Claims
- 1. A method for fabricating an integrated circuit, comprising the steps of:
providing a semiconductor wafer with a resist pattern formed thereon; placing said semiconductor wafer in a process chamber; and spraying an ozonated deionized water mist to a surface of said semiconductor wafer to remove said resist pattern.
- 2. The method of claim 1, wherein said spraying step is performed at an elevated temperature in the range of 55-65° C.
- 3. The method of claim 1, wherein said ozonated deionized water mist is formed by combining deionized water with ozone in an atomizer.
- 4. The method of claim 1, further comprising the step of rotating said semiconductor wafer during said spraying step.
- 5. The method of claim 4, wherein said step of rotating said semiconductor wafer comprises alternately rotating said semiconductor wafer in a clockwise direction and a counterclockwise direction.
- 6. The method of claim 1 wherein said step of placing said semiconductor wafer is a process chamber comprises the step of placing said semiconductor wafer in a carrier with a plurality of additional semiconductor wafers.
- 7. An apparatus for removing resist and resist residue from a wafer surface, comprising:
a process chamber; a carrier for holding a plurality of wafers in said process chamber; an atomizer for mixing deionized water and ozone gas to form an ozonated deionized water mist, said atomizer located within said process chamber.
- 8. The apparatus of claim 7, further comprising a motor for rotating said carrier.
- 9. The apparatus of claim 8, wherein said motor is capable of rotating said carrier in both a clockwise direction and a counterclockwise direction.
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] The following co-pending applications are related and are hereby incorporated by reference:
1Serial No.Filing dateInventors(TI-27169)Jung et al.(TI-27170)Jung et al.(TI-29572)Murphy et al
Provisional Applications (1)
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Number |
Date |
Country |
|
60165112 |
Nov 1999 |
US |
Divisions (1)
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Number |
Date |
Country |
Parent |
09666576 |
Sep 2000 |
US |
Child |
10055444 |
Jan 2002 |
US |