Encapsulated connections

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CPC
H05K2201/10977

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

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H05K2201/10977Encapsulated connections

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Embedded printed circuit board
- Patent number 12,245,376
- Issue date Mar 4, 2025
- Shinko Electric Industries Co., Ltd.
- Seiji Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical impedance monitoring device, system and method for locom...
- Patent number 12,222,305
- Issue date Feb 11, 2025
- SOUTHEAST UNIVERSITY
- Zhen Zhu
- G01 - MEASURING TESTING
Information Patent Grant
Ceramic electronic component, substrate arrangement, and method of...
- Patent number 12,198,859
- Issue date Jan 14, 2025
- Taiyo Yuden Co., Ltd.
- Yasutomo Suga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fine pitch copper pillar package and method
- Patent number 12,191,241
- Issue date Jan 7, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module
- Patent number 12,177,982
- Issue date Dec 24, 2024
- Murata Manufacturing Co., Ltd.
- Tadashi Nomura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package assembly
- Patent number 12,150,243
- Issue date Nov 19, 2024
- Wiwynn Corporation
- Yi Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module
- Patent number 12,144,159
- Issue date Nov 12, 2024
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board interconnection device and circuit board assembly
- Patent number 12,127,344
- Issue date Oct 22, 2024
- BorgWarner Inc.
- Sisay Tadele
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection structure and manufacturing method therefor
- Patent number 12,100,923
- Issue date Sep 24, 2024
- Resonac Corporation
- Kunihiko Akai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Preventing liquid ingress in a device
- Patent number 12,101,887
- Issue date Sep 24, 2024
- Koninklijke Philips N.V.
- Marinus Arnoldus Martinus Vugts
- F21 - LIGHTING
Information Patent Grant
Stackable via package and method
- Patent number 12,035,472
- Issue date Jul 9, 2024
- Amkor Technology Singapore Holding Ptd. Ltd.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with stress reduction design and method for f...
- Patent number 12,035,475
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component, electric device including the same
- Patent number 11,877,485
- Issue date Jan 16, 2024
- Samsung Display Co., Ltd.
- Chung-seok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure and method for manufacturing a circuit boar...
- Patent number 11,792,941
- Issue date Oct 17, 2023
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board
- Patent number 11,778,741
- Issue date Oct 3, 2023
- LG Innotek Co., Ltd
- Yong Han Jeon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module
- Patent number 11,716,813
- Issue date Aug 1, 2023
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure
- Patent number 11,711,887
- Issue date Jul 25, 2023
- Autonetworks Technologies, Ltd.
- Shungo Hiratani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stackable via package and method
- Patent number 11,700,692
- Issue date Jul 11, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical contact arrangement for microfabricated ultrasonic trans...
- Patent number 11,672,179
- Issue date Jun 6, 2023
- BFLY OPERATIONS, INC.
- Jonathan M. Rothberg
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Method of manufacturing electronic module, electronic module, and e...
- Patent number 11,632,886
- Issue date Apr 18, 2023
- Canon Kabushiki Kaisha
- Mitsutoshi Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible display apparatus
- Patent number 11,604,389
- Issue date Mar 14, 2023
- E Ink Holdings Inc.
- Lih-Hsiung Chan
- G02 - OPTICS
Information Patent Grant
Electronic device module
- Patent number 11,546,996
- Issue date Jan 3, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jung Mok Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module
- Patent number 11,419,215
- Issue date Aug 16, 2022
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing electronics without PCB
- Patent number 11,399,437
- Issue date Jul 26, 2022
- Nikolay V. Khatuntsev
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Grant
Packaged electronic devices with top terminations
- Patent number 11,343,919
- Issue date May 24, 2022
- NXP USA, INC.
- Fernando A. Santos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting structure and electronic device
- Patent number 11,304,295
- Issue date Apr 12, 2022
- NEC Corporation
- Kyoko Otsuka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal interface adhesion for transfer molded electronic components
- Patent number 11,140,786
- Issue date Oct 5, 2021
- International Business Machines Corporation
- Timothy J. Chainer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure and method for manufacturing a circuit boar...
- Patent number 11,134,572
- Issue date Sep 28, 2021
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Padded, flexible encasing for body monitoring systems in fabrics
- Patent number 11,122,688
- Issue date Sep 14, 2021
- Bloomer Health Tech., Inc.
- Alicia Chong Rodriguez
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Stackable via package and method
- Patent number 11,089,685
- Issue date Aug 10, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20250056721
- Publication date Feb 13, 2025
- HongQiSheng Precision Electronics (QinHuangdao) Co., Ltd.
- Cheng-Jia LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20250056713
- Publication date Feb 13, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Ho-Jae LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL IMPEDANCE MONITORING DEVICE, SYSTEM AND METHOD FOR LOCOM...
- Publication number 20250044249
- Publication date Feb 6, 2025
- SOUTHEAST UNIVERSITY
- Zhen ZHU
- G01 - MEASURING TESTING
Information Patent Application
PACKAGE ASSEMBLY
- Publication number 20250040039
- Publication date Jan 30, 2025
- Wiwynn Corporation
- Yi Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND SYSTEM FOR PROVIDING ILLUMINATING OBJECTS WITHIN SUBSTRATE
- Publication number 20240349424
- Publication date Oct 17, 2024
- John Simonetti
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FORMING A SEMICONDUCTOR PACKAGE WITH STRESS REDUCTION DE...
- Publication number 20240334608
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Kuei HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240298406
- Publication date Sep 5, 2024
- IBIDEN CO., LTD.
- Jun SAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240260197
- Publication date Aug 1, 2024
- IBIDEN CO., LTD.
- Nobuhisa KURODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT MODULE
- Publication number 20240237211
- Publication date Jul 11, 2024
- Murata Manufacturing Co., Ltd.
- Yoshihito OTSUBO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATION FLEXIBLE CIRCUIT DEVICE, FLEXIBLE CAPACITANCE SENSOR, FL...
- Publication number 20240206058
- Publication date Jun 20, 2024
- Honda Motor Co., Ltd.
- Ryusuke Ishizaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR, CIRCUIT MODULE, AND METHOD OF MANUFAC...
- Publication number 20240170221
- Publication date May 23, 2024
- Murata Manufacturing Co., Ltd.
- China UEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT MODULE
- Publication number 20240138066
- Publication date Apr 25, 2024
- Murata Manufacturing Co., Ltd.
- Yoshihito OTSUBO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20240130042
- Publication date Apr 18, 2024
- Murata Manufacturing Co., Ltd.
- Kumiko ISHIKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL CONTACT ARRANGEMENT FOR MICROFABRICATED ULTRASONIC TRANS...
- Publication number 20240122073
- Publication date Apr 11, 2024
- BFLY OPERATIONS, INC.
- Jonathan M. Rothberg
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Application
ELECTRONIC PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240074127
- Publication date Feb 29, 2024
- Chipbond Technology Corporation
- Chen-Yu Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEADLESS CURRENT SENSOR PACKAGE WITH HIGH ISOLATION
- Publication number 20240044946
- Publication date Feb 8, 2024
- ALLEGRO MICROSYSTEMS, LLC
- Robert A. Briano
- G01 - MEASURING TESTING
Information Patent Application
STACKABLE VIA PACKAGE AND METHOD
- Publication number 20230354523
- Publication date Nov 2, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING CIRCUIT BOARDS
- Publication number 20230254975
- Publication date Aug 10, 2023
- Samsung Electronics Co., Ltd.
- Sunjae KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MODULE AND METHOD FOR MANUFACTURING ELECTRONIC...
- Publication number 20230217599
- Publication date Jul 6, 2023
- Murata Manufacturing Co., Ltd.
- Toru Komatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EMBEDDED PRINTED CIRCUIT BOARD
- Publication number 20230199967
- Publication date Jun 22, 2023
- Shinko Electric Industries Co., Ltd.
- Seiji Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE ASSEMBLY
- Publication number 20230189434
- Publication date Jun 15, 2023
- Wiwynn Corporation
- Yi Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20230113302
- Publication date Apr 13, 2023
- LG Innotek Co., Ltd.
- Yong Han JEON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20230115957
- Publication date Apr 13, 2023
- Samsung Electronics Co., Ltd.
- KIJU LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE
- Publication number 20230100404
- Publication date Mar 30, 2023
- Murata Manufacturing Co., Ltd.
- Tadashi NOMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RUGGEDIZED DV-LED DISPLAY SYSTEMS AND MODULES, AND METHODS OF MANUF...
- Publication number 20230076449
- Publication date Mar 9, 2023
- PLANAR SYSTEMS, INC.
- Pete LUTY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREFOR
- Publication number 20230060577
- Publication date Mar 2, 2023
- Showa Denko Materials Co., Ltd.
- Kunihiko AKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD INTERCONNECTION DEVICE AND CIRCUIT BOARD ASSEMBLY
- Publication number 20230056822
- Publication date Feb 23, 2023
- BorgWarner Inc.
- Sisay Tadele
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20230008582
- Publication date Jan 12, 2023
- IBIDEN CO., LTD.
- Yoshinori TAKENAKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20230011786
- Publication date Jan 12, 2023
- IBIDEN CO., LTD.
- Yoshinori TAKENAKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER MODULE WITH HOUSED POWER SEMICONDUCTORS FOR CONTROLLABLE ELEC...
- Publication number 20220418088
- Publication date Dec 29, 2022
- ZF Friedrichshafen AG
- Thomas Maier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Encapsulated connections

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Embedded printed circuit board

Electrical impedance monitoring device, system and method for locom...

Ceramic electronic component, substrate arrangement, and method of...

Fine pitch copper pillar package and method

Module

Package assembly

Module

Circuit board interconnection device and circuit board assembly

Connection structure and manufacturing method therefor

Preventing liquid ingress in a device

Stackable via package and method

Semiconductor package with stress reduction design and method for f...

Electronic component, electric device including the same

Circuit board structure and method for manufacturing a circuit boar...

Circuit board

Module

Substrate structure

Stackable via package and method

Electrical contact arrangement for microfabricated ultrasonic trans...

Method of manufacturing electronic module, electronic module, and e...

Flexible display apparatus

Electronic device module

Module

Method for manufacturing electronics without PCB

Packaged electronic devices with top terminations

Mounting structure and electronic device

Thermal interface adhesion for transfer molded electronic components

Circuit board structure and method for manufacturing a circuit boar...

Padded, flexible encasing for body monitoring systems in fabrics

Stackable via package and method

Patents Applicationslast 30 patents

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD

ELECTRICAL IMPEDANCE MONITORING DEVICE, SYSTEM AND METHOD FOR LOCOM...

PACKAGE ASSEMBLY

METHOD AND SYSTEM FOR PROVIDING ILLUMINATING OBJECTS WITHIN SUBSTRATE

METHOD FOR FORMING A SEMICONDUCTOR PACKAGE WITH STRESS REDUCTION DE...

PRINTED WIRING BOARD

WIRING SUBSTRATE

CIRCUIT MODULE

LAMINATION FLEXIBLE CIRCUIT DEVICE, FLEXIBLE CAPACITANCE SENSOR, FL...

MULTILAYER CERAMIC CAPACITOR, CIRCUIT MODULE, AND METHOD OF MANUFAC...

CIRCUIT MODULE

CIRCUIT BOARD

ELECTRICAL CONTACT ARRANGEMENT FOR MICROFABRICATED ULTRASONIC TRANS...

ELECTRONIC PACKAGE AND METHOD OF MANUFACTURING THE SAME

LEADLESS CURRENT SENSOR PACKAGE WITH HIGH ISOLATION

STACKABLE VIA PACKAGE AND METHOD

SEMICONDUCTOR PACKAGES HAVING CIRCUIT BOARDS

ELECTRONIC COMPONENT MODULE AND METHOD FOR MANUFACTURING ELECTRONIC...

EMBEDDED PRINTED CIRCUIT BOARD

PACKAGE ASSEMBLY

CIRCUIT BOARD

SEMICONDUCTOR PACKAGES

MODULE

RUGGEDIZED DV-LED DISPLAY SYSTEMS AND MODULES, AND METHODS OF MANUF...

CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREFOR

CIRCUIT BOARD INTERCONNECTION DEVICE AND CIRCUIT BOARD ASSEMBLY

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE

POWER MODULE WITH HOUSED POWER SEMICONDUCTORS FOR CONTROLLABLE ELEC...