Lead-frames fixed on or encapsulated in insulating substrates

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H01L23/49861

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/49861Lead-frames fixed on or encapsulated in insulating substrates

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Interposer and semiconductor package including the same
- Patent number 12,218,099
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Jungsoo Byun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic packages with integral heat spreaders
- Patent number 12,199,004
- Issue date Jan 14, 2025
- NAVITAS SEMICONDUCTOR LIMITED
- Charles Bailley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate and manufacturing method thereof
- Patent number 12,199,027
- Issue date Jan 14, 2025
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compact power module
- Patent number 12,199,071
- Issue date Jan 14, 2025
- Wolfspeed, Inc.
- Brice McPherson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid interposer of glass and silicon to reduce thermal crosstalk
- Patent number 12,191,220
- Issue date Jan 7, 2025
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan out device with a filler-free insulating material
- Patent number 12,191,222
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages with cavities and methods of manufactur...
- Patent number 12,165,942
- Issue date Dec 10, 2024
- Texas Instruments Incorporated
- Jesus Bajo Bautista
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,165,965
- Issue date Dec 10, 2024
- Kabushiki Kaisha Toshiba
- Tomohiro Iguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor packages
- Patent number 12,159,833
- Issue date Dec 3, 2024
- Samsung Electronics Co., Ltd.
- Joonsung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,159,810
- Issue date Dec 3, 2024
- Denso Corporation
- Akinori Sakakibara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier modules including semiconductor resistor and tantal...
- Patent number 12,143,077
- Issue date Nov 12, 2024
- Skyworks Solutions, Inc.
- Peter J. Zampardi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package structure with reduced vertical stress regions
- Patent number 12,131,982
- Issue date Oct 29, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Tae Kyung Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Extendable inner lead for leaded package
- Patent number 12,125,780
- Issue date Oct 22, 2024
- NXP B.V.
- Mei Yeut Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded die packaging with integrated ceramic substrate
- Patent number 12,125,799
- Issue date Oct 22, 2024
- Texas Instruments Incorporated
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures with deformable conductors
- Patent number 12,125,778
- Issue date Oct 22, 2024
- Liquid Wire Inc.
- Mark William Ronay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package with reduced stress
- Patent number 12,119,280
- Issue date Oct 15, 2024
- Texas Instruments Incorporated
- Gregory Thomas Ostrowicki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package including lead frame and manufacturing m...
- Patent number 12,113,008
- Issue date Oct 8, 2024
- Diodes Incorporated
- Shiau-Shi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,107,038
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Jung Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming package structure
- Patent number 12,094,819
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,094,826
- Issue date Sep 17, 2024
- Rohm Co., Ltd.
- Hirotaka Otake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and mounting structure thereof
- Patent number 12,087,675
- Issue date Sep 10, 2024
- Rohm Co., Ltd.
- Ippei Yasutake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module
- Patent number 12,080,635
- Issue date Sep 3, 2024
- Wolfspeed, Inc.
- Brice McPherson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolated 3D semiconductor device package with transistors attached...
- Patent number 12,074,160
- Issue date Aug 27, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Tiburcio A. Maldo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid coating for integrated circuit device
- Patent number 12,068,266
- Issue date Aug 20, 2024
- Raytheon Technologies Corporation
- Jarrod N. Vaillancourt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and related methods
- Patent number 12,062,549
- Issue date Aug 13, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having routable encapsulated conductive subst...
- Patent number 12,062,588
- Issue date Aug 13, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Won Bae Bang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 12,057,426
- Issue date Aug 6, 2024
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,057,365
- Issue date Aug 6, 2024
- Rohm Co., Ltd.
- Takumi Kanda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
QFN semiconductor package, semiconductor package and lead frame
- Patent number 12,051,642
- Issue date Jul 30, 2024
- NXP USA, INC.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,052,014
- Issue date Jul 30, 2024
- Rohm Co., Ltd.
- Yuji Ishimatsu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Chip Package and Manufacturing Method Thereof
- Publication number 20250038096
- Publication date Jan 30, 2025
- DIODES INCORPORATED
- Shiau-Shi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE STRUCTURE
- Publication number 20250029899
- Publication date Jan 23, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Tae Kyung HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER SYSTEMS INCLUDING CONTROL INTERFACE AND WIRE BOND PAD
- Publication number 20250030386
- Publication date Jan 23, 2025
- Skyworks Solutions, Inc.
- Weimin Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250022791
- Publication date Jan 16, 2025
- FLOSFIA INC.
- Hiroshi KONDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING PRE-MO...
- Publication number 20250014982
- Publication date Jan 9, 2025
- STMicroelectronics International N.V.
- Mauro MAZZOLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...
- Publication number 20250015038
- Publication date Jan 9, 2025
- STMicroelectronics International N.V.
- Pierangelo MAGNI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20250006622
- Publication date Jan 2, 2025
- Fuji Electric Co., Ltd.
- Tatsuo NISHIZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR ASSEMBLIES
- Publication number 20250006576
- Publication date Jan 2, 2025
- NEXPERIA B.V.
- Hiu Hay Nichole Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC BONDING STRUCTURE AND METHOD OF FORMING SAME
- Publication number 20240412991
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung-En Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATED 3D SEMICONDUCTOR DEVICE PACKAGE WITH TRANSISTORS ATTACHED...
- Publication number 20240413148
- Publication date Dec 12, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Tiburcio A. MALDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20240413072
- Publication date Dec 12, 2024
- Dyi-Chung HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING ROUTABLE ENCAPSULATED CONDUCTIVE SUBST...
- Publication number 20240404902
- Publication date Dec 5, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Won Bae BANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAMELESS ELECTRICALLY ISOLATED POWER SEMICONDUCTOR PACKAGE
- Publication number 20240395692
- Publication date Nov 28, 2024
- LITTELFUSE, INC.
- Tiburcio Maldo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING PASSIVE DEVICES ON ACTIVE DIES TO FORM 3D PACKAGES
- Publication number 20240395769
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MOUNTING STRUCTURE THEREOF
- Publication number 20240395675
- Publication date Nov 28, 2024
- Rohm Co., Ltd.
- Ippei YASUTAKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Module
- Publication number 20240395677
- Publication date Nov 28, 2024
- Wolfspeed, Inc.
- Brice McPherson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods of Manufacture
- Publication number 20240387385
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20240371745
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Jung Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN OUT PACKAGE FOR A SEMICONDUCTOR POWER MODULE
- Publication number 20240363575
- Publication date Oct 31, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jihwan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTELLIGENT POWER MODULE PACKAGE STRUCTURE AND HYBRID CERAMIC BOARD
- Publication number 20240363516
- Publication date Oct 31, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- CHIA-SHUAI CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240363533
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240363506
- Publication date Oct 31, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Won Bae Bang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND RELATED METHODS
- Publication number 20240355638
- Publication date Oct 24, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yong LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULARIZED POWER AMPLIFIER DEVICES AND ARCHITECTURE
- Publication number 20240356501
- Publication date Oct 24, 2024
- ViaSat, Inc.
- Shih Peng SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH THERMAL PAD
- Publication number 20240347441
- Publication date Oct 17, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240348247
- Publication date Oct 17, 2024
- ROHM CO., LTD.
- Yuji ISHIMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND FABRICATION METHOD OF THE SAME, GRAPHITE PLATE, AN...
- Publication number 20240332122
- Publication date Oct 3, 2024
- ROHM CO., LTD.
- Maiko HATANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240332139
- Publication date Oct 3, 2024
- Mitsubishi Electric Corporation
- Taketo NISHIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGHLY INTEGRATED POWER ELECTRONICS AND METHODS OF MANUFACTURING TH...
- Publication number 20240332204
- Publication date Oct 3, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240321811
- Publication date Sep 26, 2024
- ROHM CO., LTD.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS

Lead-frames fixed on or encapsulated in insulating substrates

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Interposer and semiconductor package including the same

Electronic packages with integral heat spreaders

Substrate and manufacturing method thereof

Compact power module

Hybrid interposer of glass and silicon to reduce thermal crosstalk

Integrated fan out device with a filler-free insulating material

Integrated circuit packages with cavities and methods of manufactur...

Semiconductor device

Fan-out semiconductor packages

Semiconductor device

Power amplifier modules including semiconductor resistor and tantal...

Electronic package structure with reduced vertical stress regions

Extendable inner lead for leaded package

Embedded die packaging with integrated ceramic substrate

Structures with deformable conductors

Semiconductor device package with reduced stress

Semiconductor chip package including lead frame and manufacturing m...

Semiconductor packages

Method for forming package structure

Semiconductor device

Semiconductor device and mounting structure thereof

Power module

Isolated 3D semiconductor device package with transistors attached...

Hybrid coating for integrated circuit device

Semiconductor packages and related methods

Semiconductor package having routable encapsulated conductive subst...

Semiconductor module

Semiconductor device

QFN semiconductor package, semiconductor package and lead frame

Semiconductor device

Patents Applicationslast 30 patents

Semiconductor Chip Package and Manufacturing Method Thereof

ELECTRONIC PACKAGE STRUCTURE

POWER AMPLIFIER SYSTEMS INCLUDING CONTROL INTERFACE AND WIRE BOND PAD

SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING PRE-MO...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...

SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREOF

METHOD OF MANUFACTURING SEMICONDUCTOR ASSEMBLIES

MAGNETIC BONDING STRUCTURE AND METHOD OF FORMING SAME

ISOLATED 3D SEMICONDUCTOR DEVICE PACKAGE WITH TRANSISTORS ATTACHED...

SUBSTRATE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE HAVING ROUTABLE ENCAPSULATED CONDUCTIVE SUBST...

LEADFRAMELESS ELECTRICALLY ISOLATED POWER SEMICONDUCTOR PACKAGE

BONDING PASSIVE DEVICES ON ACTIVE DIES TO FORM 3D PACKAGES

SEMICONDUCTOR DEVICE AND MOUNTING STRUCTURE THEREOF

Power Module

Semiconductor Devices and Methods of Manufacture

SEMICONDUCTOR PACKAGES

FAN OUT PACKAGE FOR A SEMICONDUCTOR POWER MODULE

INTELLIGENT POWER MODULE PACKAGE STRUCTURE AND HYBRID CERAMIC BOARD

PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGES AND RELATED METHODS

MODULARIZED POWER AMPLIFIER DEVICES AND ARCHITECTURE

SEMICONDUCTOR DEVICE PACKAGE WITH THERMAL PAD

SEMICONDUCTOR DEVICE

POWER MODULE AND FABRICATION METHOD OF THE SAME, GRAPHITE PLATE, AN...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

HIGHLY INTEGRATED POWER ELECTRONICS AND METHODS OF MANUFACTURING TH...

SEMICONDUCTOR MODULE