ADDITIONAL STRAY CAPACITOR AS ANOTHER TUNING KNOB FOR 1-SUPPLY EV SOURCE

BACKGROUND
Field of the Disclosure

The present disclosure relates generally to power supplies. More specifically, but without limitation, the present disclosure relates to controlling an application of power to a load.

Background

Many types of semiconductor devices are fabricated using plasma-based etching techniques. If it is a conductor that is etched, a negative voltage with respect to ground may be applied to the conductive substrate to create a substantially uniform negative voltage across the surface of the substrate conductor, which attracts positively charged ions toward the conductor, and as a consequence, the positive ions that impact the conductor have substantially the same energy.

If the substrate is a dielectric, however, a non-varying voltage is ineffective to place a voltage across the surface of the substrate. But an alternating current (AC) voltage (e.g., high frequency AC or time varying periodic voltage waveform may be applied by a bias supply to the conductive plate (or chuck) so that the AC field induces a voltage on the surface of the substrate. During a negative portion of the applied waveform, the surface of the substrate will be charged negatively, which causes ions to be attracted toward the negatively-charged surface during the negative portion of the periodic cycle. And when the ions impact the surface of the substrate, the impact dislodges material from the surface of the substrate—effectuating the etching.

During operation of a bias supply, the bias supply undergoes state changes, and the periodic waveform may by changed, consistent with state changes, to effectuate different ion energy distribution functions (IEDFs). For example, feature profile, and selectivity to a mask and a stop-layer may be controlled by making state changes to the bias supply to adjust the IEDF.

In some circumstances, a particular distribution of ion energies (or IEDF) may be desired, which may require accurate control of the sheath voltage (V_sheath), which generally refers to the potential difference (or voltage drop) from the plasma to the substrate surface. A bias supply may be utilized to control the voltage drop across the sheath, and some bias supplies rely upon a fundamental frequency of the voltage waveform that is applied to achieve desired sheath voltage(s). But some bias supply topologies are limited by a range of frequencies they can provide, and some instances, a satellite bias supply is frequency-synchronized to a main bias supply, so the satellite bias supply may be unable to adjust its frequency. As a consequence, new technology is needed to enable bias supplies to adjust the waveform they apply when frequency control is limited.

SUMMARY

The following summary should not be considered an extensive overview relating to all contemplated aspects and/or embodiments, nor should the following summary be regarded to identify key or critical elements relating to all contemplated aspects and/or embodiments or to delineate the scope associated with any particular aspect and/or embodiment. Accordingly, the following summary has the sole purpose to present certain concepts relating to one or more aspects and/or embodiments relating to the mechanisms disclosed herein in a simplified form to precede the detailed description presented below.

An aspect may be characterized as a bias supply system comprising an output node, a return node, a bias supply configured to apply an asymmetric periodic voltage waveform between the output node and the return node, a variable capacitance coupled between the output node and the return node, and a controller coupled to the variable capacitance. The controller is configured to receive a setting that defines a slope of a workpiece voltage, monitor electrical parameters at the output node to obtain an indication of an actual slope of the workpiece voltage, and control the variable capacitance so the actual slope of the workpiece voltage approaches the slope defined by the setting.

Another aspect may be characterized as a method for biasing a substrate comprising coupling an output node and a return node of a bias supply to a plasma processing chamber, applying, with the bias supply, an asymmetric periodic voltage waveform across the output node and the return node to a plasma processing chamber, receiving a setting that defines a slope of a voltage at a surface of a workpiece in the plasma processing chamber, monitoring electrical parameters at the output node to obtain an indication of an actual slope of the voltage at the surface of the workpiece, and controlling a variable capacitance positioned across the output node and the return node so the actual slope of the workpiece voltage approaches the slope defined by the setting.

Another aspect disclosed herein may be characterized as a non-transient processor readable storage medium encoded with processor readable instructions, the instructions comprising instructions to apply, with a bias supply, an asymmetric periodic voltage waveform across an output node and a return node of the bias supply, receive a workpiece-voltage setting that defines a slope of a voltage at a surface of a workpiece, monitor electrical parameters at the output node to obtain an indication of an actual slope of the voltage at the surface of the workpiece, and control a variable capacitance positioned across the output node and the return node so the actual slope of the workpiece voltage approaches the slope defined by the workpiece-voltage setting.

These and other features, and characteristics of the present technology, as well as the methods of operation and functions of the related elements of structure and the combination of parts and economies of manufacture, will become more apparent upon consideration of the following description and the appended claims with reference to the accompanying drawings, all of which form a part of this specification, wherein like reference numerals designate corresponding parts in the various figures. It is to be expressly understood, however, that the drawings are for the purpose of illustration and description only and are not intended as a definition of the limits of the invention. As used in the specification and in the claims, the singular form of ‘a’, ‘an’, and ‘the’ include plural referents unless the context clearly dictates otherwise.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a block diagram depicting an exemplary plasma processing environment utilizing one or more bias supplies, according to various aspects of the present disclosure.

FIG. 2 is a schematic diagram depicting an example of a bias supply system.

FIG. 3 is a schematic diagram electrically representing aspects of a bias supply system and plasma processing chamber.

FIG. 4 depicts conceptual graphs of voltage and current waveforms generated by a bias supply system.

FIG. 5 depicts conceptual graphs of voltage and current waveforms generated by another bias supply system.

FIG. 6 is a block diagram depicting a control architecture according to various aspects of the disclosure.

FIG. 7 is a flowchart depicting control aspects of the disclosure.

FIG. 8 is a block diagram depicting control aspects associated with a mode of operating a bias supply system.

FIG. 9 is a flowchart depicting an example for controlling variable capacitors according to various aspects of the disclosure.

FIG. 10 is another flowchart depicting a method for controlling a variable capacitance and frequency of a bias supply system.

FIG. 11A is a schematic representation of a bias supply;

FIG. 11B is a schematic representation of another bias supply;

FIG. 12 illustrates a block diagram depicting components that may be utilized to implement control aspects disclosed herein, according to various aspects of the disclosure.

FIG. 13 is a graph depicting operational aspects of the present disclosure.

DETAILED DESCRIPTION

The word “exemplary” is used herein to mean “serving as an example, instance, or illustration.” Any embodiment described herein as “exemplary” is not necessarily to be construed as preferred or advantageous over other embodiments.

Preliminary note: the flowcharts and block diagrams in the following Figures illustrate the architecture, functionality, and operation of possible implementations of systems, methods and computer program products according to various embodiments. In this regard, some blocks in these flowcharts or block diagrams may represent a module, segment, or portion of code, which comprises one or more executable instructions for implementing the specified logical function(s). The instructions may be executable by a processor or may be used to program a field programmable gate array. It should also be noted that, in some alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved. It will also be noted that each block of the block diagrams and/or flowchart illustrations, and combinations of blocks in the block diagrams and/or flowchart illustrations, can be implemented by special purpose hardware-based systems that perform the specified functions or acts, or combinations of special purpose hardware and computer instructions.

For the purposes of this disclosure, “source generators” and “excitation supplies” are those whose energy is primarily directed to generating and sustaining the plasma, while “bias supplies” are those whose energy is primarily directed to generating a surface potential for attracting ions and electrons from the plasma. As used herein, the terms “workpiece,” “substrate,” “wafer,” or “wafer substrate” may be used interchangeably throughout the disclosure.

Referring first to FIG. 1, shown is an exemplary plasma processing environment 100, such as a deposition or etch system, in which one or more bias supplies may be utilized. The plasma processing environment 100 may include many pieces of equipment coupled directly and indirectly to a plasma processing chamber 101, within which a volume containing a plasma 102 and workpiece 103 (e.g., a wafer or substrate) and electrodes 104 (which may be embedded in a substrate support) are contained. The equipment may include vacuum handling and gas delivery equipment (not shown), one or more bias supplies 108, 109 one or more source generators 112, and one or more source matching networks 113. In many applications, power from a single source generator 112 is connected to one or multiple source electrodes 105. The source generator 112 may be a higher frequency RF generator (e.g., 13.56 MHz to 120 MHz). The electrode 105 generically represents what may be implemented with an inductively coupled plasma (ICP) source, a dual capacitively-coupled plasma source (CCP) having a secondary top electrode biased at another RF frequency, a helicon plasma source, a microwave plasma source, a magnetron, or some other independently operated source of plasma energy.

In variations of the system depicted in FIG. 1, the source generator 112 and source matching network 113 may be replaced by, or augmented with, a remote plasma source. And other variations of the system may include only a single bias supply 108. It should be recognized that many other variations of the plasma processing environment depicted in FIG. 1 may be utilized. As examples without limitation, U.S. Pat. No. 10,707,055, issued Jul. 7, 2020, and U.S. Pat. No. 10,811,227, issued Oct. 20, 2020, both of which are incorporated by reference in their entirety, disclose various types of system designs.

It should also be recognized that, while the following disclosure generally refers to plasma-based workpiece processing, implementations can include any substrate processing within a plasma chamber. In some instances, objects other than a substrate can be processed using the systems, methods, and apparatus herein disclosed. In other words, this disclosure applies to plasma processing of any object within a sub-atmospheric plasma processing chamber to affect a surface change, subsurface change, deposition or removal by physical or chemical means.

Some currently used techniques often apply a time-varying radio frequency (RF) signal, such as a sinusoidal wave, as a substrate bias. This type of sinusoidal RF bias produces a time-varying substrate voltage that accelerates ions to the workpiece surface, but the sinusoidal waveform may produce a broad, uncontrolled ion energy distribution. In contrast, consistent with aspects of the present disclosure, an asymmetric periodic waveform may be utilized to apply the substrate bias, which serves to enhance the plasma etch and deposition processes as compared to the prior art. For example, an asymmetric waveform helps alleviate one or more of the issues seen in the prior art, most notably, the broad, uncontrolled ion energy distributions commonly associated with a sinewave bias. In this way, the bias supplies of the present disclosure help provide direct control of ion energy distributions by delivering a controlled, asymmetric, periodic waveform.

As shown in FIG. 1, there may be multiple bias supplies that are used to produce corresponding asymmetric waveforms. Although more than two bias supplies may be utilized, FIG. 1 depicts a main bias supply 108 and a satellite bias supply 109. The main bias supply 108 in the depicted system may establish a frequency of the asymmetric, periodic waveforms that are applied to the plasma processing chamber 101.

More specifically, the main bias supply 108 may provide a synchronization signal 115 (that defines a synchronization frequency) to the satellite bias supply 109 to enable the asymmetric periodic waveform that is applied by the satellite bias supply 109 to be synchronized with the asymmetric periodic waveform that is applied by the main bias supply 108. As is recognized by those of ordinary skill in the art, this synchronization is generally beneficial, but in some bias supply topologies, a frequency of the asymmetric periodic waveform is a control parameter that is used to achieve a desired sheath voltage (or range of sheath voltages) in order to produce a desired voltage (or range of voltages) at a surface of the workpiece 103 in order to produce a desired distribution of ion energies. But the satellite bias supply 109 is limited to applying the frequency established by the main bias supply 108, and as a consequence, the frequency of the satellite bias supply 109 may be unable to be controlled to achieve a desired sheath voltage.

Even outside of the context of the main bias supply 108 controlling a frequency of the satellite bias supply 109, a single bias supply may be limited by a range of asymmetric periodic waveform frequencies that it may apply, and as a consequence, even a single bias supply may be unable to be controlled to achieve a desired sheath voltage. For example, if the plasma processing chamber has a high chuck capacitance, it is easier to reach a bias supply's low limit of its fundamental frequency before being able to obtain to obtain a desired sheath voltage.

To address the problems associated with the frequency limitations that bias supplies may have, a variable capacitance may be added at the output of a bias supply (e.g., the bias supply 109) that can be tuned to shift the frequency range required to achieve a desired sheath voltage or range of sheath voltages. The variable capacitance may also be varied to control the sheath voltage when the bias supply is operating at a fixed fundamental frequency.

Referring to FIG. 2 for example, shown is a bias supply system 200 that comprises a controllable capacitance 250 that is coupled between an output node 210 and a return node 212. The depicted bias supply system 200 may be implemented within a single bias supply housing, and in these implementations, the bias supply system 200 may also be characterized as a bias supply. In other implementations, the variable capacitance 250 may implemented as an external variable capacitance that is located outside of a bias supply housing 208 and the remaining components depicted in FIG. 2 may be implemented with a bias supply housing as a part of a bias supply. The components within the bias supply housing 208 make up a bias supply, and as a consequence, these components are also referred to herein as a bias supply 208.

The bias supply system 200 generally represents many variations of bias supply systems described further herein to apply a controllable asymmetric periodic voltage waveform. As shown, the bias supply system includes the output node 210 (also referred to as an output node 210), the return node 212, a switch network 220, and a series combination of an inductance 214 and a power supply 216 (also referred to herein as V_supply216) that is coupled between the output node 210 and the return node 212. In general, the bias supply system 200 functions to apply an asymmetric periodic voltage function between the output node 210 and the return node 212. Output current, i_out, delivered to a load through the output node 210 is returned to the bias supply 208 through the return node 212 that may be common with the load. In some cases, the load is a plasma load.

FIG. 2 also depicts examples of electrical parameters that are associated with the bias supply system 200 including an inductor voltage, v_b, that is a voltage across the inductance 214, which may be measured as the voltage between the output node 210 and the negative node of the power supply 216. In addition, inductance current, i_b=i_comp, that flows through the inductance 214 may be measured along the current path that includes the inductance 214 and the power supply 216. Yet another electrical parameter that may be measured is output current, i_out, which may be measured along a current path, as shown, between the switch network 220 and the output node 210. In addition, the output voltage, v_out, is another electrical parameter that may be measured and utilized as described herein. For example, v_outmay be the voltage (or potential difference) between the output node 210 and the return node 212. As described herein, the return node 212 may be grounded in some variations of the bias supply 208 or may be another non-zero voltage. It should be recognized that other electrical parameters of the bias supply system 200 may be monitored and/or measured depending upon the particular design of the bias supply system 200.

As shown, the bias supply system 200 may include a controller 234 that functions to control the power supply 216, the switch network 220, and/or the variable capacitance 250 based upon one or more of the electrical parameters (e.g., i_b, v_b, i_out, and v_out). The controller 234 may reside within the bias supply housing 208, or alternatively, may reside external to the bias supply housing 208. When implemented external to the bias supply housing, the controller 234 may be implemented as a portion of a centralized controller that controls several pieces of processing equipment such as, for example and without limitation, the bias supply 108, 109 the source generator (e.g., shown as source generator 112 in FIG. 1), the source matching network 113, the switch network 220, mass flow controllers, and other applicable components. The controller 234 may also be distributed between a bias supply and control-related components that are external to the bias supply. It is also contemplated that the controller 234 may be implemented within a housing of another piece of equipment such as the source generator, such as source generator 112 in FIG. 1, or the controller 234 may be implemented as a distributed controller that resides in several pieces of equipment.

As shown, the controller 234 may monitor power parameters by receiving one or more signals including a current signal 226 indicative of the output current, i_out, and voltage signals 228 indicative of the output voltage, v_out. Although not shown in FIG. 2 for purposes of simplicity, those of ordinary skill in the art will readily appreciate that the output current, i_outand output voltage, v_outmay be sensed by current and voltage sensors readily known in the art to produce the current signal 226 and the voltage signal 228, which may be sampled and converted to produce digital representations of the signals 226, 228, respectively.

As discussed further herein, the controller 234 receives the measurements and is generally configured to control (by providing control signals) the switch network 220 and the power supply 216 to effectuate desired aspects of the asymmetric periodic voltage waveform (as described further herein) that is applied to the output node 210 and the return node 212. But in addition, the controller 234 is configured to control the variable capacitance 250 as described further herein.

Turning now to FIG. 3, which illustrates a schematic drawing 300 that electrically depicts lumped components (e.g., lumped inductive and capacitive components) of the bias supply system 200 and the plasma processing chamber 101. As shown, the plasma processing chamber 101 may be represented by a chuck capacitance, C_chuck, (that includes a capacitance of a chuck and workpiece, such as workpiece 103 shown in FIG. 1) that is positioned between an input 310 (also referred to as an input node 310) to the plasma processing chamber 101 and a node representing a sheath voltage, V_s, at a surface of the workpiece 103. As a consequence, references to the sheath voltage, V_s, are also referred to as a voltage at a surface of the workpiece (shown as V_win FIG. 3). In addition, a return node 312 (which may be a connection to ground) is depicted. The plasma (shown as plasma 102 in FIG. 1) in the processing chamber 101 is represented by a parallel combination of a sheath capacitance, C_Sheath, a diode, and a current source, I_ion. The diode represents the non-linear, diode-like nature of the plasma sheath that results in rectification of the applied AC field, such that a direct-current (DC) voltage drop, appears between the workpiece 103 and the plasma 102.

As seen, FIG. 3 also depicts lumped-element capacitances C_{stray_0}and C_{stray_1}. In this example, C_{stray_0}is a lumped-element capacitance representing stray capacitance from an output node 210 of the bias supply 208 to the return node 312, while C_{stray_1}is a lumped-element capacitance representing the capacitance from an input node 310 of the processing chamber 101 to the return node 312. In some cases, one or more of the C_{stray_0}and C_{stray_1}lumped-element capacitances may include a capacitance of a connector and filter capacitance. Also shown is the variable capacitance 250, which is positioned to be in parallel with the stray capacitance, C_{stray_0}. The variable capacitance 250 is additive with Cstray0 and Cstray1, so a total stray capacitance, Cstray, is equal to Cstray0+Cstray1+the capacitance of the variable capacitance 250.

Referring next to FIGS. 4 and 5, shown are timing diagrams 400 and 500, respectively, associated with implementations of the switch network 220 that have two switches and one switch, respectively. Each of FIGS. 4 and 5 show a period of an asymmetric periodic voltage waveform (v_out) from a time t₀to t₄and a corresponding current waveform (i_out). As depicted in FIG. 4, the bias supplies 208 disclosed herein operate to apply an asymmetric periodic voltage waveform, V_out, between the output node 210 and the return node 212 of the bias supply 208 during a period of the asymmetric periodic voltage waveform from time t₀to t₄. As shown, the asymmetric periodic voltage waveform, v_out, comprises a first section, from t₀to t₃, that begins with a first negative voltage and changes to a second, peak voltage, Vpp, before changing to a second negative voltage at t₃. The asymmetric periodic voltage waveform, v_out, also comprises a second section, from t₃to t₄, that begins with the second negative voltage and comprises a voltage ramp between the second negative voltage and a third negative voltage level.

The asymmetric periodic voltage waveform, v_out, may also me characterized in terms of voltage portions. As shown, the asymmetric periodic voltage waveform, v_out, comprises a first portion (from time t₀to t₁) that begins with the first negative voltage and changes to a second, positive peak voltage, Vpp, (at time t₁) at or near the end of the first portion. The asymmetric periodic voltage waveform, v_out, also changes from the second, peak positive voltage level to a third positive voltage level at time t₂during the second portion (from time t₁to t₂), where the third positive voltage level is slightly below the peak voltage level, Vpp. At or near the end of the second portion, the asymmetric periodic voltage waveform, v_out, drops by a step voltage (V_step) such that it is at the second negative voltage (at time t₃). That is, during the third portion (from time t₂to t₃) the asymmetric periodic voltage waveform drops by the step voltage, V_step, to the second negative voltage at t₃. In some cases, the asymmetric periodic voltage waveform also comprises a fourth portion (from time t₃to t₄), where the fourth portion includes a negative voltage ramp between the second negative voltage level at t₃and the third negative voltage level (also referred to as Vpk−) at t₄. As seen, at time t₄, the asymmetric periodic voltage waveform, V_out, is at the peak negative voltage, V_pk-, where the peak negative voltage may have the same or similar magnitude as the first negative voltage at the start of the cycle (i.e., at t₀).

As shown in FIGS. 4 and 5, the asymmetric periodic voltage waveform, v_out, comprises a voltage step, V_step, between times t₂and t₃, where the voltage step or V_stepcorresponds to a sheath voltage at t₃that produces ions at an energy level, −E_ion. Because an energy level of ions is a function of V_step, V_stepis a parameter that is used as a setpoint in some embodiments of the bias supply system 200.

In some circumstances, during the fourth portion (t₃to t₄) of the asymmetric periodic voltage waveform, the sheath voltage may become more negative so that at t₄, ions at an energy level of −(E_ion+ΔE_ion) are produced. As shown, a magnitude of ΔE_ioncorresponds to a distribution of ion energies 460, 560 where a larger magnitude of ΔE_ionindicates there will be a larger distribution 460, 560 of ion energies and a smaller magnitude of ΔE_ionindicates there will be a smaller distribution 460, 560 of ion energies. As a consequence, ΔE_ionis another setpoint used in embodiments of the bias supply system 200, and as discussed further herein, a frequency of the asymmetric periodic voltage waveform and/or a capacitance of the variable capacitance 250 may be used to control ΔE_ion. The ΔEion setpoint may be referred to as workpiece-voltage setting because it defines a voltage difference between −Eion (shown at t3) and −(Eion+ΔEion) shown at t4, and as shown in FIGS. 4 and 5, the workpiece-voltage setting defines a slope of a workpiece voltage (between time t3 and t4).

Also shown in FIGS. 4 and 5 are times t_reset(between times t₀and t₃) and t_ramp(between times t₃and t₄). As shown, t_resetcovers a time that includes the first, second, and third portions (t₀to t₃) of the asymmetric periodic voltage waveform, while t_rampincludes the fourth portion (t₃to t₄). In many modes of operation, controlling t_rampis an effective approach to controlling the period, and hence frequency, of the asymmetric periodic voltage waveform.

FIGS. 4 and 5 also depict the peak negative voltage, V_pk-, which identifies an end to the fourth portion of the asymmetric periodic voltage function. As further described herein, the negative voltage peak, V_pk-, may be used as a control parameter. For example, a threshold value for the negative voltage peak, V_pk-, may trigger the closing of switch S1 and opening of switch S2 (as shown in FIG. 4) or closing the single switch S1 that is controlled with reference to FIG. 5.

As shown in FIGS. 4 and 5, a full current cycle occurs between times t₀and t₃of the asymmetric periodic voltage waveform. Additionally, t_rampbetween t₃and t₄corresponds to the time between two adjacent full current cycles. An aspect of the present disclosure addresses the problem of how to adjust the output current, i_out, to compensate for the ion current, I_ion(shown by way of the I_ioncurrent source in FIG. 3). Another aspect of the present disclosure addresses the problem of how to adjust a level of ion energies, E_ion, and distribution of the ion energies (IEDF) in the plasma processing chamber 101.

As shown in FIG. 4, in variations of the bias supplies 208 that comprise two switches, the second portion of the asymmetric periodic voltage waveform may transition (during the time between time t₁to t₂) to the third portion of the asymmetric periodic voltage waveform. And as shown in FIG. 5, in variations of the bias supplies 208 that comprise one switch, t₁may equal t₂and the first portion of the asymmetric periodic voltage waveform may end (and the second portion may start) at a positive peak voltage level (Vpp). Further details of both single-switch and two-switch bias supplies are disclosed further herein in relation to FIGS. 11A and 11B, but FIGS. 4 and 5 provide a reference for the various control methodologies and the various structural variations disclosed further herein.

Shown in FIG. 4 are a switching sequence of a first switch, S1, and a second switch, S2; output current, i_out, provided at the output node 210; output voltage, v_out, at the output node 210; and the sheath or workpiece voltage, V_s˜Vw (also shown in FIG. 3); and a corresponding ion energy distribution function (IEDF) depicted as ion flux versus ion energy.

As shown in FIG. 4. the first switch, S1, and the second switch, S2, may be controlled so that output current, i_out, completes a full current cycle between times t₀and t₃. During a start of a current cycle at to, the output current, i_out, is controlled from a level −I_o, to reach a positive peak current value, and then the current is controlled to fall back to −I_o, at t₁. Then, at t₂, the output current, i_out, is controlled from the level −I_o, to increase, to a peak value in an opposite direction (i.e., opposite from the positive peak current value or decrease to a negative peak current value) before decreasing back to −I_oat t₃. More specifically, during the positive portion of the current cycle (when the first switch, S1, is closed and the second switch, S2, is open), the current increases to a peak positive value then decreases to −I_o. Additionally, during a negative portion (from time t₂to t₃) of the full current cycle, the current increases to a negative value peak value then decreases to −1_o.

As shown, in FIG. 4, the first switch, S1, and the second switch, S2, may be controlled with an adjustable deadtime, which is the time from t₁to t₂(after the switch, S1, is opened from a closed position and before S2 is closed). As depicted in FIG. 4, controlling the deadtime enables t_resetto be controlled. Furthermore, adjusting a ratio of t_resetto t_ramphelps adjust the average power supplied by the bias supply system 200 to the plasma processing chamber. In some cases, control over t_resetalso enables the fundamental switching frequency to be controlled (e.g., to remain below a level that affects plasma density in the plasma processing chamber 101).

Another aspect of control that may be achieved with the bias supply system 200 disclosed herein is ion current compensation, i_comp. More specifically, the length of the deadtime, the length of t_ramp, and/or the period of the periodic voltage function (between t₀and t₄) may be controlled to control a level of ion current compensation. In FIG. 4, t_ramp, the deadtime, and/or the level, I_o, may be controlled (if desired) so that ion current, I_ion, is compensated to a point where:

I
_o
=I
_ion−(C_chuck+C_{stray_1})*slope, and

I_comp=I_ion−(C_chuck+C_{stray_0}+C_{stray_1})*slope, where “slope” in this context corresponds to the slope of the output voltage, V_out, from t₃to t₄. As discussed further herein, the addition of the variable capacitance 250 adds to the stray capacitance C_{stray_total}=Cstray0+Cstray1+the capacitance of the variable capacitance 250 so that I_comp=I_ion−(C_chuck+C_{stray_total})*slope.

As shown in FIG. 4, when overcompensating for ion current, the sheath voltage V_s(and the voltage at the surface of the workpiece 103 in FIG. 1) becomes increasingly negative between times t₃and t₄(i.e., during the t_ramptime frame). In some cases, there is a distribution of ion energies as a result of the range of sheath voltages between t₃and t₄. It should be recognized, however, that ion current may be undercompensated so that the sheath voltage V_s(and the voltage at the surface of the workpiece 103) becomes less negative between times t₃and t₄(during the t_ramptime frame). That is, under compensation of the ion current can result in a less negative slope in V_outand/or a positive slope in the sheath voltage, V_s, during the t_ramptime frame.

It is also possible to adjust the slope of the bias output voltage, v_out, between t₃and t₄so that the workpiece voltage, V_w, and sheath voltage, V_s, is substantially constant between t₃and t₄, which results in a very narrow distribution of ion energy (or narrow IEDF). To achieve a flat workpiece voltage (where ΔEion=0), Icomp=(1+C_{stray_total}/C_chuck)*I_ion.

By adjusting both deadtime and t_ramp, the frequency of the asymmetric, periodic voltage waveform may be fixed if desired, but it is also possible to vary the deadtime, t_ramp, to affect the frequency of the asymmetric, periodic voltage waveform, v_out. It is also contemplated that the deadtime may be shortened while shortening or lengthening t_ramp, in some embodiments. As discussed, in some instances there are limits to the changes that can be made to the frequency of the asymmetric, periodic voltage waveform, and adjustments to the variable capacitance 250 enable adjustments to ΔE_ionwhen there are frequency limitations.

In a single-switch network, as shown in FIG. 5, the switch network (e.g., switch network 220 in FIG. 2) may be controlled so that the output current, i_out, completes a full cycle from a level −I_oto a peak positive value, back to the level −I_o, to a peak value in an opposite direction (i.e., to a peak negative value) and back to the level −I_o. It should be recognized that the peak value of the current (e.g., peak positive value between t₀and t₁=t₂) in a first half of the current cycle may be different than the peak value of the current (e.g., negative peak value between t₁=t₂and t₃) in the second half of the current cycle.

Referring next to FIG. 6, shown is a block diagram depicting general aspects of metrology, readback, and control, according to various aspects of the disclosure. More specifically, FIG. 6 depicts a controller 634 (which is an example of the controller 234), a switch network 220, variable capacitance 650, and a load 608. As shown, controller 634 includes a metrology component 620, a data processing component 630, a Vstep/Eion controller 632, a timing parameter estimator 633, a ΔEion controller 636, and a gate drive signal generator 638. The depicted variable capacitance 650 is an example of variable capacitance 250 that includes a first adjustable capacitor, C1, coupled between the output node and the return node, and a series combination of a second capacitor, C2, and a dissipation resistor, R2, coupled between the output node and the return node.

The second variable capacitor, C2, is an optional filtering capacitance that filters ringing that may occur due to the addition of the first variable capacitor, C1. The current associated with the filtered ringing is dissipated by the dissipation resistor, R2. As discussed further herein, the second variable capacitor, C2, may be adjusted to filter ringing while limiting heat that is dissipated by the dissipation resistor, R2.

In general, the metrology component 620 receives and samples signals indicative of electrical parameter values and provides a digital representation of the electrical parameter values to the data processing component 630. For example, the electrical parameters may include output current, i_outand output voltage, v_out. It is also contemplated that other electrical parameters such as i_compand v_bmay also be monitored.

A current-signal line 626 may provide analog signals from a current transducer that are indicative of output current, i_out, provided at the output of the bias supply system 200, and a voltage line 628 may provide analog signals that are indicative of the output voltage, v_out, at the output of the bias supply system 200. In response to receiving the signals (indicative of i_outand v_out), the metrology component 620 samples and digitizes the signals. For example, the metrology component 620 may provide complete digital representations of v_outand the output current, i_out. As shown, current-signal line 626′ may optionally provide analog signals from a current transducer that are indicative of output current, i_out, provided to the output node 210, and a voltage line 628′ may provide analog signals that are indicative of the output voltage, v_out, across the output node 210 and the return node.

Although not required, the metrology component 620 may be realized in part by a field programmable gate array (FPGA), and the data processing component 630, a Vstep/Eion controller 632, timing parameter estimator 633, ΔEion controller 636, and gate drive signal generator 638 may be realized by one or more processors that execute code (e.g., processor-executable code) stored in non-transitory media. But other combinations of hardware, software, and firmware may be used in different embodiments.

As shown, the digital representations of the asymmetrical periodic voltage waveform, v_out; the output current, i_outand/or i_compmay be provided to the data processing component 630, which may further process the digital representations of the asymmetrical periodic voltage waveform, v_out; the output current, i_outand/or i_compto provide feedback values for of one or more of sheath voltage, V_s, (which represents workpiece voltage) and one or more other parameter values such as E_ion, V_step, and ΔE_ion.

For example, the data processing component 630 may calculate E_ionas:

$E_{i o n} = \frac{C_{c h u c k}}{C_{c h u c k} + C_{s h e a t h}} V_{step} - \frac{1}{C_{c h u c k} + C_{s h e a t h}} \int_{t_{2}}^{t_{3}} i_{i o n} dt \approx \frac{C_{c h u c k}}{C_{c h u c k} + C_{s h e a t h}} V_{step}$

Where Vstep may be measured at Vout.

And the data processing component 630 may determine ΔE_ionas a difference in the workpiece voltage, V_w, from time t₃to time t₄where a reconstructed workpiece voltage, V_wmay be determined as:

$V_{w} (t) = V_{w} (t_{0}) + \frac{C_{c h} + C_{s t r a y}}{C_{c h}} [v_{out 1} (t) - v_{out 1} (t_{0})] - \frac{1}{C_{c h}} \int_{t_{0}}^{t} i_{o u t} d t$

Where Cstray=a capacitance of the variable capacitance 250+Cstray1, where Cstray1 is a lumped-element capacitance representing capacitance from an output of the bias supply 208 to an input 310 of the chamber 101 (including a capacitance of a connector and filter capacitance).

The relationship between ΔE_ionand the capacitance of the variable capacitance 250 may also be seen as follows:

$Δ E_{i o n} = E_{i o n} * \frac{\sqrt{1 + 4 F (1 - F) (1 / K_{c} - 1)} - (1 + 2 F)}{2}$

Where

$K_{c} = \frac{C_{stray} + \frac{C_{c h u c k} C_{sheath}}{C_{c h u c k} + C_{sheath}}}{C_{stray} + C_{chuck}}$

and Cstray=Cstray0+Cstray1+the capacitance of the variable capacitance 250. And

$F = \frac{I_{i o n} t_{ramp}}{(C_{c h u c k} + C_{sheath}) E_{i o n}} .$

As shown, the Vstep/Eion controller 632 is configured to receive a Vstep setpoint or a Eion setpoint from an operator of the bias supply system 200 and provide a power supply signal, Vsupply.set, to the power supply to set the voltage of the power supply 216. The setting may be either a Vstep setpoint or a Eion setpoint because Vstep and Eion are related

$E_{i o n} \approx \frac{C_{c h u c k}}{C_{c h u c k} + C_{sheath}} V_{s t e p}$

so one of ordinary skill in the art will appreciate that the bias supply system 200 may use either Vstep or Eion to set a desired ion energy level. Because the Vstep/Eion controller 632 controls ion energy, the Vstep/Eion controller 632 is also referred to as an ion energy controller 632. If the ion energy controller 632 is designed to receive a Vstep value as a setpoint, then the data processing component provides a measured Vstep value to the ion energy controller 632. And if the ion energy controller 632 is designed to receive an Eion value as a setpoint, then the data processing component provides a measured Eion value to the ion energy controller 632. In response, the ion energy controller 632 provides the power supply signal, Vsupply.set, to the power supply to set the voltage of the power supply 216.

The timing parameter estimator 633 may receive the digital representations of the output waveform, vout, and the output current, iout, and produce a pulse-width control signal. In some examples, the timing parameter estimator 633 detects when there is zero current flowing through switches of the bias supply 208 to reduce switching-related losses. The timing parameter estimator 633 may also determine treset (shown in FIGS. 4 and 5), where the value for treset may be provided to the data processing compoent 630.

The gate drive signal generator 638 is configured to provide gate drive signals to the switches (e.g., switches S1 and/or S2 in FIGS. 11A and 11B) of the bias supply 208 responsive to the pulse-width control signal 637 from the timing parameter estimator 633, a frequency setpoint signal, F_{sw_set}, and/or a synchronization signal 115 to control a frequency of the switching of the bias supply 208. Although many types of switches are controlled by electrical gate drive signals, it is also contemplated that optical control signals may be used. In one non-limiting example, the gate drive signal generator 638 is configured to provide the optical control signals. As shown, the gate drive signal generator 638 may also receive a synchronization signal 115 (also referred to as a common exciter signal (CEX)), which the gate drive signal generator 638 may use to produce gate drive signals that result is an asymmetric periodic voltage waveform that has a frequency that is indicated by the synchronization signal 115.

As shown, the ΔEion controller 636 is configured to receive a setpoint signal, ΔEion.set, that defines values for multiple related parameters. For example, the setpoint signal, ΔEion.set, defines a slope of the negative voltage ramp (shown between t₃and t₄in FIGS. 4 and 5), which defines the slope of the workpiece voltage (shown as sheath voltage, Vs, between t₃and t₄in FIGS. 4 and 5), which defines the distribution of ion energies 460, 560. Thus, the setpoint signal, ΔEion.set, may be referred to as a voltage setting, a negative voltage ramp setting, a workpiece-voltage setting, and an ion energy distribution setting.

As shown, the ΔEion controller 636 also receives a measured parameter value, ΔEion, corresponding to the setpoint parameter, ΔEion.set. So, if the setpoint signal, ΔEion.set, is a negative voltage ramp setting, then the measured parameter value for ΔEion may be a measured value of the negative voltage ramp (the negative voltage ramp of v_outbetween times t₃and t₄in FIGS. 4 and 5). As another example, if the setpoint signal, ΔEion.set, is a workpiece-voltage setting, then the measured parameter value for ΔEion may be a value of an actual slope of the workpiece voltage (shown as the slope of Vs between times t₃and t₄in FIGS. 4 and 5).

The ΔEion controller 636 may also receive the synchronization signal 115 and a current-signal, i_R2, that is indicative of current through the dissipation resistor, R2. As shown, the ΔEion controller 636 may provide the frequency setpoint signal Fsw_set to the gate drive signal generator 638 to control a frequency of the switching of the bias supply 208. In addition, the ΔEion controller 636 also provides one or more control signals to the variable capacitance 250. In the example depicted in FIG. 6, ΔEion controller 636 provides a first control signal to control the first variable capacitor, C1, and the ΔEion controller 636 provides a second control signal to control the second variable capacitor, C2.

Referring briefly to FIG. 13, shown are graphs depicting a switching frequency, fsw, that is required to reach a flat workpiece voltage for three different asymmetrical periodic voltage waveforms where a first waveform 1302 is characterized by a Vstep value of 500 Volts, a second waveform 1304 is characterized by a Vstep value of 750 Volts, and a third waveform 1306 is characterized by a Vstep value of 1000 Volts. As discussed above, the switching frequency, fsw, corresponds to the frequency of the asymmetric periodic voltage waveform, and a flat workpiece voltage will produce a relatively narrow distribution of ion energies.

As shown, for any of the three waveforms, when a capacitance of the variable capacitance 250 is increased, the switching frequency, fsw, that achieves a flat workpiece voltage increases. For example, the waveform 1306 with a Vstep of 1000 Volts will achieve a flat workpiece voltage (from times t3 to t4 in FIGS. 4 and 5) at a frequency of 200 kHz when the value of the variable capacitance 250 is zero farads. But when the value of the variable capacitance 250 is increased to 1000 pF, the switching frequency, fsw, that will achieve a flat workpiece voltage is over 300 kHz. This shift to higher frequencies (that achieve a flat workpiece voltage) may be beneficial where the bias supply 208 has limitations in a range of frequencies. For example, if the bias supply 208 can only effectively operate above 300 kHz with a Vstep of 1000 Volts, then increasing the value of the variable capacitance 250 to be at least 1000 pF enables the bias supply 208 to achieve a flat workpiece voltage.

FIG. 13 also depicts the benefit of the variable capacitance 250 when a frequency of the bias supply is fixed. For example, if the operating frequency of the bias supply 208 is fixed at 350 kHz (e.g., because the bias supply 208 receives a synchronization signal 115 fixing its frequency at 350 kHz), then adjusting the variable capacitance 250 to be 1000 pF will enable the bias supply 208 to achieve a flat workpiece voltage with a Vstep of 750 Volts.

Referring next to FIG. 7, shown is a general flowchart depicting a method for controlling the bias supply system 200, at least in part, utilizing the variable capacitance 250. As shown, if the synchronization signal 115 (also referred to as a common exciter signal (CEX)) is utilized to control a frequency of the bias supply system 200 (Block 702), then the bias supply system 200 controls ΔE_ionby running a capacitance control method (Block 704). But if CEX is not utilized, the bias supply system 200 may control ΔE_ionutilizing both frequency control and capacitance control methodologies (Block 706).

Referring to FIG. 8, shown is a process-flow diagram depicting a method for adjusting ΔE_ionutilizing the variable capacitance 250. Because ΔE_ionaffects the distribution (also referred to as a spread) of ion energies, the method conveyed by FIG. 8 may also be characterized as method for controlling a distribution of ion energies utilizing the variable capacitance 250. As shown, FIG. 8 depicts an ΔEion controller 836, which is example of the ΔEion controller 636 depicted in FIG. 6. As shown, the ΔEion controller 636 includes an optional lookup table 862, which may be used to produce an estimate, Cext_est, of a value for the variable capacitance 250 based upon a value of ΔE_ion, which may be provided by the data processing component 630. The estimate. Cext_est, may be used by a proportional-integral-derivative (PID) compensator 864 as an initial value of the variable capacitance 250 when producing a setting for the variable capacitance 250.

Referring again to FIG. 13, shown is an example of data that may be stored in the optional lookup table 862. As shown in FIG. 13, when a desired value for V_stepis available and the operating frequency, fsw, of the bias supply 208 is known, then a value for the variable capacitance 250 may be obtained. For example, if the setpoint value for V_stepis 500 Volts and the frequency, fsw, of the bias supply is set to 500 kHz, then a value for C-ext of 1250 pF may be obtained and used (by the PID compensator 864) as a starting value for the variable capacitance 250, 650.

As shown, a comparator 860 of the ΔE_ioncontroller 836 receives the setpoint signal, ΔEion.set, and a feedback value of ΔEion and provides an error signal, ΔE_ionerror, that is a difference between the desired setpoint (e.g., negative voltage ramp, slope of the workpiece voltage, or ion energy distribution) and a corresponding feedback value of ΔEion. In turn, the PID compensator 864 produces a setting, C-ext, for the variable capacitance 250. As those of ordinary skill in the art will appreciate, the PID compensator may be configured with a min-max limiter.

If the variable capacitance 250 comprises a single capacitor (e.g., as depicted in FIG. 3), then C-ext, may be used to set the single capacitor. But if the variable capacitance 250 comprises two variable capacitors (such as the variable capacitance 650), the capacitor controller 866 may create signals to control settings of the capacitors (such as the capacitors C1 and C2 depicted in FIG. 6). In some implementations, the capacitors are motor-controlled variable vacuum capacitors and the capacitor controller 866 provides motor-control signals (as shown in FIG. 8) to control motors for C1 and C2. But it is contemplated that the capacitors may each be a solid-state adjustable capacitor.

Referring next to FIG. 9, shown is a flowchart depicting a method for controlling the variable capacitance 650 that may be executed by the capacitor controller 866. As shown, power lost in the damping resistor, R2, is calculated as P₂=R₂*I_R2²(Block 902), and if the power losses, P2, exceed a threshold value of Pmax (Block 904), then a capacitance of C2 is reduced at Block 908 to reduce the amount of energy that is dissipated through the damping resistor, R2 (e.g., to limit a temperature of R2). The setting for C2 can be calculated using a simple integrator or a proportional-integrator compensator with an error input=Pmax−P2.

The capacitor C1 is then adjusted to be equal to C_ext minus C2 (Block 910). But if the power losses, P2, do not exceed a threshold value of Pmax (Block 904), then C1 is set to be equal to K*C_ext and C2 is set to be equal to (1−K)*C_ext (Block 906) where K is a programmable value that may be greater than 0.25 and less than 0.5.

Referring to FIG. 10, shown is a flowchart depicting a method for controlling ΔEion utilizing both frequency of the asymmetrical periodic waveform and a capacitance of the carriable capacitance 250. In this method, an indication of an ΔE_ionerror is obtained (Block 1002), which may be obtained by calculating ΔE_ion_error=setpoint−ΔE_ion. Then a frequency, fsw, of the asymmetrical voltage waveform that achieves an acceptable error level is determined (Block 1004). For example, an acceptable error may be substantially zero error.

As shown, if the frequency, fsw, of the asymmetrical voltage waveform is within a threshold range of frequencies between a minimum frequency, Fmin, and a maximum frequency, Fmax, that the bias supply system 200 can provide (Block 1006), then the value for the ΔE_ionerror continues to be obtained at Block 1002 and the desired frequency, fsw, continues to be calculated and used as the frequency of the asymmetrical periodic voltage waveform at Block 1004. But if the calculated frequency, fsw, is outside of the range between the minimum frequency, Fmin, and the maximum frequency, Fmax, then the frequency is clamped (Block 1008) and the capacitance control algorithm described with reference to FIG. 8 is run. In general, the method depicted in FIG. 10 prioritizes controlling ΔE_ionwith the frequency, fsw, of the asymmetric periodic voltage waveform, and when the bias supply system cannot provide the frequency, fsw, the capacitance of the variable capacitance 250 is adjusted to control ΔE_ion.

FIG. 11A illustrates an example topology 1100A of a bias supply, such as bias supply 208, comprising a single power supply, V_supply, and a switch network 1120A comprising two active switches, S1 and S2. In the variation depicted in FIG. 11A, a series combination of the first switch S1 and the first diode D1 is arranged between the return node 212 of the bias supply and node 862. In addition, a series combination of the second switch S2 and the second diode D2 is arranged between the node 862 and the return node 212 of the bias supply. As shown in FIG. 11A, the first diode D1 is arranged between the first switch S1 and the node 862 with its anode coupled to the first switch S1 and its cathode coupled to the node 862. The second diode D2 is arranged between the second switch S2 and the node 862 with its cathode coupled to the second switch S2 and its anode coupled to the node 862. In this arrangement, the cathode of the first diode D1, the anode of the second diode D2, and one end of the inductor L1 are coupled at the node 862, while the opposing end of the inductor is coupled to the output node 210.

In operation, first diode D1 conducts when the first switch S1 is closed, and a second diode D2 conducts when the second switch D2 is closed. And the first switch S1 and the second switch S2 are controlled as depicted in FIG. 4 to produce the asymmetric periodic voltage waveform V_outand the output current i_out(shown in FIG. 4). Although not depicted, it should be recognized that the position of the first switch S1 and the position of the first diode D1 may be swapped. Similarly, the position of the second switch S2 and the position of the second diode D2 may be swapped.

FIG. 11B illustrates a fourth example topology 1100B of a bias supply, such as bias supply 208, comprising a single power supply, V_supply, and a switch network 1120B having a single active switch, S1, according to various aspects of the disclosure.

In the switch network 1120B shown in FIG. 11B, a first inductor L1 is coupled between a node 870 and the output node 210, and the switch S1 is coupled between the node 870 and the return node 212. A diode D1 is coupled in parallel with the switch S1 between the node 870 and the return node 212. In operation, the switch S1 is opened and closed, as shown in FIG. 5, to produce the asymmetric periodic voltage function V_outand the output current i_outshown in FIG. 5. For example, an application of the asymmetric periodic voltage waveform is effectuated between the output node 210 and the return node 212 by closing the switch S1 to cause the output current i_outto change from −I_oto a peak value and back to −I_o. After the switch S1 is opened, the current increases to a peak value in an opposite direction and back to −I_o. To reduce or minimize losses, the timing parameter estimator 633 may optionally detect when the output current i_outis reaching I_oand provide a signal to the gate drive signal generator 638 to cause the switch S1 to open when the output current i_outis at I_o.

In operation, the switches S1 and/or S2 described in relation to FIGS. 11A and 11B are operated as previously described to create the asymmetric periodic waveform, v_out, and the output current, i_out, depicted in FIGS. 4 and/or 5. It should be recognized that because the switch S1 and the diode D1 are arranged in series (e.g., in FIG. 11A) the order of the switch S1 and the diode D1 may be swapped. Similarly, because the switch S2 and the diode D2 are arranged in series the order of the switch S2 and the diode D2 may also be swapped.

In many implementations, the switches disclosed herein are realized by field-effect switches, such as, metal-oxide semiconductor field-effect transistors (MOSFETs). In some implementations, the switches are realized by silicon carbide metal-oxide semiconductor field-effect transistors (SiC MOSFETs) or gallium nitride metal-oxide semiconductor field-effect transistors (GaN MOSFETs). As another example, the switches may be realized by insulated gate bipolar transistors (IGBTs). In these implementations, the gate drive signal generator 638 may comprise an electrical driver known in the art that is configured to apply electrical drive signals to the switches. It is also contemplated that the drive signals may be sent via optical lines to convey optical switching signals. Additionally, the switches may switch in response to the optical signal and/or optical signals that are converted to an electrical drive signal.

It should be recognized that each of the switches depicted herein generally represents one or more switches that are capable of closing and opening to connect and disconnect, respectively, a current pathway. For example, each of the switches may be realized by a plurality of switches arranged is series (for enhanced voltage capability), may be realized by a plurality of switches arranged is parallel (for enhanced current capability), or each of the switches may be comprised of a plurality of switches arranged in a series-parallel combination (for enhanced voltage and or current capability). In these variations, one of ordinary skill in the art will recognize that each switch may be synchronously driven by a corresponding drive signal.

It should also be recognized that any of the diodes depicted herein may be realized by a plurality of diodes. For example, any diode may be realized by a plurality of series-connected diodes (to enhance voltage capability), may be realized by a plurality of diodes arranged in parallel (to enhance current capability), or may be comprised of a plurality of diodes arranged in a series-parallel combination (for enhanced voltage and or current capability).

Those of skill in the art would understand that information and signals may be represented using any of a variety of different technologies and techniques. For example, data, instructions, commands, information, signals, bits, symbols, and chips that may be referenced throughout the above description may be represented by voltages, currents, electromagnetic waves, magnetic fields or particles, optical fields or particles, or any combination thereof.

Those of skill would further appreciate that the various illustrative logical blocks, modules, circuits, and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware, computer software, or combinations of both. To clearly illustrate this interchangeability of hardware and software, various illustrative components, blocks, modules, circuits, and steps have been described above generally in terms of their functionality. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the overall system. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present invention.

The steps of a method or algorithm described in connection with the embodiments disclosed herein may be embodied directly in hardware, in a software module executed by a processor, or in a combination of the two. A software module may reside in RAM memory, flash memory, ROM memory, EPROM memory, EEPROM memory, registers, hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art. An exemplary storage medium is coupled to the processor such that the processor can read information from, and write information to, the storage medium. In the alternative, the storage medium may be integral to the processor. The processor and the storage medium may reside in an ASIC.

Many embodiments and methods described herein may be realized using a processor in connection with processor executable instructions and a field programmable gate array (programmed by hardware description language instructions). In some embodiments, the FPGA is used for high-speed processing and control, including switching control, measurement, pulsing, and multi-level operation while a processor is utilized for other lower-speed processing. Referring to FIG. 12 for example, shown is a block diagram 1000 depicting physical components of a controller that may be utilized to realize control aspects disclosed herein.

As shown, in this embodiment a display 1012 and nonvolatile memory 1020 are coupled to a bus 1022 that is also coupled to random access memory (“RAM”) 1024, a processing portion (which includes N processing components) 1026, a field programmable gate array (FPGA) 1027, and a transceiver component 1028 that includes N transceivers. Although the components depicted in FIG. 12 represent physical components, FIG. 12 is not intended to be a detailed hardware diagram; thus, many of the components depicted in FIG. 12 may be realized by common constructs or distributed among additional physical components. Moreover, it is contemplated that other existing and yet-to-be developed physical components and architectures may be utilized to implement the functional components described with reference to FIG. 12.

This display 1012 generally operates to provide a user interface for a user, and in several implementations, the display is realized by a touchscreen display. In general, the nonvolatile memory 1020 is non-transitory memory that functions to store (e.g., persistently store) data and processor-executable code (including executable code that is associated with effectuating the methods described herein). In some embodiments for example, the nonvolatile memory 1020 includes bootloader code, operating system code, file system code, and non-transitory processor-executable code to facilitate the execution of a method for predicting plasma behaviors by measuring current waveform(s), e.g., during asymmetric bias waveform application.

In many implementations, the nonvolatile memory 1020 is an example of a non-transitory processor readable storage medium and may be realized by flash memory (e.g., NAND or ONENAND memory), but it is contemplated that other memory types may be utilized as well. Although it may be possible to execute the code from the nonvolatile memory 1020, the executable code in the nonvolatile memory is typically loaded into RAM 1024 and executed by one or more of the N processing components in the processing portion 1026.

The N processing components in connection with RAM 1024 generally operate to execute the instructions encoded in nonvolatile memory 1020 to enable execution of the algorithms and functions disclosed herein. It should be recognized that several algorithms are disclosed herein, but some of these algorithms are not represented in flowcharts. Processor-executable code to effectuate methods described herein may be persistently stored in nonvolatile memory 1020 and executed by the N processing components in connection with RAM 1024. As one of ordinarily skill in the art will appreciate, the processing portion 1026 may include a video processor, digital signal processor (DSP), micro-controller, graphics processing unit (GPU), or other hardware processing components or combinations of hardware and software processing components (e.g., an FPGA or an FPGA including digital logic processing portions).

In addition, or in the alternative, non-transitory FPGA-configuration-instructions may be persistently stored in nonvolatile memory 1020 and accessed (e.g., during boot up) to configure a field programmable gate array (FPGA) to implement the algorithms disclosed herein.

The input component 1030 may receive electrical signals (e.g., signals indicative of output current, I_out, and voltage, V_out) obtained (e.g., by current transducers, VI sensors, current transducers, and/or voltage sensors) at the output node 210 and/or return node 212 of the disclosed bias supplies 208.

Although not required, in some implementations the FPGA 1027 may sample the electrical signals and provide the digital representations of output current, I_out, and output voltage V_out. In some embodiments, the processing portion 1026 (in connection with processor-executable instructions stored in the nonvolatile memory 1020) are used to realize the functional blocks disclosed herein. But the FPGA 1027 may also be used to implement these functions. In addition, the input component 1030 may receive the synchronization signal 115. The signals received at the input component 1030 may generally include, for example, synchronization signals, power control signals to the various generators and power supply units, or control signals from a user interface. Those of ordinary skill in the art will readily appreciate that any of a variety of types of sensors such as, without limitation, directional couplers and voltage-current (VI) sensors, may be used to sample electrical parameters, such as voltage and current, and that the signals indicative of the power parameters may be generated in the analog domain and converted to the digital domain.

The output component 1040 generally operates to provide one or more analog or digital signals to effectuate the gate drive signals for opening and closing of the switches. The output component 1040 may also provide control signals to control the variable capacitance 250, 650. For example, the output component 1040 may provide the control signals to control a single capacitor C1 or more than one capacitor, such as C1 and C2 (shown in FIG. 6).

The depicted transceiver component 1028 includes N transceiver chains, which may be used for communicating with external devices via wireless or wireline networks. Each of the N transceiver chains may represent a transceiver associated with a particular communication scheme (e.g., WiFi, Ethernet, Profibus, etc.).

As will be appreciated by one skilled in the art, aspects of the present disclosure may be embodied as a system, method or computer program product. Accordingly, aspects of the present disclosure may take the form of an entirely hardware embodiment, an entirely software embodiment (including firmware, resident software, micro-code, etc.) or an embodiment combining software and hardware aspects that may all generally be referred to herein as a “circuit,” “module” or “system.” Furthermore, aspects of the present disclosure may take the form of a computer program product embodied in one or more computer readable medium(s) having computer readable program code embodied thereon.

As used herein, the recitation of “at least one of A, B and C” or “at least one of A, B or C” is intended to mean “either A, B, C or any combination of A, B and C.” The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present disclosure. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the disclosure. Thus, the present disclosure is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

ADDITIONAL STRAY CAPACITOR AS ANOTHER TUNING KNOB FOR 1-SUPPLY EV SOURCE

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