3120573

Information

• Patent Grant
• 3120573

• References
• Source

• Patent Number

  3,120,573

• Date Filed

  Not available

• Date Issued

  Tuesday, February 4, 1964
  61 years ago

• CPC

  • H05K3/284 - for encapsulating mounted components
  • B29C33/12 - with incorporated means for positioning inserts
  • B29C33/40 - Plastics
  • B29C39/10 - incorporating preformed parts or layers
  • B29C39/26 - Moulds or cores
  • B29C70/68 - by incorporating or moulding on preformed parts
  • B29K2801/00 - Use of cellulose, modified cellulose or cellulose derivatives
  • B29L2031/3406 - Components
  • H05K2201/10977 - Encapsulated connections
  • H05K2203/1316 - Moulded encapsulation of mounted components

• US Classifications

  • 264 - Plastic and nonmetallic article shaping or treating: processes
  • 174 - Electricity: conductors and insulators
  • 249 - Static molds
  • 361 - Electricity: electrical systems and devices
  • 439 - Electrical connectors