3411051

Information

• Patent Grant
• 3411051

• References
• Source

• Patent Number

  3,411,051

• Date Filed

  Not available

• Date Issued

  Tuesday, November 12, 1968
  56 years ago

• CPC

  • H01L29/0642 - Isolation within the component
  • H01L21/00 - Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/76297 - Dielectric isolation using EPIC techniques
  • H01L27/00 - Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate
  • H01L29/00 - Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier
  • Y10S148/031 - Diffusion at an edge
  • Y10S148/035 - Diffusion through a layer
  • Y10S148/085 - Isolated-integrated
  • Y10S148/167 - Two diffusions in one hole
  • Y10T29/49124 - On flat or curved insulated base, e.g., printed circuit, etc.

• US Classifications

  • 257 - Active solid-state devices
  • 029 - Metal working
  • 148 - Metal treatment