3905844

Information

• Patent Grant
• 3905844

• References
• Source

• Patent Number

  3,905,844

• Date Filed

  Not available

• Date Issued

  Tuesday, September 16, 1975
  49 years ago

• CPC

  • H01L21/00 - Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/185 - Joining of semiconductor bodies for junction formation
  • H01L29/00 - Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier
  • Y10S148/035 - Diffusion through a layer
  • Y10S148/085 - Isolated-integrated
  • Y10S148/107 - Melt
  • Y10S148/135 - Removal of substrate

• US Classifications

  • 438 - Semiconductor device manufacturing: process
  • 148 - Metal treatment
  • 257 - Active solid-state devices