Moulded substrate

Industry

CPC
H05K2201/09118

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/09118Moulded substrate

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Component carrier with embedded interposer laterally between electr...
- Patent number 12,165,964
- Issue date Dec 10, 2024
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Minwoo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterned article including electrically conductive elements
- Patent number 12,133,327
- Issue date Oct 29, 2024
- 3M Innovative Properties Company
- Raymond P. Johnston
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Molded article, electrical product and method for producing molded...
- Patent number 12,122,078
- Issue date Oct 22, 2024
- Nissha Co., Ltd.
- Seiichi Yamazaki
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Patterned conductive article
- Patent number 12,048,092
- Issue date Jul 23, 2024
- 3M Innovative Properties Company
- Raymond P. Johnston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 12,010,795
- Issue date Jun 11, 2024
- LG Innotek Co., Ltd
- Il Sik Nam
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaged semiconductor device
- Patent number 11,955,479
- Issue date Apr 9, 2024
- Texas Instruments Incorporated
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced semiconductor package with at least one heat ext...
- Patent number 11,942,389
- Issue date Mar 26, 2024
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced semiconductor package with at least one heat ext...
- Patent number 11,842,939
- Issue date Dec 12, 2023
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging device for connection with a circuit element
- Patent number 11,800,249
- Issue date Oct 24, 2023
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Yuta Momiuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier for arranging electrical components on a circuit...
- Patent number 11,770,896
- Issue date Sep 26, 2023
- HARTING AG
- Thomas Hess
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a circuit having a lamination layer using...
- Patent number 11,744,022
- Issue date Aug 29, 2023
- KYOCERA AVX Components (San Diego), Inc.
- Seung Hyuk Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermally enhanced semiconductor package with at least one heat ext...
- Patent number 11,676,878
- Issue date Jun 13, 2023
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adapter board and method for making adapter board
- Patent number 11,665,820
- Issue date May 30, 2023
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Man-Zhi Peng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mechanical support within moulded chip package
- Patent number 11,659,663
- Issue date May 23, 2023
- Murata Manufacturing Co., Ltd.
- Kimmo Kaija
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermally enhanced semiconductor package with at least one heat ext...
- Patent number 11,646,242
- Issue date May 9, 2023
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Illumination assembly including thermal energy management
- Patent number 11,619,376
- Issue date Apr 4, 2023
- INNOTEC, CORP.
- Thomas J. Veenstra
- F21 - LIGHTING
Information Patent Grant
Thermally enhanced semiconductor package with at least one heat ext...
- Patent number 11,621,207
- Issue date Apr 4, 2023
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing an electromechanical structure and an arra...
- Patent number 11,516,920
- Issue date Nov 29, 2022
- TACTOTEK OY
- Mikko Heikkinen
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Application specific electronics packaging systems, methods and dev...
- Patent number 11,503,718
- Issue date Nov 15, 2022
- Molex, LLC
- Marko Spiegel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Camera module and molded circuit board assembly and manufacturing m...
- Patent number 11,477,354
- Issue date Oct 18, 2022
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu Wang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Thermally enhanced semiconductor package with at least one heat ext...
- Patent number 11,476,177
- Issue date Oct 18, 2022
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced semiconductor package with at least one heat ext...
- Patent number 11,443,999
- Issue date Sep 13, 2022
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced semiconductor package with at least one heat ext...
- Patent number 11,410,904
- Issue date Aug 9, 2022
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier for electrical/electronic parts for attachment in...
- Patent number 11,401,740
- Issue date Aug 2, 2022
- Kiekert AG
- Sascha Maciolowski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System for manufacturing an electromechanical structure
- Patent number 11,406,021
- Issue date Aug 2, 2022
- TACTOTEK OY
- Mikko Heikkinen
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
System for manufacturing an electromechanical structure
- Patent number 11,363,720
- Issue date Jun 14, 2022
- TACTOTEK OY
- Mikko Heikkinen
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Molded interconnect device
- Patent number 11,357,112
- Issue date Jun 7, 2022
- Molex, LLC
- Tsuey Choo Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermally enhanced semiconductor package with at least one heat ext...
- Patent number 11,328,974
- Issue date May 10, 2022
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced semiconductor package with at least one heat ext...
- Patent number 11,296,003
- Issue date Apr 5, 2022
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compact microelectronic integrated gas sensor
- Patent number 11,231,386
- Issue date Jan 25, 2022
- STMicroelectronics Pte Ltd
- Jerome Teysseyre
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
PATTERNED CONDUCTIVE ARTICLE
- Publication number 20240306290
- Publication date Sep 12, 2024
- 3M Innovative Properties Company
- Raymond P. Johnston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240292534
- Publication date Aug 29, 2024
- LG Innotek Co., Ltd.
- Il Sik NAM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BASE MEMBER, ELECTRONIC DEVICE, AND STRUCTURE
- Publication number 20240032190
- Publication date Jan 25, 2024
- Canon Kabushiki Kaisha
- KOICHI ODAGAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC APPARATUS
- Publication number 20230199961
- Publication date Jun 22, 2023
- Industrial Technology Research Institute
- Yu-Lin Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT CARRIER FOR ARRANGING ELECTRICAL COMPONENTS ON A CIRCUIT...
- Publication number 20230061125
- Publication date Mar 2, 2023
- HARTING AG
- Thomas HESS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING WIRING BOARD, WIRING BOARD, METHOD FOR MAN...
- Publication number 20230007781
- Publication date Jan 5, 2023
- FUJIKURA LTD.
- Kazutoshi Koshimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20220338346
- Publication date Oct 20, 2022
- LG Innotek Co., Ltd.
- Il Sik NAM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MAKING A MOLDED INTERCONNECT DEVICE
- Publication number 20220279656
- Publication date Sep 1, 2022
- Molex, LLC
- Tsuey Choo CHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PATTERNED CONDUCTIVE ARTICLE
- Publication number 20220167499
- Publication date May 26, 2022
- Raymond P. Johnston
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MECHANICAL SUPPORT WITHIN MOULDED CHIP PACKAGE
- Publication number 20220110213
- Publication date Apr 7, 2022
- Murata Manufacturing Co., Ltd.
- Kimmo KAIJA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMAGE SENSOR PACKAGES
- Publication number 20220093673
- Publication date Mar 24, 2022
- Samsung Electronics Co., Ltd.
- Raehyung DO
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Method for Manufacturing a Circuit Having a Lamination Layer Using...
- Publication number 20220087029
- Publication date Mar 17, 2022
- Ethertronics, Inc.
- Seung Hyuk Choi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
ADAPTER BOARD AND METHOD FOR MAKING ADAPTER BOARD
- Publication number 20220087020
- Publication date Mar 17, 2022
- QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
- MAN-ZHI PENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMALLY ENHANCED SEMICONDUCTOR PACKAGE WITH AT LEAST ONE HEAT EXT...
- Publication number 20210296199
- Publication date Sep 23, 2021
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR MOLDING AN FPC AND A PLASTIC PART
- Publication number 20210298179
- Publication date Sep 23, 2021
- DONGGUAN LUXSHARE PRECISION INDUSTRY CO. LTD.
- Jiaoping CAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADAPTER BOARD AND METHOD FOR MAKING ADAPTOR BOARD
- Publication number 20210235581
- Publication date Jul 29, 2021
- QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
- MAN-ZHI PENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPLICATION SPECIFIC ELECTRONICS PACKAGING SYSTEMS, METHODS AND DEV...
- Publication number 20210144861
- Publication date May 13, 2021
- Molex, LLC
- Marko SPIEGEL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPLICATION SPECIFIC ELECTRONICS PACKAGING SYSTEMS, METHODS AND DEV...
- Publication number 20200352032
- Publication date Nov 5, 2020
- Molex, LLC
- Marko SPIEGEL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN MOLDED SUBSTRATE AND MOUNTING STRUCTURE FOR CAPACITOR
- Publication number 20200227206
- Publication date Jul 16, 2020
- FANUC CORPORATION
- Yuuki INOUE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICRO POWER DISTRIBUTION BOXES AND METHODS OF MANUFACTURING SAME US...
- Publication number 20200196451
- Publication date Jun 18, 2020
- Molex, LLC
- Victor ZADEREJ
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMALLY ENHANCED PACKAGE AND PROCESS FOR MAKING THE SAME
- Publication number 20200176347
- Publication date Jun 4, 2020
- Qorvo US, Inc.
- Julio C. Costa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICE
- Publication number 20200066716
- Publication date Feb 27, 2020
- TEXAS INSTRUMENTS INCORPORATED
- YIQI TANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONTROL UNIT
- Publication number 20200045823
- Publication date Feb 6, 2020
- Jaguar Land Rover Limited
- Ashutosh TOMAR
- B60 - VEHICLES IN GENERAL
Information Patent Application
Method for Manufacturing a Circuit Having a Lamination Layer Using...
- Publication number 20200045827
- Publication date Feb 6, 2020
- Ethertronics, Inc.
- Seung Hyuk Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPLICATION SPECIFIC ELECTRONICS PACKAGING SYSTEMS, METHODS AND DEV...
- Publication number 20200022265
- Publication date Jan 16, 2020
- Molex, LLC
- Marko SPIEGEL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICE
- Publication number 20190363080
- Publication date Nov 28, 2019
- TEXAS INSTRUMENTS INCORPORATED
- YIQI TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED INTERCONNECT SUBSTRATE FOR A CABLE ASSEMBLY
- Publication number 20190273342
- Publication date Sep 5, 2019
- TE Connectivity Corporation
- Gustaf Emil Dill
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOLDED INTERCONNECT DEVICE AND METHOD OF MAKING SAME
- Publication number 20190166698
- Publication date May 30, 2019
- Molex, LLC
- Tsuey Choo CHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS FOR CARRYING OUT A MANUFACTURING METHOD ON AN ELECTRO CHE...
- Publication number 20190098763
- Publication date Mar 28, 2019
- TactoTek Oy
- Mikko Heikkinen
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
PCB Assembly with Molded Matrix Core
- Publication number 20190075655
- Publication date Mar 7, 2019
- Apple Inc.
- Albert Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Moulded substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Component carrier with embedded interposer laterally between electr...

Patterned article including electrically conductive elements

Molded article, electrical product and method for producing molded...

Patterned conductive article

Printed circuit board

Packaged semiconductor device

Thermally enhanced semiconductor package with at least one heat ext...

Thermally enhanced semiconductor package with at least one heat ext...

Imaging device for connection with a circuit element

Component carrier for arranging electrical components on a circuit...

Method for manufacturing a circuit having a lamination layer using...

Thermally enhanced semiconductor package with at least one heat ext...

Adapter board and method for making adapter board

Mechanical support within moulded chip package

Thermally enhanced semiconductor package with at least one heat ext...

Illumination assembly including thermal energy management

Thermally enhanced semiconductor package with at least one heat ext...

Method for manufacturing an electromechanical structure and an arra...

Application specific electronics packaging systems, methods and dev...

Camera module and molded circuit board assembly and manufacturing m...

Thermally enhanced semiconductor package with at least one heat ext...

Thermally enhanced semiconductor package with at least one heat ext...

Thermally enhanced semiconductor package with at least one heat ext...

Component carrier for electrical/electronic parts for attachment in...

System for manufacturing an electromechanical structure

System for manufacturing an electromechanical structure

Molded interconnect device

Thermally enhanced semiconductor package with at least one heat ext...

Thermally enhanced semiconductor package with at least one heat ext...

Compact microelectronic integrated gas sensor

Patents Applicationslast 30 patents

PATTERNED CONDUCTIVE ARTICLE

PRINTED CIRCUIT BOARD

BASE MEMBER, ELECTRONIC DEVICE, AND STRUCTURE

ELECTRONIC APPARATUS

COMPONENT CARRIER FOR ARRANGING ELECTRICAL COMPONENTS ON A CIRCUIT...

METHOD FOR MANUFACTURING WIRING BOARD, WIRING BOARD, METHOD FOR MAN...

PRINTED CIRCUIT BOARD

METHOD OF MAKING A MOLDED INTERCONNECT DEVICE

PATTERNED CONDUCTIVE ARTICLE

MECHANICAL SUPPORT WITHIN MOULDED CHIP PACKAGE

IMAGE SENSOR PACKAGES

Method for Manufacturing a Circuit Having a Lamination Layer Using...

ADAPTER BOARD AND METHOD FOR MAKING ADAPTER BOARD

THERMALLY ENHANCED SEMICONDUCTOR PACKAGE WITH AT LEAST ONE HEAT EXT...

DEVICE AND METHOD FOR MOLDING AN FPC AND A PLASTIC PART

ADAPTER BOARD AND METHOD FOR MAKING ADAPTOR BOARD

APPLICATION SPECIFIC ELECTRONICS PACKAGING SYSTEMS, METHODS AND DEV...

APPLICATION SPECIFIC ELECTRONICS PACKAGING SYSTEMS, METHODS AND DEV...

RESIN MOLDED SUBSTRATE AND MOUNTING STRUCTURE FOR CAPACITOR

MICRO POWER DISTRIBUTION BOXES AND METHODS OF MANUFACTURING SAME US...

THERMALLY ENHANCED PACKAGE AND PROCESS FOR MAKING THE SAME

PACKAGED SEMICONDUCTOR DEVICE

CONTROL UNIT

Method for Manufacturing a Circuit Having a Lamination Layer Using...

APPLICATION SPECIFIC ELECTRONICS PACKAGING SYSTEMS, METHODS AND DEV...

PACKAGED SEMICONDUCTOR DEVICE

MOLDED INTERCONNECT SUBSTRATE FOR A CABLE ASSEMBLY

MOLDED INTERCONNECT DEVICE AND METHOD OF MAKING SAME

APPARATUS FOR CARRYING OUT A MANUFACTURING METHOD ON AN ELECTRO CHE...

PCB Assembly with Molded Matrix Core