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YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10USPC classification Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10S148/00Metal treatment

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Y10S148/02Contacts, special

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Patents Grantslast 30 patents

Information Patent Grant
Nitride compound semiconductor element and method for manufacturing...
- Patent number 8,306,085
- Issue date Nov 6, 2012
- Panasonic Corporation
- Yoshiaki Hasegawa
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Nitride compound semiconductor element and method for manufacturing...
- Patent number 8,039,283
- Issue date Oct 18, 2011
- Panasonic Corporation
- Yoshiaki Hasegawa
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Multilayer film with stack of nanometer-scale thicknesses
- Patent number 7,847,368
- Issue date Dec 7, 2010
- Hewlett-Packard Development Company, L.P.
- Paval Kornilovich
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for fabricating semiconductor integrated circuit device
- Patent number 7,799,690
- Issue date Sep 21, 2010
- Renesas Electronics Corporation
- Yoshikazu Tanabe
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of forming multilayer film
- Patent number 7,375,012
- Issue date May 20, 2008
- Pavel Kornilovich
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for fabricating semiconductor integrated circuit device
- Patent number 7,250,376
- Issue date Jul 31, 2007
- Renesas Technology Corp.
- Yoshikazu Tanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor integrated circuit device
- Patent number 7,053,007
- Issue date May 30, 2006
- Renesas Technology Corp.
- Yoshikazu Tanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor integrated circuit device
- Patent number 7,008,880
- Issue date Mar 7, 2006
- Renesas Technology Corp.
- Yoshikazu Tanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor integrated circuit device
- Patent number 6,962,880
- Issue date Nov 8, 2005
- Renesas Technology Corp.
- Yoshikazu Tanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor integrated circuit device
- Patent number 6,962,881
- Issue date Nov 8, 2005
- Renesas Technology Corp.
- Yoshikazu Tanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor integrated circuit device
- Patent number 6,855,642
- Issue date Feb 15, 2005
- Renesas Technology Corp.
- Yoshikazu Tanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for batch processing semiconductor substrates...
- Patent number 6,673,699
- Issue date Jan 6, 2004
- ADC Telecommunications, Inc.
- Kevin J. Hubbard
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Laser alignment target
- Patent number 6,624,524
- Issue date Sep 23, 2003
- Altera Corporation
- Raminda U. Madurawe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor integrated circuit device
- Patent number 6,596,650
- Issue date Jul 22, 2003
- Hitachi, Ltd.
- Yoshikazu Tanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor integrated circuit device
- Patent number 6,569,780
- Issue date May 27, 2003
- Hitachi, Ltd.
- Yoshikazu Tanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor integrated circuit drive using...
- Patent number 6,528,431
- Issue date Mar 4, 2003
- Hitachi, Ltd.
- Yoshikazu Tanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor integrated circuit device
- Patent number 6,518,201
- Issue date Feb 11, 2003
- Hitachi, Ltd.
- Yoshikazu Tanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor integrated circuit device
- Patent number 6,518,202
- Issue date Feb 11, 2003
- Hitachi, Ltd.
- Yoshikazu Tanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for batch processing semiconductor substrates...
- Patent number 6,451,120
- Issue date Sep 17, 2002
- ADC Telecommunications, Inc.
- Kevin J. Hubbard
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method for fabricating semiconductor integrated circuit device
- Patent number 6,417,114
- Issue date Jul 9, 2002
- Hitachi, Ltd.
- Yoshikazu Tanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Strapping via for interconnecting integrated circuit structures
- Patent number 6,350,645
- Issue date Feb 26, 2002
- Integrated Device Technology, Inc.
- Chuen-Der Lien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Butted contact resistance of an SRAM by double VCC implantation
- Patent number 6,310,397
- Issue date Oct 30, 2001
- Taiwan Semiconductor Manufacturing Company
- Yeong-Kong Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor integrated circuit device
- Patent number 6,239,041
- Issue date May 29, 2001
- Hitachi, Ltd.
- Yoshikazu Tanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor acceleration sensor
- Patent number 6,124,148
- Issue date Sep 26, 2000
- Seiko Instruments R&D Center Inc.
- Masataka Shinogi
- G01 - MEASURING TESTING
Information Patent Grant
Modification of interfacial fields between dielectrics and semicond...
- Patent number 6,117,749
- Issue date Sep 12, 2000
- National Semiconductor Corporation
- Sheldon Aronowitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Simplified process for the fabrication of deep clear laser marks us...
- Patent number 6,063,695
- Issue date May 16, 2000
- Taiwan Semiconductor Manufacturing Company
- Chung-Te Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for improving the butted contact resistance of an SRAM by do...
- Patent number 6,057,186
- Issue date May 2, 2000
- Taiwan Semiconductor Manufacturing Company
- Yeong-Rong Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor buried contact with a removable...
- Patent number 6,010,953
- Issue date Jan 4, 2000
- Micron Technology, Inc.
- Kirk D. Prall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser alignment target
- Patent number 6,002,182
- Issue date Dec 14, 1999
- Altera Corporation
- Raminda U. Madurawe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Static random access memory design and fabrication process featurin...
- Patent number 5,998,249
- Issue date Dec 7, 1999
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jhon-Jhy Liaw
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
NITRIDE COMPOUND SEMICONDUCTOR ELEMENT AND METHOD FOR MANUFACTURING...
- Publication number 20120002693
- Publication date Jan 5, 2012
- PANASONIC CORPORATION
- Yoshiaki HASEGAWA
- B82 - NANO-TECHNOLOGY
Information Patent Application
NITRIDE COMPOUND SEMICONDUCTOR ELEMENT AND METHOD FOR MANUFACTURING...
- Publication number 20100226401
- Publication date Sep 9, 2010
- Yoshiaki Hasegawa
- B82 - NANO-TECHNOLOGY
Information Patent Application
MULTILAYER FILM
- Publication number 20090126977
- Publication date May 21, 2009
- Paval Kornilovich
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for fabricating semiconductor intergrated circuit device
- Publication number 20080045027
- Publication date Feb 21, 2008
- Yoshikazu Tanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multilayer film
- Publication number 20060194420
- Publication date Aug 31, 2006
- Pavel Kornilovich
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for fabricating semiconductor integrated circuit device
- Publication number 20050227501
- Publication date Oct 13, 2005
- Yoshikazu Tanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating semiconductor integrated circuit device
- Publication number 20050208731
- Publication date Sep 22, 2005
- Yoshikazu Tanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating semiconductor integrated circuit device
- Publication number 20040161945
- Publication date Aug 19, 2004
- Yoshikazu Tanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating semiconductor integrated circuit device
- Publication number 20040157468
- Publication date Aug 12, 2004
- Yoshikazu Tanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating semiconductor intergrated circuit device
- Publication number 20040157467
- Publication date Aug 12, 2004
- Yoshikazu Tanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating semiconductor integrated circuit device
- Publication number 20030219995
- Publication date Nov 27, 2003
- Yoshikazu Tanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for batch processing semiconductor substrates...
- Publication number 20020197757
- Publication date Dec 26, 2002
- ADC Telecommunications, Inc.
- Kevin J. Hubbard
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Method for fabricating semiconductor integrated circuit device
- Publication number 20020009898
- Publication date Jan 24, 2002
- Yoshikazu Tanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating semiconductor integrated circuit device
- Publication number 20020004315
- Publication date Jan 10, 2002
- Yoshikazu Tanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating semiconductor integrated circuit device
- Publication number 20010010975
- Publication date Aug 2, 2001
- Yoshikazu Tanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating semiconductor integrated circuit device
- Publication number 20010009813
- Publication date Jul 26, 2001
- Yoshikazu Tanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating semiconductor integrated circuit device
- Publication number 20010006853
- Publication date Jul 5, 2001
- Yoshikazu Tanabe
- H01 - BASIC ELECTRIC ELEMENTS

Contacts, special

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Nitride compound semiconductor element and method for manufacturing...

Nitride compound semiconductor element and method for manufacturing...

Multilayer film with stack of nanometer-scale thicknesses

Method for fabricating semiconductor integrated circuit device

Method of forming multilayer film

Method for fabricating semiconductor integrated circuit device

Method for fabricating semiconductor integrated circuit device

Method for fabricating semiconductor integrated circuit device

Method for fabricating semiconductor integrated circuit device

Method for fabricating semiconductor integrated circuit device

Method for fabricating semiconductor integrated circuit device

Apparatus and method for batch processing semiconductor substrates...

Laser alignment target

Method for fabricating semiconductor integrated circuit device

Method for fabricating semiconductor integrated circuit device

Method for fabricating semiconductor integrated circuit drive using...

Method for fabricating semiconductor integrated circuit device

Method for fabricating semiconductor integrated circuit device

Apparatus and method for batch processing semiconductor substrates...

Method for fabricating semiconductor integrated circuit device

Strapping via for interconnecting integrated circuit structures

Butted contact resistance of an SRAM by double VCC implantation

Method for fabricating semiconductor integrated circuit device

Method of manufacturing semiconductor acceleration sensor

Modification of interfacial fields between dielectrics and semicond...

Simplified process for the fabrication of deep clear laser marks us...

Method for improving the butted contact resistance of an SRAM by do...

Method for forming a semiconductor buried contact with a removable...

Laser alignment target

Static random access memory design and fabrication process featurin...

Patents Applicationslast 30 patents

NITRIDE COMPOUND SEMICONDUCTOR ELEMENT AND METHOD FOR MANUFACTURING...

NITRIDE COMPOUND SEMICONDUCTOR ELEMENT AND METHOD FOR MANUFACTURING...

MULTILAYER FILM

Method for fabricating semiconductor intergrated circuit device

Multilayer film

Method for fabricating semiconductor integrated circuit device

Method for fabricating semiconductor integrated circuit device

Method for fabricating semiconductor integrated circuit device

Method for fabricating semiconductor integrated circuit device

Method for fabricating semiconductor intergrated circuit device

Method for fabricating semiconductor integrated circuit device

Apparatus and method for batch processing semiconductor substrates...

Method for fabricating semiconductor integrated circuit device

Method for fabricating semiconductor integrated circuit device

Method for fabricating semiconductor integrated circuit device

Method for fabricating semiconductor integrated circuit device

Method for fabricating semiconductor integrated circuit device