Partial encapsulation or coating

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CPC
H01L23/3157

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/3157Partial encapsulation or coating

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for forming an electrical connection between an electronic c...
- Patent number 12,170,262
- Issue date Dec 17, 2024
- STMicroelectronics (Grenoble 2) SAS
- David Auchere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate, semiconductor device package and method of manufacturing...
- Patent number 12,165,963
- Issue date Dec 10, 2024
- Advanced Semiconductor Engineering, Inc.
- Cheng-Lin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a flip-chip package core substrate with build...
- Patent number 12,154,866
- Issue date Nov 26, 2024
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Pao-Hung Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-tier IC package including processor and high bandwidth memory
- Patent number 12,154,890
- Issue date Nov 26, 2024
- Huawei Technologies Co., Ltd.
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 12,142,560
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor having tubular walled sensing cavity
- Patent number 12,135,303
- Issue date Nov 5, 2024
- Texas Instruments Incorporated
- Christlyn Faith Arias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly of 2XD module using high density interconnect bridges
- Patent number 12,125,815
- Issue date Oct 22, 2024
- Intel Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packaging warpage control
- Patent number 12,125,716
- Issue date Oct 22, 2024
- NXP USA, INC.
- Zhiwei Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating the same die stack structure and semiconduct...
- Patent number 12,119,328
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a semiconductor device package
- Patent number 12,119,282
- Issue date Oct 15, 2024
- Advanced Semiconductor Engineering, Inc.
- Tun-Ching Pi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor structure
- Patent number 12,119,229
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yu-Hsiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices and methods of manufacturing electronic devices
- Patent number 12,119,319
- Issue date Oct 15, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Ki Yeul Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making the same
- Patent number 12,113,031
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Chieh Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating assemble substrate
- Patent number 12,114,427
- Issue date Oct 8, 2024
- Siliconware Precision Industries Co., Ltd.
- Lung-Yuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and fabrication method thereof
- Patent number 12,107,055
- Issue date Oct 1, 2024
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two-step decapsulation technique for semiconductor package having s...
- Patent number 12,106,973
- Issue date Oct 1, 2024
- Silicon Laboratories Inc.
- Erwin Hendarto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,100,635
- Issue date Sep 24, 2024
- Samsung Electronics Co., Ltd.
- Sanghoon Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Analog sense points for measuring circuit die
- Patent number 12,094,789
- Issue date Sep 17, 2024
- Micron Technology, Inc.
- Christopher F. Kinney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including a molding layer
- Patent number 12,080,676
- Issue date Sep 3, 2024
- Samsung Electronics Co., Ltd.
- Hae-Jung Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 12,080,681
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Wei Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure
- Patent number 12,074,119
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 12,074,131
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible package architecture concept in fanout
- Patent number 12,074,077
- Issue date Aug 27, 2024
- Apple Inc.
- Karthik Shanmugam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,074,142
- Issue date Aug 27, 2024
- Samsung Electronics Co., Ltd.
- Jongpa Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-on-wafer-on-substrate package with improved yield
- Patent number 12,068,300
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of fabricating a semiconductor de...
- Patent number 12,068,359
- Issue date Aug 20, 2024
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Lawrence Selvaraj Susai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,062,608
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages including conductors electrically con...
- Patent number 12,062,635
- Issue date Aug 13, 2024
- Micron Technology, Inc.
- Po Chih Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,062,639
- Issue date Aug 13, 2024
- Samsung Electronics Co., Ltd.
- Jaekyung Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including a lower semiconductor package, an u...
- Patent number 12,057,366
- Issue date Aug 6, 2024
- Samsung Electronics Co., Ltd.
- Ji Hwang Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE WITH REDISTRIBUTION LAYER PLATE FORMED VIA TEMPO...
- Publication number 20240421019
- Publication date Dec 19, 2024
- MICROCHIP TECHNOLOGY INCORPORATED
- Mankit Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240421125
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- SEUNGDUK BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Singulation Assisted Structures and Methods for Improving Bond...
- Publication number 20240421126
- Publication date Dec 19, 2024
- Apple Inc.
- Chi Nung Ni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20240413080
- Publication date Dec 12, 2024
- Fuji Electric Co., Ltd.
- Naoyuki OHSE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240413040
- Publication date Dec 12, 2024
- JCET GROUP CO., LTD.
- Danfeng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A MOLDING LAYER
- Publication number 20240404984
- Publication date Dec 5, 2024
- Samsung Electronics Co., Ltd.
- HAE-JUNG YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240404932
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Fung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240395648
- Publication date Nov 28, 2024
- ROHM CO., LTD.
- Kazuki YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED STACKED DTC STRUCTURE
- Publication number 20240395948
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming Chyi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240387489
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Chia LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME
- Publication number 20240387400
- Publication date Nov 21, 2024
- STATS ChipPAC Pte Ltd.
- JiSeon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20240387421
- Publication date Nov 21, 2024
- Samsung Electronics Co., Ltd.
- Hyungsun JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20240387359
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF, MEMORY SYSTEM AND...
- Publication number 20240379473
- Publication date Nov 14, 2024
- Yangtze Memory Technologies Co., Ltd.
- Peng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20240379429
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- JING-CHENG LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240379622
- Publication date Nov 14, 2024
- Samsung Electronics Co., Ltd.
- Sung Yun WOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME
- Publication number 20240379535
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME
- Publication number 20240371787
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chieh HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240371835
- Publication date Nov 7, 2024
- Samsung Electronics Co., Ltd.
- Jongpa HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE
- Publication number 20240371647
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- YU-HSIANG HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE MODULE INCLUDING A RECESSED UPPER SURFACE AND METHODS OF FO...
- Publication number 20240371774
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kuan-Lin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making a Multi-Tier System-in-Pa...
- Publication number 20240371759
- Publication date Nov 7, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240371815
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH OPEN SENSOR CAVITY
- Publication number 20240363466
- Publication date Oct 31, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Jeffrey Salvacion Solas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING PACKAGE STRUCTURE
- Publication number 20240363587
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Wei Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20240363472
- Publication date Oct 31, 2024
- Samsung Electronics Co., Ltd.
- Ji Hwang KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY, FABRICATION METHOD THEREOF AND MEMORY SYSTEM
- Publication number 20240355694
- Publication date Oct 24, 2024
- Yangtze Memory Technologies Co., Ltd.
- Huayang YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240355802
- Publication date Oct 24, 2024
- Samsung Electronics Co., Ltd.
- Chengtar WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-WAFER-ON-SUBSTRATE PACKAGE WITH IMPROVED YIELD
- Publication number 20240355804
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE
- Publication number 20240347512
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS

Partial encapsulation or coating

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for forming an electrical connection between an electronic c...

Substrate, semiconductor device package and method of manufacturing...

Method of fabricating a flip-chip package core substrate with build...

Multi-tier IC package including processor and high bandwidth memory

Semiconductor packages and methods of forming same

Sensor having tubular walled sensing cavity

Assembly of 2XD module using high density interconnect bridges

Semiconductor device packaging warpage control

Methods of fabricating the same die stack structure and semiconduct...

Method of making a semiconductor device package

Method of manufacturing semiconductor structure

Electronic devices and methods of manufacturing electronic devices

Semiconductor device and method of making the same

Method for fabricating assemble substrate

Electronic package and fabrication method thereof

Two-step decapsulation technique for semiconductor package having s...

Semiconductor package and method of fabricating the same

Analog sense points for measuring circuit die

Semiconductor package including a molding layer

Package structure and method of fabricating the same

Chip package structure

Package structure and manufacturing method thereof

Flexible package architecture concept in fanout

Semiconductor package and method of fabricating the same

Chip-on-wafer-on-substrate package with improved yield

Semiconductor devices and methods of fabricating a semiconductor de...

Semiconductor packages

Semiconductor device packages including conductors electrically con...

Semiconductor package and method of fabricating the same

Semiconductor devices including a lower semiconductor package, an u...

Patents Applicationslast 30 patents

ELECTRONIC PACKAGE WITH REDISTRIBUTION LAYER PLATE FORMED VIA TEMPO...

SEMICONDUCTOR PACKAGE

Chip Singulation Assisted Structures and Methods for Improving Bond...

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE INCLUDING A MOLDING LAYER

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE

DOUBLE-SIDED STACKED DTC STRUCTURE

PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME

PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF, MEMORY SYSTEM AND...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME

SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE

PACKAGE MODULE INCLUDING A RECESSED UPPER SURFACE AND METHODS OF FO...

Semiconductor Device and Method of Making a Multi-Tier System-in-Pa...

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE PACKAGE WITH OPEN SENSOR CAVITY

METHOD OF FABRICATING PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGES

MEMORY, FABRICATION METHOD THEREOF AND MEMORY SYSTEM

SEMICONDUCTOR PACKAGE

CHIP-ON-WAFER-ON-SUBSTRATE PACKAGE WITH IMPROVED YIELD

PACKAGE