • H05K3/386 - by the use of an organic polymeric bonding layer
  • H05K3/102 - by bonding of conductive powder
  • H05K2203/0108 - Male die used for patterning, punching or transferring
  • H05K2203/0557 - Non-printed masks
  • Y10S425/811 - Stencil

• US Classifications

  • 264 - Plastic and nonmetallic article shaping or treating: processes
  • 174 - Electricity: conductors and insulators
  • 419 - Powder metallurgy processes
  • 425 - Plastic article or earthenware shaping or treating: apparatus