3846167

Information

• Patent Grant
• 3846167

• References
• Source

• Patent Number

  3,846,167

• Date Filed

  Not available

• Date Issued

  Tuesday, November 5, 1974
  50 years ago

• CPC

  • H01L27/118 - Masterslice integrated circuits
  • H01L21/00 - Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/8222 - Bipolar technology
  • H01L27/00 - Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate
  • Y10S148/02 - Contacts, special
  • Y10S148/145 - Shaped junctions
  • Y10S148/162 - Testing steps

• US Classifications

  • 438 - Semiconductor device manufacturing: process
  • 148 - Metal treatment
  • 205 - Electrolysis: processes, compositions used therein, and methods of preparing the compositions
  • 257 - Active solid-state devices