3469684

Information

• Patent Grant
• 3469684

• References
• Source

• Patent Number

  3,469,684

• Date Filed

  Not available

• Date Issued

  Tuesday, September 30, 1969
  55 years ago

• CPC

  • H05K13/003 - Placing of components on belts holding the terminals
  • H01L21/50 - Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326
  • H01L23/057 - the leads being parallel to the base
  • H01L23/49861 - Lead-frames fixed on or encapsulated in insulating substrates
  • H01L2924/0002 - Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
  • Y10T29/49121 - Beam lead frame or beam lead device
  • Y10T428/12208 - Variation in both width and thickness
  • Y10T428/15 - Sheet, web, or layer weakened to permit separation through thickness
  • Y10T428/24479 - including variation in thickness

• US Classifications

  • 257 - Active solid-state devices
  • 029 - Metal working
  • 174 - Electricity: conductors and insulators
  • 361 - Electricity: electrical systems and devices
  • 428 - Stock material or miscellaneous articles
  • 438 - Semiconductor device manufacturing: process