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2971249
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Information
Patent Grant
2971249
References
Source
Patent Number
2,971,249
Date Filed
Not available
Date Issued
Tuesday, February 14, 1961
64 years ago
CPC
H05K3/041 - by using a die for cutting the conductive material
H05K3/386 - by the use of an organic polymeric bonding layer
H05K2203/0108 - Male die used for patterning, punching or transferring
Y10S425/811 - Stencil
Y10T29/49128 - Assembling formed circuit to base
US Classifications
029 - Metal working
174 - Electricity: conductors and insulators
264 - Plastic and nonmetallic article shaping or treating: processes
425 - Plastic article or earthenware shaping or treating: apparatus
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