3544432

Information

• Patent Grant
• 3544432

• References
• Source

• Patent Number

  3,544,432

• Date Filed

  Not available

• Date Issued

  Tuesday, December 1, 1970
  53 years ago

• CPC

  • H05K3/387 - for electroless plating
  • C23C18/2033 - Heat
  • C23C18/2086 - with use of organic or inorganic compounds other than metals, first
  • C23C18/285 - Sensitising or activating with tin based compound or composition
  • C23C18/30 - Activating or accelerating or sensitising with palladium or other noble metal
  • D06Q1/04 - by metallising
  • H05K2201/09118 - Moulded substrate
  • Y10S205/927 - Polyolefin

• US Classifications

  • 205 - Electrolysis: processes, compositions used therein, and methods of preparing the compositions