2965962

Information

• Patent Grant
• 2965962

• References
• Source

• Patent Number

  2,965,962

• Date Filed

  Not available

• Date Issued

  Tuesday, December 27, 1960
  64 years ago

• CPC

  • H01J5/28 - between conductive parts of vessel
  • H01L23/041 - the container being a hollow construction having no base used as a mounting for the semiconductor body
  • H01L23/3157 - Partial encapsulation or coating
  • H01J2893/0044 - Direct connection between two metal elements, in particular via material a connecting material
  • H01L2924/0002 - Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
  • Y10S220/29 - Welded seam
  • Y10T29/49885 - with coating before or during assembling
  • Y10T29/49945 - by driven force fit

• US Classifications

  • 228 - Metal fusion bonding
  • 029 - Metal working
  • 220 - Receptacles
  • 257 - Active solid-state devices
  • 438 - Semiconductor device manufacturing: process