the leads being parallel to the base

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/057the leads being parallel to the base

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Patents Grantslast 30 patents

Information Patent Grant
Active shield structure
- Patent number 12,114,471
- Issue date Oct 8, 2024
- ARM Limited
- Narayan Prasad Ramachandran
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Panel molded electronic assemblies with multi-surface conductive co...
- Patent number 12,096,549
- Issue date Sep 17, 2024
- Vicor Corporation
- Patrizio Vinciarelli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device dam walls located between two adjacent conductive...
- Patent number 11,929,369
- Issue date Mar 12, 2024
- Innolux Corporation
- Shuhei Hosaka
- G02 - OPTICS
Information Patent Grant
Radio frequency packages containing substrates with coefficient of...
- Patent number 11,929,310
- Issue date Mar 12, 2024
- NXP USA, INC.
- Lu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,855,049
- Issue date Dec 26, 2023
- Fuji Electric Co., Ltd.
- Hayato Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of package-then-etch three-dimensional package structure el...
- Patent number 11,823,911
- Issue date Nov 21, 2023
- Jiangsu Changjiang Electronics Technology Co., Ltd
- Haishen Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power laminate RF package
- Patent number 11,791,251
- Issue date Oct 17, 2023
- Qorvo US, Inc.
- Dylan Murdock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module arrangement
- Patent number 11,699,625
- Issue date Jul 11, 2023
- Infineon Technologies AG
- Alexander Hoehn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module
- Patent number 11,682,596
- Issue date Jun 20, 2023
- Fuji Electric Co., Ltd.
- Yuichiro Hinata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method and semiconductor device
- Patent number 11,640,926
- Issue date May 2, 2023
- Fuji Electric Co., Ltd.
- Yuji Ichimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with elastic coupler and related methods
- Patent number 11,569,140
- Issue date Jan 31, 2023
- Semiconductor Components Industries, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a groove within a resin insulating p...
- Patent number 11,569,141
- Issue date Jan 31, 2023
- Mitsubishi Electric Corporation
- Daisuke Oya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with partitioning based on environmental...
- Patent number 11,538,767
- Issue date Dec 27, 2022
- Texas Instruments Incorporated
- Barry Jon Male
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded air-cavity package and device comprising the same
- Patent number 11,527,451
- Issue date Dec 13, 2022
- Ampleon Netherlands B.V.
- Leonardus Theodorus Maria Raben
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Unitary housing for electronic device
- Patent number 11,505,131
- Issue date Nov 22, 2022
- Apple Inc.
- Christopher D. Prest
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Power semiconductor module having a current sensor module fixed wit...
- Patent number 11,502,064
- Issue date Nov 15, 2022
- Infineon Technologies AG
- Tomas Manuel Reiter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,495,527
- Issue date Nov 8, 2022
- Sumitomo Electric Industries, Ltd.
- Hirotaka Oomori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic conductive feedthroughs for a semiconductor wafer
- Patent number 11,485,670
- Issue date Nov 1, 2022
- Medtronic, Inc.
- David A. Ruben
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Light-emitting device
- Patent number 11,489,099
- Issue date Nov 1, 2022
- Nichia Corporation
- Yuta Horikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna module and electronic device including the same
- Patent number 11,462,834
- Issue date Oct 4, 2022
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Young Kyoon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module arrangement and method for producing the...
- Patent number 11,462,446
- Issue date Oct 4, 2022
- Infineon Technologies AG
- Alexander Hoehn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for mounting an electrical component in which a hood is used...
- Patent number 11,424,170
- Issue date Aug 23, 2022
- Siemens Aktiengesellschaft
- Nora Busche
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Panel molded electronic assemblies with multi-surface conductive co...
- Patent number 11,324,107
- Issue date May 3, 2022
- Vicor Corporation
- Patrizio Vinciarelli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-before-etch three-dimensional package structure electricall...
- Patent number 11,217,459
- Issue date Jan 4, 2022
- Jiangsu Changjiang Electronics Technology Co., Ltd
- Haishen Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical semiconductor apparatus and method of manufacturing optical...
- Patent number 11,217,730
- Issue date Jan 4, 2022
- Nikkiso Co., Ltd.
- Hiroyasu Ichinokura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for a transducer in an EWLB package
- Patent number 11,211,298
- Issue date Dec 28, 2021
- Infineon Technologies AG
- Stephan Pindl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 11,177,224
- Issue date Nov 16, 2021
- Fuji Electric Co., Ltd.
- Toshio Denta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having case to which circuit board is bonded b...
- Patent number 11,177,236
- Issue date Nov 16, 2021
- Fuji Electric Co., Ltd.
- Tatsuya Karasawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,177,190
- Issue date Nov 16, 2021
- Fuji Electric Co., Ltd.
- Makoto Isozaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit (IC) device package lid attach utilizing nano pa...
- Patent number 11,164,804
- Issue date Nov 2, 2021
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Power Converter, Package Structure, and Heat Dissipation Structure
- Publication number 20240421100
- Publication date Dec 19, 2024
- Huawei Digital Power Technologies Co., Ltd.
- Xingzhong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE HAVING SEMICONDUCTOR COMPONENTS AND INCORPORATING A TE...
- Publication number 20240395651
- Publication date Nov 28, 2024
- SAFRAN
- Rabih KHAZAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSERT-MOLDED ARTICLE AND METHOD FOR MANUFACTURING INSERT-MOLDED AR...
- Publication number 20240304505
- Publication date Sep 12, 2024
- Fuji Electric Co., Ltd.
- Hisato INOKUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC-COMPONENT MOUNTING PACKAGE AND ELECTRONIC DEVICE
- Publication number 20240243055
- Publication date Jul 18, 2024
- KYOCERA CORPORATION
- Toshihiko KITAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240213265
- Publication date Jun 27, 2024
- InnoLux Corporation
- Shuhei HOSAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240079382
- Publication date Mar 7, 2024
- Fuji Electric Co., Ltd.
- Hayato NAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIAMOND-METAL COMPOSITE HIGH POWER DEVICE PACKAGES
- Publication number 20230352360
- Publication date Nov 2, 2023
- MACOM Technology Solutions Holdings, Inc.
- Quinn Don Martin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230326816
- Publication date Oct 12, 2023
- Fuji Electric Co., Ltd.
- Tadahiko SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE HAVING LEADFRAME-LESS SIGNAL CONNECTORS, IN PARTICULAR...
- Publication number 20230317537
- Publication date Oct 5, 2023
- STMicroelectronics S.r.l.
- Sergio SAVINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20230071827
- Publication date Mar 9, 2023
- Fuji Electric Co., Ltd.
- Kousuke KOMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE WITH SHAPED EXTERNAL CONTACT FOR REDUCED CRACK...
- Publication number 20220415732
- Publication date Dec 29, 2022
- Christoph Liebl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS
- Publication number 20220406669
- Publication date Dec 22, 2022
- Fuji Electric Co., Ltd.
- Hiroki KOGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE ARRANGEMENT
- Publication number 20220359319
- Publication date Nov 10, 2022
- Alexander Hoehn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE HAVING A CURRENT SENSOR MODULE FIXED WIT...
- Publication number 20220262773
- Publication date Aug 18, 2022
- Tomas Manuel Reiter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20220216240
- Publication date Jul 7, 2022
- InnoLux Corporation
- Shuhei HOSAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND POWER CONVERTER
- Publication number 20220181221
- Publication date Jun 9, 2022
- Mitsubishi Electric Corporation
- Yoshinori YOKOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF INSERT CASE FOR SEMICONDUCTOR DEVICE AND SE...
- Publication number 20220165583
- Publication date May 26, 2022
- Mitsubishi Electric Corporation
- Hiroyuki MASUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS OF PACKAGE-THEN-ETCH THREE-DIMENSIONAL PACKAGE STRUCTURE EL...
- Publication number 20220084841
- Publication date Mar 17, 2022
- Jiangsu Changjiang Electronics Technology Co., Ltd
- Haishen KONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molded Air-cavity Package and Device Comprising the Same
- Publication number 20210384092
- Publication date Dec 9, 2021
- Ampleon Netherlands B.V.
- Leonardus Theodorus Maria Raben
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20210375832
- Publication date Dec 2, 2021
- Fuji Electric Co., Ltd.
- Hayato NAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20210320055
- Publication date Oct 14, 2021
- Sumitomo Electric Industries, Ltd.
- Hirotaka OOMORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA MODULE AND ELECTRONIC DEVICE INCLUDING THE SAME
- Publication number 20210242593
- Publication date Aug 5, 2021
- Samsung Electro-Mechanics Co., Ltd.
- Young Kyoon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210217675
- Publication date Jul 15, 2021
- Mitsubishi Electric Corporation
- Daisuke OYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE
- Publication number 20210183715
- Publication date Jun 17, 2021
- Mitsubishi Electric Corporation
- Satoshi KAWABATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE
- Publication number 20210151356
- Publication date May 20, 2021
- Fuji Electric Co., Ltd.
- Yuichiro HINATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit (IC) Device Package Lid Attach Utilizing Nano Pa...
- Publication number 20210028079
- Publication date Jan 28, 2021
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Module Arrangement
- Publication number 20200357711
- Publication date Nov 12, 2020
- Alexander Hoehn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Module Arrangement and Method for Producing the...
- Publication number 20200357710
- Publication date Nov 12, 2020
- Alexander Hoehn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20200357753
- Publication date Nov 12, 2020
- Fuji Electric Co., Ltd.
- Toshio DENTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200286807
- Publication date Sep 10, 2020
- Fuji Electric Co., Ltd.
- Makoto ISOZAKI
- H01 - BASIC ELECTRIC ELEMENTS

the leads being parallel to the base

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Active shield structure

Panel molded electronic assemblies with multi-surface conductive co...

Electronic device dam walls located between two adjacent conductive...

Radio frequency packages containing substrates with coefficient of...

Semiconductor device

Process of package-then-etch three-dimensional package structure el...

High power laminate RF package

Power semiconductor module arrangement

Power semiconductor module

Semiconductor device manufacturing method and semiconductor device

Semiconductor package with elastic coupler and related methods

Semiconductor device including a groove within a resin insulating p...

Integrated circuit package with partitioning based on environmental...

Molded air-cavity package and device comprising the same

Unitary housing for electronic device

Power semiconductor module having a current sensor module fixed wit...

Semiconductor module

Hermetic conductive feedthroughs for a semiconductor wafer

Light-emitting device

Antenna module and electronic device including the same

Power semiconductor module arrangement and method for producing the...

Method for mounting an electrical component in which a hood is used...

Panel molded electronic assemblies with multi-surface conductive co...

Package-before-etch three-dimensional package structure electricall...

Optical semiconductor apparatus and method of manufacturing optical...

System and method for a transducer in an EWLB package

Method of manufacturing semiconductor device

Semiconductor device having case to which circuit board is bonded b...

Semiconductor device

Integrated circuit (IC) device package lid attach utilizing nano pa...

Patents Applicationslast 30 patents

Power Converter, Package Structure, and Heat Dissipation Structure

POWER MODULE HAVING SEMICONDUCTOR COMPONENTS AND INCORPORATING A TE...

INSERT-MOLDED ARTICLE AND METHOD FOR MANUFACTURING INSERT-MOLDED AR...

ELECTRONIC-COMPONENT MOUNTING PACKAGE AND ELECTRONIC DEVICE

ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

DIAMOND-METAL COMPOSITE HIGH POWER DEVICE PACKAGES

SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING THE SAME

POWER MODULE HAVING LEADFRAME-LESS SIGNAL CONNECTORS, IN PARTICULAR...

SEMICONDUCTOR MODULE

SEMICONDUCTOR MODULE WITH SHAPED EXTERNAL CONTACT FOR REDUCED CRACK...

SEMICONDUCTOR APPARATUS

POWER SEMICONDUCTOR MODULE ARRANGEMENT

POWER SEMICONDUCTOR MODULE HAVING A CURRENT SENSOR MODULE FIXED WIT...

ELECTRONIC DEVICE

SEMICONDUCTOR MODULE AND POWER CONVERTER

MANUFACTURING METHOD OF INSERT CASE FOR SEMICONDUCTOR DEVICE AND SE...

PROCESS OF PACKAGE-THEN-ETCH THREE-DIMENSIONAL PACKAGE STRUCTURE EL...

Molded Air-cavity Package and Device Comprising the Same

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR MODULE

ANTENNA MODULE AND ELECTRONIC DEVICE INCLUDING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE

POWER SEMICONDUCTOR MODULE

Integrated Circuit (IC) Device Package Lid Attach Utilizing Nano Pa...

Power Semiconductor Module Arrangement

Power Semiconductor Module Arrangement and Method for Producing the...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE