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3756888
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Information
Patent Grant
3756888
References
Source
Patent Number
3,756,888
Date Filed
Not available
Date Issued
Tuesday, September 4, 1973
51 years ago
CPC
B32B38/06 - Embossing
B29C65/04 - Dielectric heating, e.g. high-frequency welding
B29C65/18 - using heated tools
B29C65/7441 - for making welds and cuts of other than simple rectilinear form
B29C66/1122 - Single lap to lap joints
B29C66/21 - said joint lines being formed by a single dot or dash or by several dots or dashes
B29C66/246 - said joint lines forming figures
B29C66/436 - Joining sheets for making articles comprising cushioning or padding materials, the weld being performed through the cushioning material
B29C66/4724 - said single elements being appliques
B29C66/727 - being porous
B29C66/80 - General aspects of machine operations or constructions and parts thereof
B29C66/8122 - characterised by the composition of the material constituting the pressing elements
B29C66/81419 - and flat
B29C66/81427 - comprising a single ridge
B29C66/8167 - Quick change joining tools or surfaces
B29C66/81821 - of the welding jaws
B29C66/81871 - of the welding jaws
B29C66/8322 - Joining or pressing tools reciprocating along one axis
B29C67/20 - for porous or cellular articles
B32B27/00 - Layered products comprising a layer of synthetic resin
B44C3/082 - comprising a cutting out operation
B44C3/085 - stamping
B29C35/12 - Dielectric heating
B29C59/02 - by mechanical means
B29C66/433 - Casing-in
B29C66/71 - characterised by the composition of the plastics material of the parts to be joined
B29C66/8165 - Carrier plates for mounting joining tool parts
B29L2031/722 - Decorative or ornamental articles
Y10T156/1023 - Surface deformation only [e.g., embossing]
Y10T156/1041 - Subsequent to lamination
Y10T156/1043 - Subsequent to assembly
Y10T156/1054 - and simultaneously bonding [e.g., cut-seaming]
US Classifications
156 - Adhesive bonding and miscellaneous chemical manufacture
428 - Stock material or miscellaneous articles
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