The present invention will be better understood from the following detailed description of the preferred embodiment according to the present invention, taken in conjunction with the accompanying drawings, in which
The following description of the preferred embodiment is provided to understand the features and the structures of the present invention.
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The plasma chamber 11 is connected to the input of a mass flow controller 15; and, the substrate 16 to be treated is placed on the dielectric layer 114 in the discharge gap 115. Plasma working gas 151 is filled into the plasma chamber 11 by the mass flow controller 15. On operating the present invention, a surface discharge is formed on the surface of dielectric layer 114 of the first electrode 111. Then charged particles on a surface of the dielectric layer 114 are attracted by the second electrode 112 to produce plasmas in the gap between the 2nd electrode and the common ground electrode. Thus, a novel apparatus of triple-electrode dielectric barrier discharge at an atmospheric pressure is obtained.
When using the present invention, the first power supply 12 and the second power supply 13 are each connected to first electrode 111 and second electrode 112; when the first electrode 111 is applied with a power from the first power supply 12, surface discharge plasma is formed on the surface of the dielectric layer 114. After a delay time 183, the second electrode 112 is applied with a voltage pulse from the second power supply 13 and the charged particles generated in the surface discharge plasma filled in the discharge gap 115 are to generate glow discharge plasma. Then, the plasma monitor 17 precisely figures out proper delay time 183 to enhance the plasma density. Thus, the discharge gap 115 can be widened to process thick materials.
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To sum up, the present invention is an apparatus of triple-electrode dielectric barrier discharge at an atmospheric pressure where a wide discharge gap can be used at an atmospheric pressure and its plasma density can be greatly enhanced for processing thick materials and speeding up the processing.
The preferred embodiment herein disclosed is not intended to unnecessarily limit the scope of the invention. Therefore, simple modifications or variations belonging to the equivalent of the scope of the claims and the instructions disclosed herein for a patent are all within the scope of the present invention.