Claims
- 1. A semiconductor processing apparatus comprised of:a work holder, disposed vertically, for holding a work, and a treating surface, disposed vertically, for treating said work, wherein a diameter of said treating surface (D) is in a range of d<D<2d, wherein (d) is a diameter of said work.
- 2. An apparatus according to claim 1, further including a drive structure to rotate said work in a same direction as said treating surface, and a rotational frequency (ω) of said work and a rotational frequency (ω) of said treating surface is determined by the distance (R) between a rotational center of said work and that of the treating surface of when the relative velocity between said treating surface and said work is predetermined as V, in a relationship of ω=V/R.
- 3. An apparatus according to claim 1, further including a polishing liquid supplier to supply polishing liquid from a supply disposed above said treating surface.
- 4. An apparatus according to claim 3, further including a polishing liquid supplier to supply polishing liquid from the grooves formed on the treating surface.
- 5. An apparatus according to claim 1, wherein said treating is polishing or grinding.
- 6. A semiconductor processing apparatus comprised of:a work holder, disposed vertically, for holding two works, one on each side of a work holder, and two treating surfaces, disposed vertically, for treating said two works, each of said treating surfaces being respectively faced to a surface of one of said two works, wherein a diameter of said treating surface (D) is in a range of d<D<2d, wherein (d) is a diameter of said work.
- 7. An apparatus according to claim 6, wherein further including a drive structure to rotate said work in a same direction as said treating surface and a rotational frequency (ω) of said work and a rotational frequency (ω) of said treating surface is determined by the distance (R) between a rotational center of said work and that of the polishing surface when relative velocity between said treating surface and said work is predetermined as V, in a relationship of ω=V/R.
- 8. An apparatus according to claim 6, further comprising a polishing liquid supplier to supply a polishing liquid from a supply unit disposed above said treating surface.
- 9. An apparatus according to claim 8, further comprising a polishing liquid supplier to supply a polishing liquid from grooves formed on the treating surface.
- 10. An apparatus according to claim 6, wherein said treating is polishing or grinding.
Parent Case Info
This application is a Divisional application of Ser. No. 09/254,431, filed Mar. 9, 1999, now U.S. Pat. No. 6,221,773 which is an application filed under 35 USC 371 of International (PCT) application Serial No. PCT/JP96/02634, filed Sep. 13, 1996.
US Referenced Citations (9)
Foreign Referenced Citations (4)
Number |
Date |
Country |
5481591 |
Jun 1979 |
JP |
56134170 |
Oct 1981 |
JP |
6025649 |
Feb 1985 |
JP |
469161 |
Mar 1992 |
JP |