3912153

Information

• Patent Grant
• 3912153

• References
• Source

• Patent Number

  3,912,153

• Date Filed

  Not available

• Date Issued

  Tuesday, October 14, 1975
  49 years ago

• CPC

  • H01L21/67144 - Apparatus for mounting on conductive members
  • B23K1/012 - Soldering with the use of hot gas
  • H05K3/3421 - Leaded components
  • H05K3/3494 - Heating methods for reflowing of solder
  • H05K2201/09072 - Hole or recess under component or special relationship between hole and component
  • H05K2201/09418 - Special orientation of pads, lands or terminals of component
  • H05K2201/09709 - Staggered pads, lands or terminals Parallel conductors in different planes
  • H05K2203/0195 - Tool for a process not provided for in H05K3/00
  • H05K2203/0475 - Molten solder just before placing the component
  • H05K2203/081 - Blowing of gas
  • Y02P70/613 - involving the assembly of several electronic elements

• US Classifications

  • 228 - Metal fusion bonding