3166448

Information

• Patent Grant
• 3166448

• References
• Source

• Patent Number

  3,166,448

• Date Filed

  Not available

• Date Issued

  Tuesday, January 19, 1965
  60 years ago

• CPC

  • H01L23/482 - consisting of lead-in layers inseparably applied to the semiconductor body
  • H01L21/00 - Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L29/00 - Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier
  • H01L2924/0002 - Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
  • Y10S438/912 - Displacing pn junction

• US Classifications

  • 438 - Semiconductor device manufacturing: process
  • 228 - Metal fusion bonding
  • 257 - Active solid-state devices
  • 420 - Alloys or metallic compositions