Partial encapsulation or coating

Industry

CPC
H01L23/3157

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/3157Partial encapsulation or coating

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with fin isolation
- Patent number 12,261,051
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chang-Yin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management in integrated circuit packages
- Patent number 12,261,097
- Issue date Mar 25, 2025
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded chip package with anchor structures
- Patent number 12,249,519
- Issue date Mar 11, 2025
- Advanced Micro Devices, Inc.
- Priyal Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low profile sensor packages
- Patent number 12,230,619
- Issue date Feb 18, 2025
- STMicroelectronics Pte Ltd
- Jing-En Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making a photonic semiconductor...
- Patent number 12,218,114
- Issue date Feb 4, 2025
- STATS ChipPAC Pte. Ltd.
- KyungOe Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 12,211,765
- Issue date Jan 28, 2025
- Advanced Semiconductor Engineering, Inc.
- Wei-Tung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming the same
- Patent number 12,205,888
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Continuous interconnects between heterogeneous materials
- Patent number 12,205,878
- Issue date Jan 21, 2025
- Liquid Wire Inc.
- Mark William Ronay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for producing the same
- Patent number 12,199,066
- Issue date Jan 14, 2025
- Kioxia Corporation
- Gen Toyota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-molded leadframes in semiconductor devices
- Patent number 12,191,273
- Issue date Jan 7, 2025
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframes in semiconductor devices
- Patent number 12,183,703
- Issue date Dec 31, 2024
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective underfill assembly and method therefor
- Patent number 12,183,595
- Issue date Dec 31, 2024
- NXP B.V.
- Leo van Gemert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,183,665
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- Myungsam Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming an electrical connection between an electronic c...
- Patent number 12,170,262
- Issue date Dec 17, 2024
- STMicroelectronics (Grenoble 2) SAS
- David Auchere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate, semiconductor device package and method of manufacturing...
- Patent number 12,165,963
- Issue date Dec 10, 2024
- Advanced Semiconductor Engineering, Inc.
- Cheng-Lin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a flip-chip package core substrate with build...
- Patent number 12,154,866
- Issue date Nov 26, 2024
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Pao-Hung Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-tier IC package including processor and high bandwidth memory
- Patent number 12,154,890
- Issue date Nov 26, 2024
- Huawei Technologies Co., Ltd.
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 12,142,560
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor having tubular walled sensing cavity
- Patent number 12,135,303
- Issue date Nov 5, 2024
- Texas Instruments Incorporated
- Christlyn Faith Arias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly of 2XD module using high density interconnect bridges
- Patent number 12,125,815
- Issue date Oct 22, 2024
- Intel Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packaging warpage control
- Patent number 12,125,716
- Issue date Oct 22, 2024
- NXP USA, INC.
- Zhiwei Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating the same die stack structure and semiconduct...
- Patent number 12,119,328
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a semiconductor device package
- Patent number 12,119,282
- Issue date Oct 15, 2024
- Advanced Semiconductor Engineering, Inc.
- Tun-Ching Pi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor structure
- Patent number 12,119,229
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yu-Hsiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices and methods of manufacturing electronic devices
- Patent number 12,119,319
- Issue date Oct 15, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Ki Yeul Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making the same
- Patent number 12,113,031
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Chieh Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating assemble substrate
- Patent number 12,114,427
- Issue date Oct 8, 2024
- Siliconware Precision Industries Co., Ltd.
- Lung-Yuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and fabrication method thereof
- Patent number 12,107,055
- Issue date Oct 1, 2024
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two-step decapsulation technique for semiconductor package having s...
- Patent number 12,106,973
- Issue date Oct 1, 2024
- Silicon Laboratories Inc.
- Erwin Hendarto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,100,635
- Issue date Sep 24, 2024
- Samsung Electronics Co., Ltd.
- Sanghoon Jung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE, SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING...
- Publication number 20250105122
- Publication date Mar 27, 2025
- Advanced Semiconductor Engineering, Inc.
- Cheng-Lin HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAIR-STEP CONFIGURATION FOR A SEMICONDUCTOR DIE OF AN INTEGRATED C...
- Publication number 20250096058
- Publication date Mar 20, 2025
- Western Digital Technologies, Inc.
- Huoliang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND METHOD OF FABRICATING THE SAME
- Publication number 20250096069
- Publication date Mar 20, 2025
- INFINEON TECHNOLOGIES AG
- Adrian Lis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ON FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME
- Publication number 20250087562
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- Narae Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming FOWLP with Pre-Molded Em...
- Publication number 20250087545
- Publication date Mar 13, 2025
- STATS ChipPAC Pte Ltd.
- Kai Chong Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REINFORCEMENT STRUCTURES FOR MULTI-DIE SEMICONDUCTOR PACKAGES AND M...
- Publication number 20250079334
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Yu Chen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING AN ELECTRICAL CONNECTION BETWEEN AN ELECTRONIC C...
- Publication number 20250070081
- Publication date Feb 27, 2025
- STMicroelectronics (Grenoble 2) SAS
- David Auchere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20250069962
- Publication date Feb 27, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Mun Gil Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20250062245
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250062281
- Publication date Feb 20, 2025
- ORIENT SEMICONDUCTOR ELECTRONICS, LIMITED
- Yueh-Ming Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING A CAVITY IN A REDISTRIBUTION LAYER OF AN IC PACKAGE TO REDU...
- Publication number 20250054934
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACAKGE AND METHOD FOR FORMING THE SAME
- Publication number 20250054925
- Publication date Feb 13, 2025
- STATS ChipPAC Pte Ltd.
- YongHyuk JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PACKAGE
- Publication number 20250046724
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Eunsu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20250046742
- Publication date Feb 6, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Ki Yeul YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDERFILL STRUCTURE, AND SEMICONDUCTOR CHIP CARRYING MODULE AND MET...
- Publication number 20250046666
- Publication date Feb 6, 2025
- ASTI GLOBAL INC., TAIWAN
- Chien-Shou Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH HYBRID ROUTING AND METHOD THEREFOR
- Publication number 20250038092
- Publication date Jan 30, 2025
- NXP USA, Inc.
- Chee Seng Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP
- Publication number 20250038143
- Publication date Jan 30, 2025
- Chipbond Technology Corporation
- Chun-Chia Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250029936
- Publication date Jan 23, 2025
- Samsung Electronics Co., Ltd.
- Jongwon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR HAVING TUBULAR WALLED SENSING CAVITY
- Publication number 20250020610
- Publication date Jan 16, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Christlyn Faith ARIAS
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250022812
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Hansung Ryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGING WARPAGE CONTROL
- Publication number 20250006511
- Publication date Jan 2, 2025
- NXP USA, Inc.
- Zhiwei Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPEN CAVITY SENSOR
- Publication number 20250006573
- Publication date Jan 2, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Maricel Fabia ESCAÑO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH CAVITY AND RELATED PACKAGING METHOD
- Publication number 20250006578
- Publication date Jan 2, 2025
- JCET GROUP CO., LTD.
- Jianghua Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING ARCHITECTURE INCLUDING COMPENSATION LAYERS FOR WAFER-SCAL...
- Publication number 20250006695
- Publication date Jan 2, 2025
- Intel Corporation
- Bhaskar Jyoti Krishnatreya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS
- Publication number 20240429119
- Publication date Dec 26, 2024
- Fuji Electric Co., Ltd.
- Shigeki SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240429200
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Jing Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE WITH REDISTRIBUTION LAYER PLATE FORMED VIA TEMPO...
- Publication number 20240421019
- Publication date Dec 19, 2024
- MICROCHIP TECHNOLOGY INCORPORATED
- Mankit Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240421125
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- SEUNGDUK BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Singulation Assisted Structures and Methods for Improving Bond...
- Publication number 20240421126
- Publication date Dec 19, 2024
- Apple Inc.
- Chi Nung Ni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20240413080
- Publication date Dec 12, 2024
- Fuji Electric Co., Ltd.
- Naoyuki OHSE
- H01 - BASIC ELECTRIC ELEMENTS

Partial encapsulation or coating

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device with fin isolation

Thermal management in integrated circuit packages

Molded chip package with anchor structures

Low profile sensor packages

Semiconductor device and method of making a photonic semiconductor...

Semiconductor device package

Semiconductor packages and methods of forming the same

Continuous interconnects between heterogeneous materials

Semiconductor device and method for producing the same

Pre-molded leadframes in semiconductor devices

Leadframes in semiconductor devices

Selective underfill assembly and method therefor

Semiconductor package

Method for forming an electrical connection between an electronic c...

Substrate, semiconductor device package and method of manufacturing...

Method of fabricating a flip-chip package core substrate with build...

Multi-tier IC package including processor and high bandwidth memory

Semiconductor packages and methods of forming same

Sensor having tubular walled sensing cavity

Assembly of 2XD module using high density interconnect bridges

Semiconductor device packaging warpage control

Methods of fabricating the same die stack structure and semiconduct...

Method of making a semiconductor device package

Method of manufacturing semiconductor structure

Electronic devices and methods of manufacturing electronic devices

Semiconductor device and method of making the same

Method for fabricating assemble substrate

Electronic package and fabrication method thereof

Two-step decapsulation technique for semiconductor package having s...

Semiconductor package and method of fabricating the same

Patents Applicationslast 30 patents

SUBSTRATE, SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING...

STAIR-STEP CONFIGURATION FOR A SEMICONDUCTOR DIE OF AN INTEGRATED C...

POWER MODULE AND METHOD OF FABRICATING THE SAME

CHIP ON FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME

Semiconductor Device and Method of Forming FOWLP with Pre-Molded Em...

REINFORCEMENT STRUCTURES FOR MULTI-DIE SEMICONDUCTOR PACKAGES AND M...

METHOD FOR FORMING AN ELECTRICAL CONNECTION BETWEEN AN ELECTRONIC C...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

FORMING A CAVITY IN A REDISTRIBUTION LAYER OF AN IC PACKAGE TO REDU...

SEMICONDUCTOR PACAKGE AND METHOD FOR FORMING THE SAME

SUBSTRATE PACKAGE

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

UNDERFILL STRUCTURE, AND SEMICONDUCTOR CHIP CARRYING MODULE AND MET...

SEMICONDUCTOR DEVICE WITH HYBRID ROUTING AND METHOD THEREFOR

CHIP

SEMICONDUCTOR PACKAGE

SENSOR HAVING TUBULAR WALLED SENSING CAVITY

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE PACKAGING WARPAGE CONTROL

OPEN CAVITY SENSOR

PACKAGE STRUCTURE WITH CAVITY AND RELATED PACKAGING METHOD

PACKAGING ARCHITECTURE INCLUDING COMPENSATION LAYERS FOR WAFER-SCAL...

SEMICONDUCTOR APPARATUS

SEMICONDUCTOR PACKAGE

ELECTRONIC PACKAGE WITH REDISTRIBUTION LAYER PLATE FORMED VIA TEMPO...

SEMICONDUCTOR PACKAGE

Chip Singulation Assisted Structures and Methods for Improving Bond...

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE