3660154

Information

• Patent Grant
• 3660154

• References
• Source

• Patent Number

  3,660,154

• Date Filed

  Not available

• Date Issued

  Tuesday, May 2, 1972
  52 years ago

• CPC

  • H01L29/207 - further characterised by the doping material
  • H01L21/00 - Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/34 - the devices having semiconductor bodies not provided for in groups H01L21/0405, H01L21/0445 , H01L21/06, H01L21/16 and H01L21/18 with or without impurities
  • H01L21/479 - Application of electric currents or fields
  • H01L29/22 - including, apart from doping materials or other impurities, only AIIBVI compounds
  • Y10S438/906 - Cleaning of wafer as interim step

• US Classifications

  • 438 - Semiconductor device manufacturing: process
  • 148 - Metal treatment
  • 257 - Active solid-state devices