3822465

Information

• Patent Grant
• 3822465

• References
• Source

• Patent Number

  3,822,465

• Date Filed

  Not available

• Date Issued

  Tuesday, July 9, 1974
  50 years ago

• CPC

  • B23K20/10 - making use of vibrations
  • H01L2224/45015 - being circular
  • H01L2224/45147 - Copper (Cu) as principal constituent
  • H01L2224/45565 - Single coating layer
  • H01L2224/48455 - Details of wedge bonds
  • H01L2224/78315 - of the pressing surface
  • H01L2924/01015 - Phosphorus [P]
  • H01L2924/01019 - Potassium [K]
  • H01L2924/01039 - Yttrium [Y]
  • H01L2924/09701 - Low temperature co-fired ceramic [LTCC]

• US Classifications

  • 228 - Metal fusion bonding
  • 156 - Adhesive bonding and miscellaneous chemical manufacture