The present invention relates to an apparatus for coating a glass substrate and more particularly to an apparatus according to the preamble of claim 1. The present invention further relates to a method for coating a glass substrate and more particularly to a method according to the preamble of claim 18.
It is generally know to use liquid starting materials for coating glass by atomizing the liquid starting materials into droplets and directing the formed droplets on the surface of glass to be coated for producing a coating. In other words according to the prior art the droplets are brought to the surface of the substrate to be coated as liquid droplets, whereby the coating is formed on the surface of the substrate such that first the droplets brought on the surface are pyrolized or the vaporizable substances of the droplets are vaporized for providing a coating on the surface of the substrate.
The problem in the above identified prior art coating process is the slow growth rate of the coating, which is due to fact that the liquid droplets brought to the surface of the glass produce a liquid film on the surface of the glass. The pyrolization and vaporization of the liquid film is slow. The slow growth rate limits the utilization of this coating process in many applications such as when a coating is produced on a moving sheet glass. Furthermore, the uniformity of the produced coating is difficult to control in this prior art coating process as uniformity of the produced coating depends on the uniform deposition of the droplets on the glass substrate. Also the deposition efficiency of the droplets depends on the effective guiding of the droplets on the glass substrate, which is not achieved in the prior art.
An other prior art method for providing a coating on a glass substrate is to use known vapour deposition methods such as CVD (chemical vapour deposition). In these conventional vapour deposition methods the surface of the glass substrate to be coated is subjected to vapour starting materials which react with the surface of the glass or with each other to form a coating on the surface of the glass.
The problem with these conventional prior art vapour deposition methods is that the starting materials are vaporized distant from the surface of the substrate to be coated and the vaporized starting materials are transported with a carrier gas to the substrate. The long transportation distance of the vaporized starting materials causes undesirable particle formation during the transportation of the vaporized starting materials. The undesirably formed particles end up to the surface of the substrate to be coated and therefore reduce the quality of the produced coating.
An object of the present invention to provide an apparatus and a method for overcoming the above mentioned problems. The objects of the present invention are achieved by an apparatus according to the characterizing portion of claim 1. The objects of the present invention are further achieved by a method according to the characterizing portion of claim 18.
The preferred embodiments of the invention are disclosed in the dependent claims.
The present invention is based on an idea of supplying the starting materials into the deposition chamber as liquid droplets and directing the droplets towards the surface of the glass substrate to be coated. The deposition chamber is further provided with at least one thermal reactor for vaporizing the droplets before the droplets contact surface of the glass substrate or before the starting materials react on the surface of the substrate. The thermal reactor may be produced with a flame or with plasma or as a hot zone produced with heating means, such as electrical heating means. Preferable the thermal reactor is provided substantially close to the surface of the substrate. In an other embodiment the glass substrate is brought to the coating process in such a temperature that the thermal energy of the glass substrate is able to produce a hot zone and vaporize the droplets substantially close to the surface of the glass substrate. The vaporized starting materials react on the substrate surface to produce a desired coating or film on the substrate. As the starting materials are vaporized close to the substrate surface, the vapour pressure of the starting materials at the substrate surface is high, thus allowing high coating growth rates. The advantage of the coating process and coating apparatus of the present invention is that they combine the advantages of prior art coating methods such that the problems associated with the prior art coating methods are solved. The coating process and coating apparatus of the present invention provide an increased growth rate of the coating in relation to the prior art methods in which the starting materials are brought to the surface of the glass substrate as liquid droplets due to the fact that the surface reactions take place when the staring materials are vaporized. Furthermore, as the vaporization of the liquid droplets takes place substantially close to the surface of the substrate to be coated the undesirable particle formation may be avoided as the vaporized starting materials do not have be transferred long distances to the surface of the substrate. Supplying the starting materials as droplets into the deposition chamber requires more simple equipment that supplying the starting materials in gas phase into the deposition chamber. This enables the coating process to be applied easily to different kinds of applications, such as production lines and process lines.
To solve the problems relating to the uniformity of the coating and efficiency of the guiding the droplets towards the surface of the substrate the droplets are guided towards the surface of the glass substrate with electrical forces. The formed droplets are first electrically charged during or after the atomization and the electrically charged droplets are further guided towards the surface of the substrate using one or more electrical fields. Charging the droplets enhances the uniformity of the coating as the electrically charged droplets provide uniform droplet flow as the charged repelling each other due to the repulsive forces of the electrical charge.
In the following the invention will be described in greater detail by means of preferred embodiments with reference to the attached [accompanying] drawings, in which
In the atomizer 2 it is advantageous to use very high flow rate of the atomizing gas, advantageously from 50 m/s to sonic velocity. The high gas flow rate has several advantages. Firstly, it is very advantageous from the point of views of charging, because e.g. the created ions drift quickly away from the vicinity of the corona. This expulsion of the space charging caused by ions decreases the electric field attenuating the discharge and forming around the corona electrode 32 and thereby also the required corona voltage. For example by feeding nitrogen as atomizing gas through conduit 31 with a flow rate near the corona electrode 32 being roughly 150 m/s, it is possible to use approximately 5 kV as the charging voltage of the corona electrode 32. Secondly, the high flow rate reduces the ion loss to the surroundings of the atomizer 2, with a preferable residence time of the charged gas in the atomizer being 1 m/s or less. Thirdly, the high flow rate at the exit nozzle of the atomizer 2 reduces the droplet size.
The corona discharge electrode and its counter electrode may be positioned in various different ways not described in the previous embodiments. Thus it is e.g. possible to connect the counter electrode to the glass substrate, to the coating formed on the glass substrate or to a plate outside the glass substrate.
In
The charged droplets 3 are also preferably guided towards or on the glass substrate 15 using a separate electric field provided between a first and second electrode. The separate electric field is preferably provided inside a deposition chamber 16 for guiding the charged droplets 3 towards the glass substrate 15. The charged droplets 3 may be deposited on a glass substrate 15 as liquid droplets or alternatively the charged droplets may be vaporized before the starting materials react on the glass substrate 15 or before the droplets contact the glass substrate 15 such that the vaporized starting material react on the glass substrate 15.
The droplets 3 entering the deposition chamber are electrically charged using one or more charging means. The charging means may comprise one or more corona electrodes 4 which electrically charge the droplets 3 as they pass the corona electrodes 4. Alternatively the charging means may comprise one or more blow charger supplying electrically charged gas for charging the droplets 3. As shown in
In an alternative embodiment the atomizer 2 is arranged inside the deposition chamber 16, as in
The electrically charged droplets 3 are further guided towards a glass substrate 15 or on the glass substrate 15 using one or more electric fields provided in the deposition chamber 16. The one or more electric fields is provided between opposite electrodes 13, 14 in the deposition chamber 16 and between which electrodes 13, 14 the glass substrate 15 is positioned in the deposition chamber 16. In
According to the above mentioned the droplets 3 are first electrically charged and then guided towards the glass substrate using one or more electric fields provided inside the deposition chamber 16. In one embodiment the droplets 3 guided towards the glass substrate using electrical forces are vaporized before the starting materials react on the surface of the substrate 15 or before the droplets 15 contact the glass substrate. Thus the electrically guided droplets are conducted to a thermal reactor (not shown) before they react on the glass substrate 15 or before the droplets 3 contact the glass substrate 15. Thus the thermal reactor is preferably provided close to the glass substrate 15. The thermal reactor may a flame generated by combustion gas and oxidizing gas or plasma provided by means of gas. Alternatively the thermal reactor may be hot zone provided with heating means, such as electric heating means, electric resistors, inside the deposition chamber 16. The hot zone may also be provided by thermal energy of the substrate 15. The glass substrate 15 may be heated or it may come from manufacturing step, such as tin path or annealing lehr, in which the glass substrate is in elevated temperature. The thermal energy of the glass substrate 15 vaporizes the charged and guided droplets 3 close to the surface of the substrate 15 before the starting materials react on the surface of the substrate 15. Thus the vaporized starting materials react on the glass substrate 15.
Alternatively the droplets 3 are deposited on the glass substrate 15 as droplets.
b show another embodiment in which droplets 3 are electrically charged in a separate charging chamber 1 upstream of the deposition chamber 16. The charging chamber 1 is provided with one or more atomizers 2, which may two-fluid atomizers or some other type of atomizers for atomizing the liquid starting materials into droplets 3. The charging chamber 1 is insulated such that external heat, for example from hot glass substrate does heat the charging chamber 1 to prevent the droplets 3 from vaporizing. The atomizers 2 may be provided inside or upstream the charging chamber 1 or in fluid connection with the charging chamber 1 such that the formed droplets 3 may be conducted in the charging chamber 1.
The charging chamber 1 is provided with charging means 4 for electrically charging the droplets 3 after the atomization. In
The charging chamber 1 may also comprise one or more blow chargers (not shown) supplying electrically charged gas for electrically charging the droplets 3. The atomizers 2 may also be two-fluid atomizers, and that the charging means are arranged to charge at least a fraction of the gas used in the two-fluid atomizer 2 for electrically charging the droplets 3, as discussed earlier.
In the charging chamber 1 the electrically charged droplets 3 tend to repel each other due to the electrical repulsion forces of the droplets 3 charged with the same electrical polarity. Thus the distribution of the charged droplets 3 is homogenized which is advantageous for providing a homogenized flux of droplets 3, as shown in
The charging chamber 1 is provided with an outlet 9 through which the charged droplets 3 are conducted out of the charging chamber 1 and into the deposition chamber 16. The outlet 9 corresponds essentially the inlet 52 of
From the charging chamber 1 the charged droplets are conducted to the deposition chamber 16 via the outlet 9. The charging chamber 1 is arranged spaced apart from and in fluid connection with the deposition chamber 16. The electrically charged droplets 3 may be conducted using a carrier gas which together with the droplets 3 forms an aerosol as described in connection with
The glass substrate 15 is positioned in the deposition chamber 16 between the first and second electrodes 13, 14. The electric field guides the electrically charged droplets 3 by electrical forces towards the glass substrate 15 arranged between the first and second electrode 13, 14 in the deposition chamber. The glass substrate 15 may also be provided as the second electrode 14, as described earlier. According to the above mentioned the droplets 3 are first electrically charged in the charging chamber 1, conducted to the deposition chamber 16 and then guided towards the glass substrate 15 using one or more electric fields provided inside the deposition chamber 16. In one embodiment the droplets 3 guided towards the glass substrate 15 using electrical forces are vaporized before the starting materials react on the surface of the substrate 15 or before the droplets 15 contact the glass substrate. Thus the electrically guided droplets are conducted to a thermal reactor (not shown) before they react on the glass substrate 15 or before the droplets 3 contact the glass substrate 15. Thus the thermal reactor is preferably provided close to the glass substrate 15. The thermal reactor may be a flame generated by combustion gas and oxidizing gas or plasma provided by means of gas. Alternatively the thermal reactor may be a hot zone provided with heating means, such as electric heating means, for example electric resistors, inside the deposition chamber 16. The hot zone may also be provided by thermal energy of the substrate 15. The glass substrate 15 may be heated or it may come from manufacturing step, such as tin path or annealing lehr, in which the glass substrate 15 is in an elevated temperature, as described in connection with
Alternatively the droplets 3 are deposited on the glass substrate 15 as droplets.
It will be obvious to a person skilled in the art that, as the technology advances, the inventive concept can be implemented in various ways. The invention and its embodiments are not limited to the examples described above but may vary within the scope of the claims.
Filing Document | Filing Date | Country | Kind | 371c Date |
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PCT/FI10/50522 | 6/21/2010 | WO | 00 | 2/27/2013 |