Apparatus and method for heating semiconductor wafers via microwares

Abstract

An apparatus for heating a semiconductor wafer includes the following: a microwave source; an applicator cavity; and, a fixture for supporting a wafer in the applicator cavity. The fixture comprises a dielectric member providing mechanical support for the wafer and a metallic ring disposed generally parallel to and concentric with the wafer at a selected distance from the wafer, whereby the application of microwave power to the wafer may be adjusted to compensate for edge effects. An associated method for heating a semiconductor wafer comprises the steps of: a. placing the wafer in a microwave applicator cavity; b. supporting the wafer on a fixture, the fixture comprising a dielectric supporting member in contact with the wafer and a metallic ring member disposed generally parallel to and concentric with the wafer at a selected distance from the wafer; and, c. introducing microwave power into the applicator cavity in order to heat the wafer, with the metallic ring serving to modify the power distribution near the wafer edge. The apparatus may be adapted to various operations in semiconductor device fabrication and testing.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

The drawings accompanying and forming part of this specification are included to depict certain aspects of the invention. A clearer conception of the invention, and of the components and operation of systems provided with the invention, will become more readily apparent by referring to the exemplary, and therefore non-limiting embodiments illustrated in the drawing figures, wherein like numerals (if they occur in more than one view) designate the same elements. The features in the drawings are not necessarily drawn to scale.

FIG. 1 is a schematic diagram of one embodiment of the present invention.

FIG. 2 is a schematic diagram in cross-section of one embodiment of the fixture of the present invention.

FIG. 3 is a schematic diagram in cross-section of several alternate embodiments of the present invention.

FIG. 4 is a schematic plot of typical heating results using the inventive method.

FIG. 5 is a schematic diagram in cross-section of an embodiment of the present invention adapted to maintain a controlled atmosphere around the wafer.

FIG. 6 is a schematic diagram in cross-section of the present invention in which the metal ring is hollow and further serves as a gas diffuser.

Claims

1. An apparatus for heating a semiconductor wafer comprising: a microwave source;an applicator cavity; and,a fixture for supporting said wafer in said applicator cavity, said fixture comprising a structural member providing mechanical support for said wafer and a metallic ring disposed generally parallel to and coaxial with said wafer at a selected distance from said wafer, whereby the application of microwave power to said wafer may be modifed to compensate for edge effects.

2. The apparatus of claim 1 wherein said microwave source comprises a variable frequency microwave generator having a center frequency and a selected bandwidth about said center frequency.

3. The apparatus of claim 1 wherein said microwave source comprises at least one device selected from the group consisting of: solid-state power amplifiers, magnetrons, klystrons, gyrotrons, and traveling wave tubes.

4. The apparatus of claim 1 wherein said structural member comprises a plurality of dielectric supports selected from the group consisting of: ceramics, glasses, and quartz.

5. The apparatus of claim 1 wherein said metallic ring comprises an annular prism having a selected outer radius, a selected inner radius, and a selected height, wherein said inner radius is at least half of said outer radius, and said height is less than the difference between said inner and outer radii.

6. The apparatus of claim 1 wherein said metallic ring comprises an annular prism having a selected outer radius, a selected inner radius, and a selected height, wherein said inner radius is larger than the radius of said wafer, and said height is greater than the difference between said inner and outer radii.

7. The apparatus of claim 1 wherein at least a portion of said ring has a generally L-shaped cross-section.

8. The apparatus of claim 1 wherein said ring has a hollow cross-section and further comprises a plurality of openings whereby gas may be passed through said ring and introduced at selected locations proximate to said wafer.

9. A method for heating a semiconductor wafer comprising the steps of: a. placing said wafer in a microwave applicator cavity;b. supporting said wafer on a fixture, said fixture comprising a structural supporting member in contact with said wafer and a metallic ring member disposed generally parallel to and coaxial with said wafer at a selected distance from said wafer; and,c. introducing microwave power into said applicator cavity in order to heat said wafer, with said metallic ring serving to modify the power distribution near the edge of said wafer.

10. The method of claim 9 wherein the source of said microwave power comprises at least one device selected from the group consisting of: solid-state power amplifiers, magnetrons, klystrons, gyrotrons, and traveling wave tubes.

11. The method of claim 9 wherein said structural supporting member comprises a plurality of dielectric supports selected from the group consisting of: ceramics, glasses, and quartz.

12. The method of claim 9 wherein said metallic ring comprises an annular prism having a selected outer radius, a selected inner radius, and a selected height, wherein said inner radius is at least half of said outer radius.

13. The method of claim 9 wherein said ring has a hollow cross-section and further comprises a plurality of openings whereby gas may be passed through said ring and introduced therefrom at selected locations proximate to said wafer.

14. The method of claim 9 further comprising at least one step selected from the following group: d. heating said wafer at a selected heating rate;e. holding said wafer at a selected soak temperature for a selected time; and,f. cooling said wafer at a selected cooling rate.

15. The method of claim 9 further comprising at least one step selected from the following group: g. at least partially removing air from said applicator cavity; and,h. introducing a selected process gas into said applicator cavity.

16. The method of claim 9 further comprising the following step: i. adjusting said distance between said metallic ring and said wafer.

17. A fixture for heating a semiconductor wafer in a microwave oven comprising: a structural member providing mechanical support for said wafer; and,a metallic ring disposed generally parallel to and coaxial with said wafer at a selected distance from said wafer, whereby the microwave power applied to said wafer may be modified to compensate for edge effects.

18. The fixture of claim 17 wherein said structural member comprises a plurality of dielectric supports selected from the group consisting of: ceramics, glasses, and quartz.

19. The fixture of claim 17 wherein said metallic ring comprises an annular prism having a selected outer radius, a selected inner radius, and a selected height.

20. The fixture of claim 17 wherein said metallic ring further includes a dielectric window, said window being at least as large as the inner radius of said ring.

21. The fixture of claim 20 wherein said metallic ring has a generally L-shaped cross section, said dielectric window is mounted hermetically to said ring, and said fixture further comprises a second ring also containing a dielectric window, said first and second rings configured to sealably engage one another thereby forming a cavity with said wafer contained therein.

22. The fixture of claim 17 further comprising a lossy dielectric component configured to apply a selected amount of hybrid heating to said wafer in addition to said applied microwave power.