Partial encapsulation or coating

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CPC
H01L23/3157

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/3157Partial encapsulation or coating

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electronic package and method of fabricating the same
- Patent number 12,362,263
- Issue date Jul 15, 2025
- Siliconware Precision Industries Co., Ltd.
- Pin-Jing Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,362,328
- Issue date Jul 15, 2025
- Samsung Electronics Co., Ltd.
- Jaekyung Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for forming the same
- Patent number 12,355,001
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen-Chu Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double-sided stacked DTC structure
- Patent number 12,356,639
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming Chyi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating package structure
- Patent number 12,355,008
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,347,739
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and semiconductor device
- Patent number 12,347,814
- Issue date Jul 1, 2025
- Mitsubishi Electric Corporation
- Yosuke Nakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 12,334,425
- Issue date Jun 17, 2025
- Siliconware Precision Industries Co., Ltd.
- Ho-Chuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having composite seed-barrier layer and metho...
- Patent number 12,322,682
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package using a coreless signal distribution structure
- Patent number 12,322,731
- Issue date Jun 3, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Do Hyung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-mode wireless charging device
- Patent number 12,322,696
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Wei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill vacuum process
- Patent number 12,315,775
- Issue date May 27, 2025
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated device package with an integrated heat sink
- Patent number 12,315,776
- Issue date May 27, 2025
- Analog Devices, Inc.
- Michael John Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit assembly with hybrid bonding
- Patent number 12,300,655
- Issue date May 13, 2025
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming an optical semiconductor...
- Patent number 12,302,657
- Issue date May 13, 2025
- UTAC HEADQUARTERS PTE. LTD.
- Emmanuel Espiritu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a heat dissipation structure connected...
- Patent number 12,300,618
- Issue date May 13, 2025
- Taiwna Semiconductor Manufacturing Company, Ltd.
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive and thermal interface material on a plurality of dies cove...
- Patent number 12,300,574
- Issue date May 13, 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 12,288,729
- Issue date Apr 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzu-Sung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,288,764
- Issue date Apr 29, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Gyu Wan Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,283,543
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package including electronic structure and electronic bo...
- Patent number 12,283,560
- Issue date Apr 22, 2025
- Siliconware Precision Industries Co., Ltd.
- Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive bump of a semiconductor device and fabricating method th...
- Patent number 12,278,199
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chang-Pin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reinforcing resin composition, electronic component, method for man...
- Patent number 12,275,839
- Issue date Apr 15, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Shigeru Yamatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with fin isolation
- Patent number 12,261,051
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chang-Yin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management in integrated circuit packages
- Patent number 12,261,097
- Issue date Mar 25, 2025
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded chip package with anchor structures
- Patent number 12,249,519
- Issue date Mar 11, 2025
- Advanced Micro Devices, Inc.
- Priyal Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low profile sensor packages
- Patent number 12,230,619
- Issue date Feb 18, 2025
- STMicroelectronics Pte Ltd
- Jing-En Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making a photonic semiconductor...
- Patent number 12,218,114
- Issue date Feb 4, 2025
- STATS ChipPAC Pte. Ltd.
- KyungOe Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 12,211,765
- Issue date Jan 28, 2025
- Advanced Semiconductor Engineering, Inc.
- Wei-Tung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming the same
- Patent number 12,205,888
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE WITH CARRIER HAVING PLATED BOTTOM SURFACE AND SIDEWALL
- Publication number 20250226297
- Publication date Jul 10, 2025
- INFINEON TECHNOLOGIES AG
- Kok Yau CHUA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER SUBSTRATES, POWER MODULES, AND ELECTRICAL SYSTEMS
- Publication number 20250226301
- Publication date Jul 10, 2025
- Shenzhen STS Microelectronics Co., Ltd.
- Qiao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20250218887
- Publication date Jul 3, 2025
- Fuji Electric Co., Ltd.
- Kohei YAMAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME
- Publication number 20250219030
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250210563
- Publication date Jun 26, 2025
- Shinko Electric Industries Co., Ltd.
- Shinichiro Sekijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING INTEGRATED DEVICES AND A PASSIVE DEVICE
- Publication number 20250201786
- Publication date Jun 19, 2025
- QUALCOMM Incorporated
- Yue LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHODS FOR AN EMBEDDED BRIDGING PACKAGE ARCHITECTURE
- Publication number 20250201690
- Publication date Jun 19, 2025
- Samsung Electronics Co., Ltd.
- Jin YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250192060
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Eunsu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW PROFILE SENSOR PACKAGES
- Publication number 20250174616
- Publication date May 29, 2025
- STMicroelectronics Pte Ltd
- Jing-En LUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20250174508
- Publication date May 29, 2025
- Advanced Semiconductor Engineering, Inc.
- Wei-Tung CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR DEVICE WITH FIN ISOLATION
- Publication number 20250174463
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chang-Yin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250174589
- Publication date May 29, 2025
- Innolux Corporation
- Ying-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING DUMMY PADS AND MANUFACTURING METHOD...
- Publication number 20250157962
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- HANSUNG RYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250149518
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Yejin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250149396
- Publication date May 8, 2025
- Advanced Semiconductor Engineering, Inc.
- Po-Jen CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STACKING STRUCTURE
- Publication number 20250140743
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-An Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250140720
- Publication date May 1, 2025
- Samsung Electronics Co., Ltd.
- DAWOON JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20250125224
- Publication date Apr 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yao-Cheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE ASSEMBLY AND A METHOD FOR FORMING THE SAME
- Publication number 20250118611
- Publication date Apr 10, 2025
- STATS ChipPAC Pte Ltd.
- NamGu KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250118646
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- MYUNGSAM KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250118716
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE, SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING...
- Publication number 20250105122
- Publication date Mar 27, 2025
- Advanced Semiconductor Engineering, Inc.
- Cheng-Lin HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAIR-STEP CONFIGURATION FOR A SEMICONDUCTOR DIE OF AN INTEGRATED C...
- Publication number 20250096058
- Publication date Mar 20, 2025
- Western Digital Technologies, Inc.
- Huoliang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND METHOD OF FABRICATING THE SAME
- Publication number 20250096069
- Publication date Mar 20, 2025
- INFINEON TECHNOLOGIES AG
- Adrian Lis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ON FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME
- Publication number 20250087562
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- Narae Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming FOWLP with Pre-Molded Em...
- Publication number 20250087545
- Publication date Mar 13, 2025
- STATS ChipPAC Pte Ltd.
- Kai Chong Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REINFORCEMENT STRUCTURES FOR MULTI-DIE SEMICONDUCTOR PACKAGES AND M...
- Publication number 20250079334
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Yu Chen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING AN ELECTRICAL CONNECTION BETWEEN AN ELECTRONIC C...
- Publication number 20250070081
- Publication date Feb 27, 2025
- STMicroelectronics (Grenoble 2) SAS
- David Auchere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20250069962
- Publication date Feb 27, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Mun Gil Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20250062245
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS

Partial encapsulation or coating

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic package and method of fabricating the same

Semiconductor package and method of fabricating the same

Semiconductor package structure and method for forming the same

Double-sided stacked DTC structure

Methods of fabricating package structure

Package structure

Semiconductor package and semiconductor device

Electronic package and manufacturing method thereof

Semiconductor package having composite seed-barrier layer and metho...

Semiconductor package using a coreless signal distribution structure

Dual-mode wireless charging device

Underfill vacuum process

Integrated device package with an integrated heat sink

Integrated circuit assembly with hybrid bonding

Semiconductor device and method of forming an optical semiconductor...

Semiconductor device having a heat dissipation structure connected...

Adhesive and thermal interface material on a plurality of dies cove...

Integrated circuit package and method

Semiconductor device and manufacturing method thereof

Semiconductor packages

Electronic package including electronic structure and electronic bo...

Conductive bump of a semiconductor device and fabricating method th...

Reinforcing resin composition, electronic component, method for man...

Semiconductor device with fin isolation

Thermal management in integrated circuit packages

Molded chip package with anchor structures

Low profile sensor packages

Semiconductor device and method of making a photonic semiconductor...

Semiconductor device package

Semiconductor packages and methods of forming the same

Patents Applicationslast 30 patents

PACKAGE WITH CARRIER HAVING PLATED BOTTOM SURFACE AND SIDEWALL

MULTILAYER SUBSTRATES, POWER MODULES, AND ELECTRICAL SYSTEMS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME

SEMICONDUCTOR DEVICE

PACKAGE COMPRISING INTEGRATED DEVICES AND A PASSIVE DEVICE

SYSTEM AND METHODS FOR AN EMBEDDED BRIDGING PACKAGE ARCHITECTURE

SEMICONDUCTOR PACKAGE

LOW PROFILE SENSOR PACKAGES

SEMICONDUCTOR DEVICE PACKAGE

METHOD FOR FORMING SEMICONDUCTOR DEVICE WITH FIN ISOLATION

PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE INCLUDING DUMMY PADS AND MANUFACTURING METHOD...

SEMICONDUCTOR PACKAGE

PACKAGE STRUCTURE

CHIP STACKING STRUCTURE

SEMICONDUCTOR PACKAGE

INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME

ELECTRONIC PACKAGE ASSEMBLY AND A METHOD FOR FORMING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SUBSTRATE, SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING...

STAIR-STEP CONFIGURATION FOR A SEMICONDUCTOR DIE OF AN INTEGRATED C...

POWER MODULE AND METHOD OF FABRICATING THE SAME

CHIP ON FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME

Semiconductor Device and Method of Forming FOWLP with Pre-Molded Em...

REINFORCEMENT STRUCTURES FOR MULTI-DIE SEMICONDUCTOR PACKAGES AND M...

METHOD FOR FORMING AN ELECTRICAL CONNECTION BETWEEN AN ELECTRONIC C...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME