Details of wedge bonds

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H01L2224/48455

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/48455Details of wedge bonds

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 12,131,983
- Issue date Oct 29, 2024
- Rohm Co., Ltd.
- Katsutoki Shirai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Extendable inner lead for leaded package
- Patent number 12,125,780
- Issue date Oct 22, 2024
- NXP B.V.
- Mei Yeut Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages with electrical fuses
- Patent number 12,009,336
- Issue date Jun 11, 2024
- Texas Instruments Incorporated
- Mahmud Halim Chowdhury
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packaging extendable lead and method therefor
- Patent number 11,869,837
- Issue date Jan 9, 2024
- NXP B.V.
- Mei Yeut Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 11,830,845
- Issue date Nov 28, 2023
- TESSERA LLC
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wedge tool, bonding device, and bonding inspection method
- Patent number 11,756,919
- Issue date Sep 12, 2023
- Mitsubishi Electric Corporation
- Daisuke Imai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including vertical wire bonds
- Patent number 11,749,647
- Issue date Sep 5, 2023
- Western Digital Technologies, Inc.
- Xiaofeng Di
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 11,424,211
- Issue date Aug 23, 2022
- TESSERA LLC
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and wire bonding method
- Patent number 11,398,449
- Issue date Jul 26, 2022
- Kabushiki Kaisha Toshiba
- Kazuya Maruyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 10,833,044
- Issue date Nov 10, 2020
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate-less waveguide active circuit module
- Patent number 10,643,961
- Issue date May 5, 2020
- United States of America as represented by the Secretary of the Navy
- Jia-Chi S. Chieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 10,629,520
- Issue date Apr 21, 2020
- Rohm Co., Ltd.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate-less waveguide active circuit module with current mode po...
- Patent number 10,607,953
- Issue date Mar 31, 2020
- United States of America as represented by Secretary of the Navy
- Jia-Chi S. Chieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 10,593,643
- Issue date Mar 17, 2020
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 10,062,661
- Issue date Aug 28, 2018
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heavy-wire bond arrangement and method for producing same
- Patent number 9,992,861
- Issue date Jun 5, 2018
- Technische Universitat Berlin
- Andreas Middendorf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding apparatus and method of manufacturing semiconductor de...
- Patent number 9,899,348
- Issue date Feb 20, 2018
- Shinkawa Ltd.
- Naoki Sekine
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and production method therefor
- Patent number 9,837,373
- Issue date Dec 5, 2017
- Rohm Co., Ltd.
- Shoji Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a bondpad and bondpad
- Patent number 9,780,053
- Issue date Oct 3, 2017
- Infineon Technologies AG
- Magdalena Hoier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the semiconductor...
- Patent number 9,741,805
- Issue date Aug 22, 2017
- Fuji Electric Co., Ltd.
- Takeyoshi Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 9,691,731
- Issue date Jun 27, 2017
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor devices having ribbon wires
- Patent number 9,570,325
- Issue date Feb 14, 2017
- FREESCALE SEMICONDUCTOR, INC.
- Liqiang Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and production method therefor
- Patent number 9,543,239
- Issue date Jan 10, 2017
- Rohm Co., Ltd.
- Shoji Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip structure having bonding wire
- Patent number 9,484,315
- Issue date Nov 1, 2016
- Industrial Technology Research Institute
- Yu-Min Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device package
- Patent number 9,437,791
- Issue date Sep 6, 2016
- LG Innotek Co., Ltd
- Byung Mok Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding structure of semiconductor device and wire bonding method
- Patent number 9,379,085
- Issue date Jun 28, 2016
- Rohm Co., Ltd.
- Ryuji Tsubaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 9,379,086
- Issue date Jun 28, 2016
- Shinkawa Ltd.
- Shinji Kumamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coated bonding wire and methods for bonding using same
- Patent number 9,368,470
- Issue date Jun 14, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Chu-Chung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and production method therefor
- Patent number 9,293,435
- Issue date Mar 22, 2016
- Rohm Co., Ltd.
- Shoji Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing bonding connection of semiconductor device
- Patent number 9,059,182
- Issue date Jun 16, 2015
- Infineon Technologies AG
- Hubert Maier
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGES WITH ELECTRICAL FUSES
- Publication number 20240332243
- Publication date Oct 3, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Mahmud Halim CHOWDHURY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
- Publication number 20240203930
- Publication date Jun 20, 2024
- Adeia Semiconductor Solutions LLC
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXTENDABLE INNER LEAD FOR LEADED PACKAGE
- Publication number 20240105579
- Publication date Mar 28, 2024
- NXP B.V.
- Mei Yeut Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR EQUIPMENT
- Publication number 20240047438
- Publication date Feb 8, 2024
- Rohm Co., Ltd.
- Hiroaki MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240030298
- Publication date Jan 25, 2024
- ROHM CO., LTD.
- Yosui FUTAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING BONDING COVERS
- Publication number 20230343739
- Publication date Oct 26, 2023
- Semiconductor Components Industries, LLC
- Wuxing Xia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGING EXTENDABLE LEAD AND METHOD THEREFOR
- Publication number 20230027248
- Publication date Jan 26, 2023
- NXP B.V.
- Mei Yeut Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220301985
- Publication date Sep 22, 2022
- Rohm Co., Ltd.
- Katsutoki SHIRAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING VERTICAL WIRE BONDS
- Publication number 20210366875
- Publication date Nov 25, 2021
- Western Digital Technologies, Inc.
- Xiaofeng Di
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND WIRE BONDING METHOD
- Publication number 20210288019
- Publication date Sep 16, 2021
- Kabushiki Kaisha Toshiba
- Kazuya MARUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WEDGE TOOL, BONDING DEVICE, AND BONDING INSPECTION METHOD
- Publication number 20200395333
- Publication date Dec 17, 2020
- Mitsubishi Electric Corporation
- Daisuke IMAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
- Publication number 20200168579
- Publication date May 28, 2020
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLY WITH THREE DIMENSIONAL INTEGRATION AND METHO...
- Publication number 20180374827
- Publication date Dec 27, 2018
- Bridge Semiconductor Corporation
- Charles W.C. LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
- Publication number 20180350766
- Publication date Dec 6, 2018
- Tessera, Inc.
- Hiroaki SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180342442
- Publication date Nov 29, 2018
- ROHM CO., LTD.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLY WITH THREE DIMENSIONAL INTEGRATION AND METHO...
- Publication number 20170133353
- Publication date May 11, 2017
- Bridge Semiconductor Corporation
- Charles W.C. LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20160351537
- Publication date Dec 1, 2016
- SHINKAWA LTD.
- Naoki SEKINE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
- Publication number 20160211237
- Publication date Jul 21, 2016
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20160163806
- Publication date Jun 9, 2016
- Fuji Electric Co., Ltd.
- Takeyoshi NISHIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE HAVING BONDING WIRE
- Publication number 20160163665
- Publication date Jun 9, 2016
- Industrial Technology Research Institute
- Yu-Min Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming a bondpad and bondpad
- Publication number 20160141259
- Publication date May 19, 2016
- INFINEON TECHNOLOGIES AG
- Magdalena HOIER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COATED BONDING WIRE AND METHODS FOR BONDING USING SAME
- Publication number 20160126208
- Publication date May 5, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Chu-Chung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COATED WIRE FOR BONDING APPLICATIONS
- Publication number 20150360316
- Publication date Dec 17, 2015
- Heraeus Deutschland GmbH & Co. KG
- Eugen MILKE
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
LIGHT EMITTING DIODE DEVICE
- Publication number 20140291706
- Publication date Oct 2, 2014
- CHEN-HSIU LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE SYSTEM HAVING ENCAPSULATED THROUGH WIRE INTERC...
- Publication number 20140225259
- Publication date Aug 14, 2014
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Application
LIGHT EMITTING DEVICE PACKAGE
- Publication number 20140167095
- Publication date Jun 19, 2014
- LG Innotek Co., Ltd.
- Byung Mok KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A THROUGH WIRE INTERCONNECT (TWI) ON A SEMIC...
- Publication number 20140038406
- Publication date Feb 6, 2014
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Application
HEAVY-WIRE BOND ARRANGEMENT AND METHOD FOR PRODUCING SAME
- Publication number 20130220673
- Publication date Aug 29, 2013
- Technische Universitaet Berlin
- Andreas Middendorf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING JOINT STRUCTURE OF JOINT PAD, AND METHOD FOR PREPARING...
- Publication number 20130000966
- Publication date Jan 3, 2013
- Samsung Electro-Mechanics CO., LTD.
- Dong Jun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING STACKED SEMICONDUCTOR SYSTEM WITH ENCAPSULAT...
- Publication number 20120288997
- Publication date Nov 15, 2012
- Micron Technology, Inc.
- DAVID R. HEMBREE
- G01 - MEASURING TESTING

Details of wedge bonds

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Extendable inner lead for leaded package

Packages with electrical fuses

Semiconductor device packaging extendable lead and method therefor

Package-on-package assembly with wire bonds to encapsulation surface

Wedge tool, bonding device, and bonding inspection method

Semiconductor device including vertical wire bonds

Package-on-package assembly with wire bonds to encapsulation surface

Semiconductor device and wire bonding method

Package-on-package assembly with wire bonds to encapsulation surface

Substrate-less waveguide active circuit module

Semiconductor device and method for manufacturing the same

Substrate-less waveguide active circuit module with current mode po...

Package-on-package assembly with wire bonds to encapsulation surface

Package-on-package assembly with wire bonds to encapsulation surface

Heavy-wire bond arrangement and method for producing same

Wire bonding apparatus and method of manufacturing semiconductor de...

Semiconductor device and production method therefor

Method of forming a bondpad and bondpad

Semiconductor device and method for manufacturing the semiconductor...

Package-on-package assembly with wire bonds to encapsulation surface

Packaged semiconductor devices having ribbon wires

Semiconductor device and production method therefor

Chip structure having bonding wire

Light emitting device package

Wire bonding structure of semiconductor device and wire bonding method

Method of manufacturing semiconductor device

Coated bonding wire and methods for bonding using same

Semiconductor device and production method therefor

Method for producing bonding connection of semiconductor device

Patents Applicationslast 30 patents

PACKAGES WITH ELECTRICAL FUSES

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE

EXTENDABLE INNER LEAD FOR LEADED PACKAGE

SEMICONDUCTOR EQUIPMENT

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE INCLUDING BONDING COVERS

SEMICONDUCTOR DEVICE PACKAGING EXTENDABLE LEAD AND METHOD THEREFOR

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE INCLUDING VERTICAL WIRE BONDS

SEMICONDUCTOR DEVICE AND WIRE BONDING METHOD

WEDGE TOOL, BONDING DEVICE, AND BONDING INSPECTION METHOD

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE

SEMICONDUCTOR ASSEMBLY WITH THREE DIMENSIONAL INTEGRATION AND METHO...

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR ASSEMBLY WITH THREE DIMENSIONAL INTEGRATION AND METHO...

WIRE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DE...

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR...

CHIP STRUCTURE HAVING BONDING WIRE

Method of forming a bondpad and bondpad

COATED BONDING WIRE AND METHODS FOR BONDING USING SAME

COATED WIRE FOR BONDING APPLICATIONS

LIGHT EMITTING DIODE DEVICE

SEMICONDUCTOR MODULE SYSTEM HAVING ENCAPSULATED THROUGH WIRE INTERC...

LIGHT EMITTING DEVICE PACKAGE

METHOD FOR FABRICATING A THROUGH WIRE INTERCONNECT (TWI) ON A SEMIC...

HEAVY-WIRE BOND ARRANGEMENT AND METHOD FOR PRODUCING SAME

WIRE BONDING JOINT STRUCTURE OF JOINT PAD, AND METHOD FOR PREPARING...

METHOD FOR FABRICATING STACKED SEMICONDUCTOR SYSTEM WITH ENCAPSULAT...