the container being a hollow construction having no base used as a mounting for the semiconductor body

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/041the container being a hollow construction having no base used as a mounting for the semiconductor body

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor apparatus
- Patent number 12,300,637
- Issue date May 13, 2025
- Mitsubishi Electric Corporation
- Ko Kanaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protector cap for package with thermal interface material
- Patent number 12,211,761
- Issue date Jan 28, 2025
- Infineon Technologies Austria AG
- Christian Kasztelan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,165,965
- Issue date Dec 10, 2024
- Kabushiki Kaisha Toshiba
- Tomohiro Iguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded chip package and manufacturing method thereof
- Patent number 12,148,676
- Issue date Nov 19, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit structure and electrical junction box
- Patent number 12,027,500
- Issue date Jul 2, 2024
- Autonetworks Technologies, Ltd.
- Akira Haraguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package with semiconductive thermal pedestal
- Patent number 12,021,003
- Issue date Jun 25, 2024
- Marvell Asia Pte, Ltd.
- Han Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,015,014
- Issue date Jun 18, 2024
- Samsung Electronics Co., Ltd.
- Doohwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor power module and power conversion device
- Patent number 11,916,001
- Issue date Feb 27, 2024
- Mitsubishi Electric Corporation
- Kozo Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including conductive crack preventing layer
- Patent number 11,862,581
- Issue date Jan 2, 2024
- Samsung Electronics Co., Ltd.
- Ji Eun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded chip package and manufacturing method thereof
- Patent number 11,854,920
- Issue date Dec 26, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,776,892
- Issue date Oct 3, 2023
- Kabushiki Kaisha Toshiba
- Tomohiro Iguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protector cap for package with thermal interface material
- Patent number 11,769,701
- Issue date Sep 26, 2023
- Infineon Technologies Austria AG
- Christian Kasztelan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetically sealed optically transparent wafer-level packages and...
- Patent number 11,764,117
- Issue date Sep 19, 2023
- Corning Incorporated
- Robert Alan Bellman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package structure and methods of manufacturing the same
- Patent number 11,658,170
- Issue date May 23, 2023
- Advanced Semiconductor Engineering, Inc.
- Wei Tsung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,587,841
- Issue date Feb 21, 2023
- Mitsubishi Electric Corporation
- Hiroyuki Masumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with elastic coupler and related methods
- Patent number 11,569,140
- Issue date Jan 31, 2023
- Semiconductor Components Industries, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising sealing frame configured as a condu...
- Patent number 11,569,142
- Issue date Jan 31, 2023
- Mitsubishi Electric Corporation
- Shinichi Miwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,538,727
- Issue date Dec 27, 2022
- Mitsubishi Electric Corporation
- Hiroyuki Masumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,417,612
- Issue date Aug 16, 2022
- Samsung Electronics Co., Ltd.
- Ji Eun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lens cap for a transistor outline package
- Patent number 11,367,692
- Issue date Jun 21, 2022
- Schott AG
- Robert Hettler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus and method for manufacturing same
- Patent number 11,348,849
- Issue date May 31, 2022
- Mitsubishi Electric Corporation
- Takeshi Hosomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and amplifier having bonding wire and conducti...
- Patent number 11,342,279
- Issue date May 24, 2022
- Sumitomo Electric Industries, Ltd.
- Ayumu Honda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,289,456
- Issue date Mar 29, 2022
- Samsung Electronics Co., Ltd.
- Doohwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding structure and substrate bonding method
- Patent number 11,244,874
- Issue date Feb 8, 2022
- Mitsubishi Electric Corporation
- Koichiro Nishizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state storage device
- Patent number 11,201,100
- Issue date Dec 14, 2021
- Global Unichip Corporation
- Yu-Ting Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Serially connected computing nodes in a distributed computing system
- Patent number 11,042,211
- Issue date Jun 22, 2021
- Louis Edmund Chall
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,037,845
- Issue date Jun 15, 2021
- Mitsubishi Electric Corporation
- Hiroyuki Masumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device and method of manufacturing the same, an...
- Patent number 11,037,844
- Issue date Jun 15, 2021
- Mitsubishi Electric Corporation
- Satoshi Kondo
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 10,978,371
- Issue date Apr 13, 2021
- Fuji Electric Co., Ltd.
- Kenshi Kai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 10,916,491
- Issue date Feb 9, 2021
- Fuji Electric Co., Ltd.
- Ryoichi Kato
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE HAVING INTEGRATED LID STRUCTURE AND METHOD THE...
- Publication number 20250157862
- Publication date May 15, 2025
- NXP B.V.
- Yu Ling Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL (3D) PACKAGES AND METHODS FOR 3D PACKAGING
- Publication number 20250125200
- Publication date Apr 17, 2025
- MURATA MANUFACTURING CO., LTD.
- Stephen John ALLEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE INCLUDING A HEAT DISSIPATION STRUCTURE AND METHOD...
- Publication number 20250118615
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jui Shen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE INCLUDING A PACKAGE LID HAVING A PLURALITY OF FIN...
- Publication number 20250096062
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Ping-Yin Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250096080
- Publication date Mar 20, 2025
- Fuji Electric Co., Ltd.
- Shun HARASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HERMETIC MICROELECTRONIC MODULE USING A SHEATH
- Publication number 20250087540
- Publication date Mar 13, 2025
- Peter C. Salmon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HOUSING, SEMICONDUCTOR MODULE INCLUDING A HOUSING, AND METHOD FOR A...
- Publication number 20250069964
- Publication date Feb 27, 2025
- INFINEON TECHNOLOGIES AG
- Marco Ludwig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HERMETIC PACKAGE DEVICE, AND DEVICE MODULE
- Publication number 20240387436
- Publication date Nov 21, 2024
- Mitsubishi Electric Corporation
- Yusuke YAMAGATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240347508
- Publication date Oct 17, 2024
- Samsung Electronics Co., Ltd.
- Jihyun Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE UTILIZING INJECTABLE CONDUCTIVE COMPONENT FOR DIRECT C...
- Publication number 20240332117
- Publication date Oct 3, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Changsun YUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240312959
- Publication date Sep 19, 2024
- Samsung Electronics Co., Ltd.
- Doohwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR PRODUCING THE SAME
- Publication number 20240234166
- Publication date Jul 11, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- LI-CHUN HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CAVITY CARRIER AND METHOD THEREFOR
- Publication number 20240234222
- Publication date Jul 11, 2024
- NXP B.V.
- Kuan-Hsiang Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A LID STRUCTURE WITH A COMPARTMENT
- Publication number 20240203820
- Publication date Jun 20, 2024
- QUALCOMM Incorporated
- Youmin YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURRENT SENSOR WITH INVERTED SHIELDING ELEMENT
- Publication number 20240145348
- Publication date May 2, 2024
- Littelfuse Semiconductor (Wuxi) Co., Ltd
- Lucas Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR PRODUCING THE SAME
- Publication number 20240136202
- Publication date Apr 25, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- LI-CHUN HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CAVITY CARRIER AND METHOD THEREFOR
- Publication number 20240136238
- Publication date Apr 25, 2024
- NXP B.V.
- Kuan-Hsiang Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240087972
- Publication date Mar 14, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPLATE STRUCTURE FOR QUASI-MONOLITHIC DIE ARCHITECTURES
- Publication number 20240063066
- Publication date Feb 22, 2024
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230395485
- Publication date Dec 7, 2023
- Kabushiki Kaisha Toshiba
- Tomohiro IGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Protector Cap for Package with Thermal Interface Material
- Publication number 20230395442
- Publication date Dec 7, 2023
- Infineon Technologies Austria AG
- Christian Kasztelan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS
- Publication number 20230253347
- Publication date Aug 10, 2023
- Mitsubishi Electric Corporation
- Ko KANAYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20230238297
- Publication date Jul 27, 2023
- JMJ Korea Co., Ltd.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND VEHICLE
- Publication number 20230223314
- Publication date Jul 13, 2023
- Fuji Electric Co., Ltd.
- Daiki YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP DEVICE
- Publication number 20230197562
- Publication date Jun 22, 2023
- Sunonwealth Electric Machine Industry Co., Ltd.
- Chi-Ting YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230145610
- Publication date May 11, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH SEMICONDUCTIVE THERMAL PEDESTAL
- Publication number 20230051507
- Publication date Feb 16, 2023
- Marvell Asia Pte, Ltd.
- Han Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220392853
- Publication date Dec 8, 2022
- Samsung Electronics Co., Ltd.
- Ji Eun PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20220359229
- Publication date Nov 10, 2022
- DENSO CORPORATION
- Tomohito IWASHIGE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHODS OF MANUFACTURING THE SAME
- Publication number 20220310576
- Publication date Sep 29, 2022
- Advanced Semiconductor Engineering, Inc.
- Wei Tsung CHEN
- H01 - BASIC ELECTRIC ELEMENTS

the container being a hollow construction having no base used as a mounting for the semiconductor body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor apparatus

Protector cap for package with thermal interface material

Semiconductor device

Embedded chip package and manufacturing method thereof

Circuit structure and electrical junction box

Semiconductor device package with semiconductive thermal pedestal

Semiconductor package

Semiconductor power module and power conversion device

Semiconductor package including conductive crack preventing layer

Embedded chip package and manufacturing method thereof

Semiconductor device

Protector cap for package with thermal interface material

Hermetically sealed optically transparent wafer-level packages and...

Semiconductor package structure and methods of manufacturing the same

Semiconductor module

Semiconductor package with elastic coupler and related methods

Semiconductor device comprising sealing frame configured as a condu...

Semiconductor module

Semiconductor package

Lens cap for a transistor outline package

Semiconductor apparatus and method for manufacturing same

Semiconductor device and amplifier having bonding wire and conducti...

Semiconductor package

Substrate bonding structure and substrate bonding method

Solid-state storage device

Serially connected computing nodes in a distributed computing system

Semiconductor device and manufacturing method thereof

Power semiconductor device and method of manufacturing the same, an...

Semiconductor device and method for manufacturing semiconductor device

Semiconductor module

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE HAVING INTEGRATED LID STRUCTURE AND METHOD THE...

THREE-DIMENSIONAL (3D) PACKAGES AND METHODS FOR 3D PACKAGING

PACKAGE STRUCTURE INCLUDING A HEAT DISSIPATION STRUCTURE AND METHOD...

PACKAGE STRUCTURE INCLUDING A PACKAGE LID HAVING A PLURALITY OF FIN...

SEMICONDUCTOR DEVICE

HERMETIC MICROELECTRONIC MODULE USING A SHEATH

HOUSING, SEMICONDUCTOR MODULE INCLUDING A HOUSING, AND METHOD FOR A...

HERMETIC PACKAGE DEVICE, AND DEVICE MODULE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

POWER MODULE UTILIZING INJECTABLE CONDUCTIVE COMPONENT FOR DIRECT C...

SEMICONDUCTOR PACKAGE

CHIP PACKAGE STRUCTURE AND METHOD FOR PRODUCING THE SAME

SEMICONDUCTOR DEVICE WITH CAVITY CARRIER AND METHOD THEREFOR

PACKAGE COMPRISING A LID STRUCTURE WITH A COMPARTMENT

CURRENT SENSOR WITH INVERTED SHIELDING ELEMENT

CHIP PACKAGE STRUCTURE AND METHOD FOR PRODUCING THE SAME

SEMICONDUCTOR DEVICE WITH CAVITY CARRIER AND METHOD THEREFOR

EMBEDDED CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

TEMPLATE STRUCTURE FOR QUASI-MONOLITHIC DIE ARCHITECTURES

SEMICONDUCTOR DEVICE

Protector Cap for Package with Thermal Interface Material

SEMICONDUCTOR APPARATUS

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR APPARATUS AND VEHICLE

CHIP DEVICE

EMBEDDED CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE PACKAGE WITH SEMICONDUCTIVE THERMAL PEDESTAL

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR PACKAGE STRUCTURE AND METHODS OF MANUFACTURING THE SAME