Applied Machine Learning (ML) is a booming field that utilizes a cascade of layers of nonlinear processing units and algorithms for feature extraction and transformation with a wide variety of usages and applications. ML typically involves two phases, training, which uses a rich set of training data to train a plurality of machine learning models, and inference, which applies the trained machine learning models to actual applications. Each of the two phases poses a distinct set of requirements for its underlying infrastructures. Various infrastructures may be used, e.g., graphics processing unit (GPU), a central processing unit (CPU), a Field Programmable Gate Array (FPGA), an Application Specific Integrated Circuit (ASIC), etc. Specifically, the training phase focuses on, as a non-limiting example, GPU or ASIC infrastructures that scale with the trained models and retraining frequency, wherein the key objective of the training phase is to achieve high performance and reduce training time. The inference phase, on the other hand, focuses on infrastructures that scale with the applications, user, and data, and the key objective of the inference phase is to achieve energy (e.g., performance per watt) and capital (e.g., return on investment) efficiency.
Inference phase of ML is usually very computationally and data intensive. Unfortunately, as the input data and model sizes grow, data movement becomes a bottleneck and data processing increases because in order to perform simple processing, three operations or instructions are performed for each data, e.g., load, processing, and store. As the amount of data grows, performing these three operations or instructions becomes burdensome. Moreover, the current computing architecture is not scalable and are not well suited for ML and its applications, since a lot of time goes in loading and storing the data in comparison to processing the data.
The foregoing examples of the related art and limitations related therewith are intended to be illustrative and not exclusive. Other limitations of the related art will become apparent upon a reading of the specification and a study of the drawings.
Accordingly, a need has arisen to improve memory access and to utilize bandwidth efficiently, thereby alleviating bottleneck resulting from data movement and memory access. In some nonlimiting examples, memory accesses are interleaved across multiple channels. In other words, the addresses associated with memory accesses are interleaved across multiple channels.
In some nonlimiting embodiments, a system includes a memory, an interface engine, and a master. The memory is configured to store data. The inference engine is configured to receive the data and to perform one or more computation tasks of a machine learning (ML) operation associated with the data. The master is configured to interleave an address associated with memory access transaction for accessing the memory. The master is further configured to provide a content associated with the accessing to the inference engine.
It is appreciated that in some embodiments the memory is a dynamic random access memory (DRAM). In some embodiments the memory may be a double data rate (DDR).
According to some embodiments, a subset of bits of the interleaved address is used to determine an appropriate channel through which to access the memory. In some embodiments, the interleaving includes moving channel identifier bits within the address to highest order bits. The channel identifier bits identify an appropriate channel through which to access the memory. The interleaving further includes shifting down address bits with bit orders higher than bit order of channel identifier bits before the moving. The shifting down is by a same order as a number of channel identifier bits. The moving and the shifting down forms the interleaved address. According to some embodiments, the system further includes a network interface controller. The network interface controller in some embodiments only supports address interleaving at a granularity greater than a burst length of the address.
These and other aspects may be understood with reference to the following detailed description.
Aspects of the present disclosure are best understood from the following detailed description when read with the accompanying figures. It is noted that, in accordance with the standard practice in the industry, various features are not drawn to scale. In fact, the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion.
The following disclosure provides many different embodiments, or examples, for implementing different features of the subject matter. Specific examples of components and arrangements are described below to simplify the present disclosure. These are, of course, merely examples and are not intended to be limiting. In addition, the present disclosure may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed.
Before various embodiments are described in greater detail, it should be understood that the embodiments are not limiting, as elements in such embodiments may vary. It should likewise be understood that a particular embodiment described and/or illustrated herein has elements which may be readily separated from the particular embodiment and optionally combined with any of several other embodiments or substituted for elements in any of several other embodiments described herein. It should also be understood that the terminology used herein is for the purpose of describing the certain concepts, and the terminology is not intended to be limiting. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood in the art to which the embodiments pertain.
Each of the engines in the architecture 100 is a dedicated hardware block/component including one or more microprocessors and on-chip memory units storing software instructions programmed by a user for various machine learning operations. When the software instructions are executed by the microprocessors, each of the hardware components becomes a special purposed hardware component for practicing certain machine learning functions as discussed in detail below. In some embodiments, the architecture 100 is on a single chip, e.g., a system-on-chip (SOC).
In the example of
In some embodiments, the inference engine 160 includes a two-dimensional computing array of processing tiles, e.g., tiles 0, . . . , 63, arranged in, e.g., 8 rows by 8 columns. Each processing tile (e.g., tile 0) includes at least one on-chip memory (OCM) e.g., 210, one POD engine (or POD), e.g., 220, and one processing engine/element (PE), e.g., 230. Here, the OCMs in the processing tiles are configured to receive data from the data streaming engine 140 in a streaming fashion. The OCMs enable efficient local access to data per processing tile. The PODs are configured to perform dense or regular computations on the received data in the OCMs, e.g., matrix operations such as multiplication, matrix manipulation, tanh, sigmoid, etc., and the PEs are configured to perform sparse/irregular computations and/or complex data shape transformations of the received data in the OCMs, e.g., memory transpose, addition operation, operations on irregular data structures (such as trees, graphs, and priority queues), respectively. Both the PODs and the PEs can be programmed according to the programming instructions received from the instruction-streaming engine 150. Accordingly, the data is received and processed by each processing tile as an input data stream from the DDR memory 120 and the result is output by each processing tile as a stream of data to the DDR memory 120.
In some embodiments, a plurality of (e.g., four) processing tiles in the inference engine 160 together form a processing block or quad 250, e.g., processing tiles 0-3 form processing block 250, wherein the processing tiles within each processing block 250 are coupled to one another via a routing element 240. In some embodiments, all the routing elements are connected together as a mesh 260 of interconnect to connect the processing blocks in the same row or column as a two-dimensional array. It is appreciated that the number and/or types of components within each processing tile, the formation of the processing blocks, the number of processing tiles in each processing block, and the number of processing blocks in each row and column of the inference engine 160 as shown in
Referring now to
As presented above, memory accesses may cause bottleneck. In order to address the bottleneck resulting from memory access, the bandwidth associated with DRAM, DDR, etc., should be utilized more efficiently. In some nonlimiting examples, memory accesses are interleaved across multiple channels. In other words, the addresses associated with memory accesses are interleaved across multiple channels.
In a low power double data rate (LPDDR) system, the minimum burst length is 16. Thus, the minimum granularity of interleave is 128B. Unfortunately, NIC 290 may not support address interleaving of less than a certain size, e.g., 4 kB. Accordingly, the interleaving for addresses less than 4 kB, as an example, should be performed by each component (also referred to as master hereinafter), e.g., the host 110, the PCIe controller/DMA 125, the core 130, the instruction streaming engine 150, the data streaming engine 140, etc. In other words, each master may perform an address-bit swizzle at connectivity level with no logic involved (described in greater detail in
Referring now to
In some examples, the master 310 interleaves the address [a33, a32, a31, . . . , a0] associated with a memory location for a transaction resulting in an interleaved address 312. In this illustrative example, since there are 4 channels, only 2 bits of the address bits (also referred to as channel identifier bits) are needed to determine the appropriate channel, e.g., A0, A1, A2, or A3. In this illustrative example, the bits as and a7 of the address are used to determine the appropriate communication channel. In some embodiments, 00 may be associated with channel A3, 01 may be associated with channel A2, 10 may be associated with channel A1, and 00 may be associated with channel A0. It is appreciated that using bits as and a7 of the address to determine the appropriate channel is for illustrative purposes and that in other examples bits with different orders may be used. In one illustrative where 8 channels are used, 3 bits of the address bits are needed to identify the appropriate channel. Similarly, if 16 channels are used, 4 bits of the address bits are needed to identify the appropriate channel and so on. It is appreciated that in some embodiments fewer than 4 channels may be used, e.g., 2 channels may be used with one address bit such as a7.
The master 310 interleaves the bits of the address. For example, bits a8 and a7 of the address that are 8th and 7th order bits are moved to be the highest ordered bits of the address, hence the 33 and 32 order bits of the address. The order of the address bits a33 . . . a9 of the address are changed to new order bits and the address bits a6 . . . a0 of the address remain at the same order bits as before. In other words, the address bits [8:7] are shifted to the highest address bits [33:32] and are used to select the appropriate channel. Original bits [33:9] are shifted down by two order bits, and bits [6:0] remain unchanged. It is appreciated that higher order address bits above 34 can also remain unchanged. Accordingly, in some embodiments the higher order bits may be used to select the DRAM rank or chip-select bits, thereby supporting higher capacities without a change to the interleaving scheme.
Accordingly, the master 310 is used to efficiently access memory, e.g., DRAM memory 120, in an interleaved fashion, thereby alleviating memory accesses that cause bottleneck and inefficiencies. The DDR memory 120 receives the interleaved address 312 via an appropriate channel. In some illustrative embodiments, the DDR memory 120 may return a data 122 associated with the received interleaved data 312 to the master 310 via the appropriate channel, e.g., the same channel through which the interleaved address 312 was received. Accordingly, the bandwidth is utilized more efficiently when accessing the DDR memory 120.
The foregoing description of various embodiments of the claimed subject matter has been provided for the purposes of illustration and description. It is not intended to be exhaustive or to limit the claimed subject matter to the precise forms disclosed. Many modifications and variations will be apparent to the practitioner skilled in the art. Embodiments were chosen and described in order to best describe the principles of the invention and its practical application, thereby enabling others skilled in the relevant art to understand the claimed subject matter, the various embodiments and the various modifications that are suited to the particular use contemplated.
This application is a continuation of U.S. patent application Ser. No. 16/420,078, filed May 22, 2019, which is a continuation-in-part of U.S. patent application Ser. No. 16/226,539, filed Dec. 19, 2018, now U.S. Pat. No. 10,824,433, issued Nov. 3, 2020, and claims the benefit of U.S. Provisional Patent Application No. 62/675,076, filed May 22, 2018, which are incorporated herein in their entirety by reference.
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