3202543

Information

• Patent Grant
• 3202543

• References
• Source

• Patent Number

  3,202,543

• Date Filed

  Not available

• Date Issued

  Tuesday, August 24, 1965
  59 years ago

• CPC

  • H01L23/482 - consisting of lead-in layers inseparably applied to the semiconductor body
  • C23C14/042 - using masks
  • H01J19/30 - characterised by the material
  • H01L21/00 - Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L27/00 - Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate
  • H01J2893/0019 - Chemical composition and manufacture
  • H01L2924/0002 - Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

• US Classifications

  • 216 - Etching a substrate: processes
  • 427 - Coating processes
  • 438 - Semiconductor device manufacturing: process