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H01L2224/16225

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/16225the item being non-metallic

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Circuit test structure and method of using
- Patent number 12,253,558
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Fang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package type semiconductor package
- Patent number 12,255,197
- Issue date Mar 18, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and data transferring method for semiconductor...
- Patent number 12,255,149
- Issue date Mar 18, 2025
- PREFERRED NETWORKS, INC.
- Nobuyoshi Tanaka
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package and method manufacturing the same
- Patent number 12,249,550
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Cheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and display unit
- Patent number 12,249,597
- Issue date Mar 11, 2025
- Osram Opto Semiconductors GmbH
- Sebastian Wittmann
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Three dimensional circuit implementing machine trained network
- Patent number 12,248,869
- Issue date Mar 11, 2025
- Adeia Semiconductor Inc.
- Steven L. Teig
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Metallization structure
- Patent number 12,249,568
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory system having combined high density, low bandwidth and low d...
- Patent number 12,243,575
- Issue date Mar 4, 2025
- Apple Inc.
- Sukalpa Biswas
- G11 - INFORMATION STORAGE
Information Patent Grant
Alternative surfaces for conductive pad layers of silicon bridges f...
- Patent number 12,243,812
- Issue date Mar 4, 2025
- Intel Corporation
- Dae-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep trench capacitors embedded in package substrate
- Patent number 12,238,940
- Issue date Feb 25, 2025
- Google LLC
- Nam Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip bump interface compatible with different orientations and type...
- Patent number 12,237,287
- Issue date Feb 25, 2025
- Xilinx, Inc.
- Ygal Arbel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board with bridge chiplets
- Patent number 12,238,872
- Issue date Feb 25, 2025
- Advanced Micro Devices, Inc.
- Robert N. McLellan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,237,239
- Issue date Feb 25, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Jin Young Khim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chiplet device
- Patent number 12,230,578
- Issue date Feb 18, 2025
- Global Unichip Corporation
- Sheng-Fan Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with stacked printed circuit boards
- Patent number 12,230,622
- Issue date Feb 18, 2025
- Mediatek Inc.
- Ya-Lun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-on-film package and display apparatus including the same
- Patent number 12,230,576
- Issue date Feb 18, 2025
- Samsung Electronics Co., Ltd.
- Jaemin Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional integrated circuit structures and methods of form...
- Patent number 12,230,549
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Min Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to enable 30 microns pitch EMIB or below
- Patent number 12,230,563
- Issue date Feb 18, 2025
- Intel Corporation
- Hongxia Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic core inductors in interposer
- Patent number 12,224,252
- Issue date Feb 11, 2025
- Intel Corporation
- Krishna Bharath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package including lead frame having multiple conductive...
- Patent number 12,224,255
- Issue date Feb 11, 2025
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device assembly in computer system
- Patent number 12,222,880
- Issue date Feb 11, 2025
- RAMBUS INC.
- Scott C. Best
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 12,224,183
- Issue date Feb 11, 2025
- Chipbond Technology Corporation
- Shrane-Ning Jenq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan out structure for light-emitting diode (LED) device and lightin...
- Patent number 12,224,182
- Issue date Feb 11, 2025
- Lumileds, LLC
- Tze Yang Hin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Red flip chip light emitting diode, package, and method of making t...
- Patent number 12,218,110
- Issue date Feb 4, 2025
- Bridgelux, Inc.
- Vladimir A. Odnoblyudov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package with high density interconnects
- Patent number 12,218,069
- Issue date Feb 4, 2025
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die connection system and method
- Patent number 12,218,093
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure having molding layer
- Patent number 12,218,095
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier structures between external electrical connectors
- Patent number 12,218,035
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Chun Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods for forming the same
- Patent number 12,211,799
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Han Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 12,211,821
- Issue date Jan 28, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250087571
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Yueh Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MECHANICAL MITIGATION OF NEUTRON SEE
- Publication number 20250087595
- Publication date Mar 13, 2025
- Rockwell Collins, Inc.
- Eric N. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND METHODS RELATED TO METALLIZATION OF CERAMIC SUBSTRATES...
- Publication number 20250089154
- Publication date Mar 13, 2025
- Skyworks Solutions, Inc.
- Shaul BRANCHEVSKY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS FOR MANUFACTURING THE SAME
- Publication number 20250087634
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- CHOONGBIN YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Advanced Substrates for Large, High Performance Power Packages
- Publication number 20250087566
- Publication date Mar 13, 2025
- Google LLC
- Ilyas Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY BANDWIDTH AGGREGATION USING SIMULTANEOUS ACCESS OF STACKED S...
- Publication number 20250087252
- Publication date Mar 13, 2025
- Rambus Inc.
- Yohan Frans
- G11 - INFORMATION STORAGE
Information Patent Application
Techniques For Providing Shielding Between Inductors Using Guard Rings
- Publication number 20250087577
- Publication date Mar 13, 2025
- Altera Corporation
- Krishna Bharath Kolluru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VOLTAGE REGULATOR IN SEMICONDUCTOR PACKAGES AND METHODS OF FORMING...
- Publication number 20250087632
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chao Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR SHIELDING ELECTROMAGNETIC WAVE OF SEMICONDUCTOR PACKAGE
- Publication number 20250087597
- Publication date Mar 13, 2025
- JOINSET CO., LTD.
- Sun-Ki Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH ENHANCED THERMAL DISSIPATION AND METHOD F...
- Publication number 20250087553
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yang-Che CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING PACKAGING SUBSTRATE AND PACKAGING SUBSTRATE...
- Publication number 20250079324
- Publication date Mar 6, 2025
- ABSOLICS INC.
- Tae Kyoung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND PACKAGING METHOD
- Publication number 20250079391
- Publication date Mar 6, 2025
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250079416
- Publication date Mar 6, 2025
- PICO SEMICONDUCTOR INC.
- Yong Kuk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SECURITY CHIP FOR ENSURING THE PHYSICAL INTEGRITY OF AN INTEGRATED...
- Publication number 20250079344
- Publication date Mar 6, 2025
- NVIDIA Corporation
- Elad Mentovich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package
- Publication number 20250079425
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Eunsil Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250079424
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING THE SAME
- Publication number 20250079426
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Han-Tang Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250079338
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Sunggu KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250079243
- Publication date Mar 6, 2025
- ABSOLICS INC.
- Sungjin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING PACKAGING SUBSTRATE AND PACKAGING SUBSTRATE...
- Publication number 20250079244
- Publication date Mar 6, 2025
- ABSOLICS INC.
- Sungjin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND SEMICONDUCTOR STRUCTURE
- Publication number 20250079375
- Publication date Mar 6, 2025
- CXMT Corporation
- Hengrong SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING INTERCONNECT (HBI) ARCHITECTURES AND METHODS FOR SCA...
- Publication number 20250079392
- Publication date Mar 6, 2025
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250079403
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Jing Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming AIP Structure to Reduce...
- Publication number 20250079350
- Publication date Mar 6, 2025
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A SEMICONDUCTOR CHIP AND A CONDUCTI...
- Publication number 20250079377
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Junghoo Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND HEAT DISSIPATION STRUCTURE THEREOF
- Publication number 20250079255
- Publication date Mar 6, 2025
- Siliconware Precision Industries Co., Ltd.
- Wei-Jhen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STIFFENER WITH INTEGRATED CONNECTORS
- Publication number 20250079276
- Publication date Mar 6, 2025
- ADVANCED MICRO DEVICES, INC.
- Manish DUBEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE HAVING A SUBSTRATE WITH A STEPPED CONFIGU...
- Publication number 20250079277
- Publication date Mar 6, 2025
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC INDUCTORS FOR SEMICONDUCTOR PACKAGING
- Publication number 20250079300
- Publication date Mar 6, 2025
- Intel Corporation
- Aleksandar ALEKSOV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate Coupled Grating Couplers in Photonic Integrated Circuits
- Publication number 20250067932
- Publication date Feb 27, 2025
- Google LLC
- Liming Wang
- H01 - BASIC ELECTRIC ELEMENTS

the item being non-metallic

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Circuit test structure and method of using

Package-on-package type semiconductor package

Semiconductor device and data transferring method for semiconductor...

Semiconductor package and method manufacturing the same

Display device and display unit

Three dimensional circuit implementing machine trained network

Metallization structure

Memory system having combined high density, low bandwidth and low d...

Alternative surfaces for conductive pad layers of silicon bridges f...

Deep trench capacitors embedded in package substrate

Chip bump interface compatible with different orientations and type...

Circuit board with bridge chiplets

Semiconductor device and manufacturing method thereof

Semiconductor chiplet device

Electronic device with stacked printed circuit boards

Chip-on-film package and display apparatus including the same

Three-dimensional integrated circuit structures and methods of form...

Method to enable 30 microns pitch EMIB or below

Magnetic core inductors in interposer

Electronic package including lead frame having multiple conductive...

Stacked semiconductor device assembly in computer system

Method of manufacturing semiconductor device

Fan out structure for light-emitting diode (LED) device and lightin...

Red flip chip light emitting diode, package, and method of making t...

Multi-chip package with high density interconnects

Semiconductor die connection system and method

Chip package structure having molding layer

Barrier structures between external electrical connectors

Semiconductor packages and methods for forming the same

Package-on-package assembly with wire bond vias

Patents Applicationslast 30 patents

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

MECHANICAL MITIGATION OF NEUTRON SEE

DEVICES AND METHODS RELATED TO METALLIZATION OF CERAMIC SUBSTRATES...

SEMICONDUCTOR PACKAGES AND METHODS FOR MANUFACTURING THE SAME

Advanced Substrates for Large, High Performance Power Packages

MEMORY BANDWIDTH AGGREGATION USING SIMULTANEOUS ACCESS OF STACKED S...

Techniques For Providing Shielding Between Inductors Using Guard Rings

VOLTAGE REGULATOR IN SEMICONDUCTOR PACKAGES AND METHODS OF FORMING...

APPARATUS FOR SHIELDING ELECTROMAGNETIC WAVE OF SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE WITH ENHANCED THERMAL DISSIPATION AND METHOD F...

METHOD OF MANUFACTURING PACKAGING SUBSTRATE AND PACKAGING SUBSTRATE...

PACKAGING STRUCTURE AND PACKAGING METHOD

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SECURITY CHIP FOR ENSURING THE PHYSICAL INTEGRITY OF AN INTEGRATED...

Semiconductor Package

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING THE SAME

SEMICONDUCTOR PACKAGE

PACKAGING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

METHOD OF MANUFACTURING PACKAGING SUBSTRATE AND PACKAGING SUBSTRATE...

PACKAGE STRUCTURE AND SEMICONDUCTOR STRUCTURE

HYBRID BONDING INTERCONNECT (HBI) ARCHITECTURES AND METHODS FOR SCA...

SEMICONDUCTOR PACKAGE

Semiconductor Device and Method of Forming AIP Structure to Reduce...

SEMICONDUCTOR PACKAGE INCLUDING A SEMICONDUCTOR CHIP AND A CONDUCTI...

ELECTRONIC PACKAGE AND HEAT DISSIPATION STRUCTURE THEREOF

STIFFENER WITH INTEGRATED CONNECTORS

INTEGRATED CIRCUIT DEVICE HAVING A SUBSTRATE WITH A STEPPED CONFIGU...

MAGNETIC INDUCTORS FOR SEMICONDUCTOR PACKAGING

Substrate Coupled Grating Couplers in Photonic Integrated Circuits