Claims
- 1. A method for fabricating an integrated circuit, comprising the steps of:providing a semiconductor wafer with a resist pattern formed thereon; placing said semiconductor wafer on a wafer chuck in a scrubber; applying an ozonated deionized water to a surface of said wafer to remove said resist pattern, while said wafer is on said wafer chuck in the scrubber.
- 2. The method of claim 1, wherein said ozonated deionized water is applied at an elevated temperature in a range of 55-65° C.
- 3. The method of claim 1, wherein said ozonated deionized water is formed by combining deionized water with ozone in a closed canister.
- 4. The method of claim 3, further comprising the steps of:adding the deionized water to said closed canister; circulating said deionized water through a pump and a premixer; and adding the ozone to said deionized water at said premixer to form said ozonated deionized water.
- 5. The method of claim 1, wherein said wafer chuck is heated.
- 6. The method of claim 1, wherein said ozonated deionized water is applied using a pressure jet of said scrubber.
- 7. The method of claim 1, wherein said ozonated deionized water is applied using a megasonic nozzle of said scrubber.
- 8. The method of claim 1, wherein said ozonated deionized water is formed by mixing an ozone gas and a deionized water at a spray nozzle of a scrubber.
- 9. The method of claim 1, wherein said ozonated deionized water is applied at an elevated temperature in a range of 55-65° C., said wafer chuck is heated and a process chamber surrounding said wafer chuck is heated.
- 10. The method of claim 1, wherein said ozonated deionized water is heated at a nozzle of said scrubber to a temperature in a range of 55-65° C. and said wafer chuck is heated.
CROSS-REFERENCE TO RELATED APPLICATIONS
This application claims priority under 35 USC §119(e)(1) of provisional application No. 60/165,148 filed Nov. 12, 1999.
The following co-pending applications are related and are hereby incorporated by reference:
US Referenced Citations (3)
Number |
Name |
Date |
Kind |
5464480 |
Matthews |
Nov 1995 |
A |
6273108 |
Bergman et al. |
Aug 2001 |
B1 |
6345630 |
Fishkin et al. |
Feb 2002 |
B2 |
Foreign Referenced Citations (1)
Number |
Date |
Country |
0548 596 |
Jun 1993 |
EP |
Provisional Applications (1)
|
Number |
Date |
Country |
|
60/165148 |
Nov 1999 |
US |