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  • H05K2201/10977
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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

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H05K2201/10977Encapsulated connections
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20250120009
    • Publication date Apr 10, 2025
    • Samsung Electronics Co., Ltd.
    • Dongwoo KIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
    • Publication number 20250056721
    • Publication date Feb 13, 2025
    • HongQiSheng Precision Electronics (QinHuangdao) Co., Ltd.
    • Cheng-Jia LI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD
    • Publication number 20250056713
    • Publication date Feb 13, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Ho-Jae LEE
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRICAL IMPEDANCE MONITORING DEVICE, SYSTEM AND METHOD FOR LOCOM...
    • Publication number 20250044249
    • Publication date Feb 6, 2025
    • SOUTHEAST UNIVERSITY
    • Zhen ZHU
    • G01 - MEASURING TESTING
  • Information Patent Application

    PACKAGE ASSEMBLY
    • Publication number 20250040039
    • Publication date Jan 30, 2025
    • Wiwynn Corporation
    • Yi Cheng
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD AND SYSTEM FOR PROVIDING ILLUMINATING OBJECTS WITHIN SUBSTRATE
    • Publication number 20240349424
    • Publication date Oct 17, 2024
    • John Simonetti
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD FOR FORMING A SEMICONDUCTOR PACKAGE WITH STRESS REDUCTION DE...
    • Publication number 20240334608
    • Publication date Oct 3, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chia-Kuei HSU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRINTED WIRING BOARD
    • Publication number 20240298406
    • Publication date Sep 5, 2024
    • IBIDEN CO., LTD.
    • Jun SAKAI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20240260197
    • Publication date Aug 1, 2024
    • IBIDEN CO., LTD.
    • Nobuhisa KURODA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CIRCUIT MODULE
    • Publication number 20240237211
    • Publication date Jul 11, 2024
    • Murata Manufacturing Co., Ltd.
    • Yoshihito OTSUBO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LAMINATION FLEXIBLE CIRCUIT DEVICE, FLEXIBLE CAPACITANCE SENSOR, FL...
    • Publication number 20240206058
    • Publication date Jun 20, 2024
    • Honda Motor Co., Ltd.
    • Ryusuke Ishizaki
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTILAYER CERAMIC CAPACITOR, CIRCUIT MODULE, AND METHOD OF MANUFAC...
    • Publication number 20240170221
    • Publication date May 23, 2024
    • Murata Manufacturing Co., Ltd.
    • China UEDA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT MODULE
    • Publication number 20240138066
    • Publication date Apr 25, 2024
    • Murata Manufacturing Co., Ltd.
    • Yoshihito OTSUBO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD
    • Publication number 20240130042
    • Publication date Apr 18, 2024
    • Murata Manufacturing Co., Ltd.
    • Kumiko ISHIKAWA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRICAL CONTACT ARRANGEMENT FOR MICROFABRICATED ULTRASONIC TRANS...
    • Publication number 20240122073
    • Publication date Apr 11, 2024
    • BFLY OPERATIONS, INC.
    • Jonathan M. Rothberg
    • B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
  • Information Patent Application

    ELECTRONIC PACKAGE AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20240074127
    • Publication date Feb 29, 2024
    • Chipbond Technology Corporation
    • Chen-Yu Wang
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LEADLESS CURRENT SENSOR PACKAGE WITH HIGH ISOLATION
    • Publication number 20240044946
    • Publication date Feb 8, 2024
    • ALLEGRO MICROSYSTEMS, LLC
    • Robert A. Briano
    • G01 - MEASURING TESTING
  • Information Patent Application

    STACKABLE VIA PACKAGE AND METHOD
    • Publication number 20230354523
    • Publication date Nov 2, 2023
    • Amkor Technology Singapore Holding Pte. Ltd.
    • Akito Yoshida
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGES HAVING CIRCUIT BOARDS
    • Publication number 20230254975
    • Publication date Aug 10, 2023
    • Samsung Electronics Co., Ltd.
    • Sunjae KIM
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC COMPONENT MODULE AND METHOD FOR MANUFACTURING ELECTRONIC...
    • Publication number 20230217599
    • Publication date Jul 6, 2023
    • Murata Manufacturing Co., Ltd.
    • Toru Komatsu
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    EMBEDDED PRINTED CIRCUIT BOARD
    • Publication number 20230199967
    • Publication date Jun 22, 2023
    • Shinko Electric Industries Co., Ltd.
    • Seiji Sato
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PACKAGE ASSEMBLY
    • Publication number 20230189434
    • Publication date Jun 15, 2023
    • Wiwynn Corporation
    • Yi Cheng
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD
    • Publication number 20230113302
    • Publication date Apr 13, 2023
    • LG Innotek Co., Ltd.
    • Yong Han JEON
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SEMICONDUCTOR PACKAGES
    • Publication number 20230115957
    • Publication date Apr 13, 2023
    • Samsung Electronics Co., Ltd.
    • KIJU LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MODULE
    • Publication number 20230100404
    • Publication date Mar 30, 2023
    • Murata Manufacturing Co., Ltd.
    • Tadashi NOMURA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    RUGGEDIZED DV-LED DISPLAY SYSTEMS AND MODULES, AND METHODS OF MANUF...
    • Publication number 20230076449
    • Publication date Mar 9, 2023
    • PLANAR SYSTEMS, INC.
    • Pete LUTY
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREFOR
    • Publication number 20230060577
    • Publication date Mar 2, 2023
    • Showa Denko Materials Co., Ltd.
    • Kunihiko AKAI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CIRCUIT BOARD INTERCONNECTION DEVICE AND CIRCUIT BOARD ASSEMBLY
    • Publication number 20230056822
    • Publication date Feb 23, 2023
    • BorgWarner Inc.
    • Sisay Tadele
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE
    • Publication number 20230008582
    • Publication date Jan 12, 2023
    • IBIDEN CO., LTD.
    • Yoshinori TAKENAKA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE
    • Publication number 20230011786
    • Publication date Jan 12, 2023
    • IBIDEN CO., LTD.
    • Yoshinori TAKENAKA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR